SHAPING THE FUTURE WITH TECHNOLOGY At the world’s leading industrial trade fair, companies from the mechanical engineering, electrical engineering and digital industries as well as the energy sector will come together to present solutions for a high-performance, but also sustainable industry. More than 4,000 companies will be acting as an interconnected industrial ecosystem and demonstrating …
This bootcamp guides you through the design of superconducting qubits and quantum amplifiers with product demonstrations to illustrate the concepts you can apply in your design flow today. By the end of this bootcamp, you will have a pathway toward realizing robust and scalable superconducting quantum chips, accelerating progress in quantum computing and quantum information …
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INAUGURAL EVENT FOCUSED ON SMART MANUFACTURING & SMART MOBILITY DRIVING SEMICONDUCTOR BUSINESS IN THE MIDWEST Join us for a groundbreaking Midwest conference and tradeshow on April 1-2, 2025, focused on Smart Manufacturing and Smart Mobility with an emphasis on the semiconductor industry! Automotive electronics and smart manufacturing are two of the key end markets on …
About Us Now in its 18th year, the IEW continues to provide a relaxed, invigorating atmosphere to present new work and engage in discussions about the latest issues confronting the ESD and EOS communities. In 2025 IEW-US will again co-locate with the International Reliability Physics Symposium (IRPS). In addition to everything IEW-US provides, IEW-US registrants …
An infrastructure to enable debug and trace for your RISC-V systems is essential to identifying root-causing bugs. In this presentation, we will give an overview of Tessent UltraSight-V, an end-to-end RISC-V debug and trace solution consisting of embedded IPs and software that integrate with industry-standard tools. We will explain how the integration of UltraSight-V’s on-chip …
Empowering Engineers to Electric Machine Design This in-person technical conference will focus on the latest technological advancements in electric machine development. A range of speakers from the industry will discuss their challenges and approaches in this area. In the presentations and workshops, you will learn about technology updates and hear from prominent automotive companies about …
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The ever-evolving landscape of semiconductor design demands robust ESD protection strategies that balance performance, reliability, and compliance. At the 2025 International Electrostatic Discharge Workshop (US-IEW), industry leaders will come together to tackle two of the most pressing topics in ESD: Foundry ESD Checks and IC Requirements and Standardized ESD Compact Models. We’re excited to announce that Stephen Fairbanks, CEO and …
About Bio-IT World Conference & Expo Bio-IT World Conference & Expo is the premier global event showcasing technologies and analytic approaches that solve problems, accelerate science, and drive the future of precision medicine. By uniting a community of experts in life sciences, pharmaceuticals, clinical research, healthcare, informatics, and technology, the event pushes the boundaries of …
Learn about the revolutionary AI-driven electromagnetic-aware methodology of Ansys that automates the optimization of the floor plan of analog and RF physical layouts. DATE / TIME: April 2, 2025 9 AM EDT / 3 PM CEST Overview Analog/RF IC design has been traditionally considered an art – sometimes even a “black art” – because, contrary …
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Learn about the revolutionary AI-driven electromagnetic-aware methodology of Ansys that automates the optimization of the floor plan of analog and RF physical layouts. DATE / TIME: April 2, 2025 9 AM EDT / 3 PM CEST Venue: Virtual Overview Analog/RF IC design has been traditionally considered an art – sometimes even a “black art” – …
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About this event This webinar will guide you through a modernized design process, covering everything to ensure a more comprehensive and accurate design. This includes: Modeling transistors and creating schematics to perform transient simulations. Performing electromagnetic simulations to account for parasitic effects. Introducing post-layout simulation to help reduce the need for multiple design spins and …
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Semiconductor packaging is a critical step in the development of modern electronic devices, influencing their performance, reliability, and thermal management. The complexity of packaging technologies has grown significantly with the demand for miniaturization, higher power densities, and improved mechanical and thermal robustness. Addressing these challenges requires a comprehensive understanding of the multiphysics interactions within semiconductor …
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