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Presenters: Martin Beeby, Head of Advanced Avionics Systems and Managing Director of ConsuNova EU and Janusz Kitel, DO-254 Program Manager at Aldec Inc. Abstract: System on Chip (SoC) devices are transforming the landscape of advanced aviation systems, offering unparalleled integration of multiple functionalities within a single chip. These compact powerhouses bring numerous advantages, from reduced power …
The Moscone Center
The Moscone Center, San Jose, CA, United States
Browse the 2025 program; discover all the ways you'll connect with colleagues Join the world’s largest photonics technologies event. Learn the most cutting-edge research in biomedical optics, biophotonics, industrial lasers, optoelectronics, microfabrication, displays, quantum technologies, and more. Review the lineup of outstanding plenary speakers from around the globe. Select advanced training from more than 50 …
Santa Clara Convention Center
5001 Great America Pkwy, Santa Clara, CA, United States
The Must Attend Event for Chip, Board, and Systems Design Engineers DesignCon is the premier high-speed communications and system design conference and exposition, offering industry-critical engineering education in the heart …
Edinburgh Futures Institute, The University of Edinburgh
1 Lauriston Pl, Edinburgh
Theme: Mixed Signal Verification Analog mixed signal chips continue to grow in both demand and complexity, and a consistent efficient verification approach remains a key topic for concern. This DVClub will …
San Francisco Museum of Modern Art
151 3rd Street, San Francisco, CA, United States
Breakthroughs in photonics: network and innovate with leading experts and industrial players Why you should attend CEA-Leti leverages advances in semiconductors to enable far-reaching changes in photonic technologies. Join us …
Semiconductor and integrated circuit development continues to proceed at an incredible pace. The industry as a whole has gotten to this point of incredible complexity through the process of countless …
Package reliability and qualification continue to evolve with the electronics industry. New electronics applications require new approaches to reliability and qualification. In the past, reliability meant discovering, characterizing and modeling failure mechanisms, and determining their impact on the reliability of the circuit. Today, reliability can also involve tradeoffs between performance and reliability; assessing the impact …
Integrated Circuit packaging has always been integral to IC performance and functionality. An IC package serves many purposes: 1) pitch conversion between the fine features of the IC die and …
San Francisco Marriott Marquis
780 Mission Street, San Francisco, CA, United States
About ISSCC The International Solid-State Circuits Conference is the foremost global forum for presentation of advances in solid-state circuits and systems-on-a-chip. The Conference offers a unique opportunity for engineers working …
Hyatt Regency San Francisco Airport
1333 Bayshore Highway, Burlingame, CA, United States
Thank you to those who attended and participated in the 2024 SMTA Wafer-Level Packaging Symposium! Their presence contributed to the success of this event, and we are truly thankful for …
Renishaw plc
New Mills, Wotton-under-Edge, Gloucestershire, United Kingdom
FPGA Front Runner - Using AI in development and product for FPGA How are they used? What input language is used and how does it find it’s way into the …
Semiconductor and integrated circuit developments continue to proceed at an incredible pace. For example, today's microprocessor chips have one thousand times the processing power of those a decade ago. These challenges have been accomplished because of the integrated circuit industry's ability to track something known as Moore's Law. Moore's Law states that an integrated circuit's …
