Discover how cutting-edge transient structural analysis and experimental testing can solve even the toughest challenges in this upcoming presentation. DATE / TIME: May 8, 2025 10 AM EDT / 4 PM CEST / 7:30 PM IST Venue: Virtual Overview This webinar will showcase how transient structural analysis and experimental testing optimized a mass damper to …
VOICE is a developer conference, created by test engineers for test engineers. Each year, the VOICE Developer Conference unites semiconductor test professionals representing the world's leading integrated device manufacturers (IDMs), foundries, fabless semiconductor companies and outsourced semiconductor assembly and test (OSAT) providers to exchange information about the latest technology advancements, express new ideas, share best …
The RISC-V Summit Europe is the premier event that connects the European movers and shakers – from industry, government, research, academia and ecosystem support – that are building the future of innovation on RISC-V. RISC-V, the open standard instruction set architecture (ISA), is enabling a range of new applications and research that will define the future of computing …
Failure and Yield Analysis is an increasingly difficult and complex process. Today, engineers are required to locate defects on complex integrated circuits. In many ways, this is akin to locating a needle in a haystack, where the needles get smaller and the haystack gets bigger every year. Engineers are required to understand a variety of …
Join us in Munich where peer-delivered technical sessions will be shared across a breadth of topics so you can explore new concepts or dive deep in your core area of expertise with fellow like-minded professionals. Munich, Germany | May 13, 2025 Registration opens Feb. 10, 2025. About User2User The User2User conference is your opportunity to …
Semiconductor Industry Market Forecast - Slide Deck & Video Link Now Available Presented Via Zoom, 14 Jan 2025 3-4pm UK (BST, GMT+1) Mark your diary now - IFS Industry Update Webinar 13 May 2025 The insights we have presented at our previous IFS events have consistently proved right. Has the chip market finally started its …
Industry Update Webinar - 13 May 2025 Presented Via Zoom, 3pm-4pm UK BST (UMC/GMT+1) Registration Open Now! Has the chip market finally started its broader industry recovery? How much longer will the AI-infrastructure boom last? What will be the likely impact of Donald Trump’s global tariff vendetta? What fate now awaits the industry in 2025? …
Join us at Europe's largest quantum event We look forward to seeing you in 2025 where we will welcome 1,000 attendees from 40+ countries! At Commercialising Quantum Global, our case study-led agenda sets the stage for vital discussions on how organisations should prepare for and implement quantum technology. We provide an accessible and in-depth debate …
The major annual event of the Israeli semiconductor industry ChipEx2025, the largest annual event of the Israeli semiconductor industry, will be held on May 13-14, 2025 in Tel Aviv, Israel. ChipEx2025 showcases companies including manufacturers, developers and suppliers of advanced hardware technologies & services. It also includes a technical seminar where the world's leading experts address the industry's most relevant …
This webinar showcases digital engineering tools for analyzing antenna design alternatives in UAV-to-ground communication systems. DATE: May 14, 2025 Venue: Virtual Overview Ansys is a digital engineering technology partner. This webinar is part of a series that showcases how these technologies empower businesses to design, simulate, and validate the most complex products faster and more …
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Learn to teach antenna design effectively with PyAEDT. This webinar covers scripting, HFSS, Maxwell, Icepak examples, and advanced simulations for professors. TIME: 05/14/2025 11 AM EDT Venue: Virtual Overview Today’s engineering practice requires skills in scripting, finite element analysis of designs, and a combination of both. By teaching this combination, you can engage your antenna …
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Get the latest on: TSMC's industry-leading HPC, Smartphone, IoT, and Automotive platform solutions to advance the AI future TSMC’s advanced logic technology progress on 5nm, 4nm, 3nm, 2nm, A16 processes and beyond TSMC 3DFabric® advanced silicon stacking and packaging technology advancement on TSMC-SoIC®, InFO, CoWoS®, and TSMC-SoW™ TSMC’s specialty technology breakthroughs on ultra-low power, RF, embedded …
