Rust Belt Innovation: Ansys AI and Advanced Engineering

850 Cranberry Woods Drive 850 Cranberry Woods Drive, Cranberry Township, PA, United States

This Ansys-hosted event focuses on the transformative impact of artificial intelligence and advanced engineering methods on the region's industries. Attendees will learn about our cutting-edge AI technologies, innovative engineering practices, …

DVCon Europe 2024

Holiday Inn Munich City Centre Hochstrasse 3, Munich, Germany

The Design and Verification Conference in Europe (DVCon Europe) is the leading European event covering the application of languages, tools and intellectual property for the design and verification of electronic …

2024 OCP Global Summit

San Jose Convention Center 150 W San Carlos St, San Jose, CA, United States

From Ideas to Impact The OCP Summit is the premier event uniting the most forward-thinking minds in open IT Ecosystem development. The Summit presents a unique platform for our Community from around the globe to share their insights, foster partnerships and showcase cutting-edge advancements in open hardware and software. The 2024 OCP Global Summit theme is "From …

Japan Mobility Show 2024

Makuhari Messe 2 Chome-1 Nakase, Chiba, Mihama Ward, Japan

Last year the 70 year-old Tokyo Motor Show was reborn as the Japan Mobility Show, conceived to promote collaboration across industries through new partnerships working to create the mobility of the future. To further this vision, this year’s show—held in collaboration and concurrently with CEATEC 2024, Japan’s largest digital exhibition of its IT and electronic …

Webinar: Avoid Costly Silicon Respins: Maximize Reliability and Yield with Advanced Noise and Binning Modeling

Online

Join Keysight for a comprehensive session focused on enhancing device reliability and preventing costly silicon respins through innovative noise and binning modeling technologies. Enhancing Reliability with Accurate Noise Measurement and Modeling Accurately accounting for noise is essential for ensuring reliability of complex semiconductor devices. Explore how noise data across the wafer serves as an early …

Webinar: Spec-Driven Modeling Automation Platform SDEP™

Online

SDEP™ provides robust APIs for creating automated reusable modeling flows significantly reducing turnaround time while preserving essential device modeling knowledge. The platform integrates Primarius‘ latest technologies for data analysis, parameter extraction, and model quality checking. With its flexible GUI and flow control capabilities, SDEP™ enables modeling engineers to efficiently build and customize workflows, automate routine …

Packaging Chips with CHIPS: West Coast Summit

Skysong at ASU’s Scottsdale Innovation Center Skysong 1 1475 North Scottsdale Road, Scottsdale, AZ, United States

This Summit will look at the CHIPS Act from the specific perspective of packaging, with a special focus on the west coast. The Packaging Chips with CHIPS: West Coast Summit is a one-day semi summit that will bring together leading thinkers from chip packaging and design companies, along with government policy makers, to discuss the chip packaging industry in …

Ansys Innovation Conference Madrid 2024

BBVA Tower Paseo de la Castellana 81, Madrid, Spain

The 𝗜𝗻𝗻𝗼𝘃𝗮𝘁𝗶𝗼𝗻 𝗖𝗼𝗻𝗳𝗲𝗿𝗲𝗻𝗰𝗲 at 𝗠𝗮𝗱𝗿𝗶𝗱 is an exclusive event where every engineer, researcher or scientist who uses or is interested in numerical simulation will find a unique experience focused on enriching their interactions with this technology. This event offers an enabling environment for the exchange of ideas, the creation of professional networks and the exploration …

Hardwear.io Security Trainings and Conference Netherlands 2024

Amsterdam Marriott Hotel Stadhouderskade 12, Amsterdam, Netherlands

Learn from leading hardware security researchers & professionals and discuss the latest & most innovative research on attacking and defending hardware. Connect with industry peers. Join us for a bigger, bolder, and better hardwear.io. ARE YOU READY FOR HARDWEAR.IO Netherlands 2024? In the past couple of months our goal was to knuckle down and build …

RISC-V Summit 2024

Santa Clara Convention Center 5001 Great America Pkwy, Santa Clara, CA, United States

RISC-V is defining the future of open computing by providing unprecedented freedom to innovate. More than 13 billion RISC-V cores have shipped, powering new innovations in AI/ML, wireless, automotive. data center, space, IoT, embedded and more. Each day, thousands of engineers around the world collaborate and contribute to advance RISC-V. The RISC-V community shares the …

CadenceCONNECT: Jasper User Group San Jose

Cadence Headquarters, San Jose, CA 2655 Seely Ave, San Jose, CA, United States

About It’s time for our annual CadenceCONNECT: Jasper User Group Conference - San Jose. This interactive, in-depth technical conference connects designers, verification engineers, and engineering managers from around the world to share the latest design and verification practices based on Cadence’s Jasper formal verification technologies and methodologies. This is an in-person conference. The Jasper User …

TechBlick Europe 2024

Estrel Berlin Hotel and Convention Center (ECC) Sonnenallee 225, Berlin, Germany

The Future of Electronics RESHAPED Let's RESHAPE the Future of Electronics together, making it Additive, Sustainable, Flexible, Hybrid,  Wearable, Structural, and 3D. Join the flagship TechBlick event and the global …

Wireless IoT Tomorrow 2024

RheinMain CongressCenter Friedrich-Ebert-Allee 1, Wiesbaden, Germany

Drive Growth and Boost Efficiency Leverage WIoT Technologies to Cut Costs and Enhance Your Business Performance The event caters to businesses of all sizes, from small startups to medium enterprises and large corporations, offering a rich program, dynamic exhibition, and much more for targeted networking, strategic growth opportunities, strong partners, products, and solutions that will …

The International Workshop on Hardware and Architectural Support for Security and Privacy (HASP) 2024

AT&T Hotel and Conference Center 1900 University Avenue, Austin, TX, United States

Call for Papers Although much attention has been directed to the study of security at the system and application levels, security and privacy research focusing on hardware and architecture aspects …

MICRO 2024 (57th IEEE/ACM International Symposium on Microarchitecture®)

AT&T Hotel and Conference Center 1900 University Avenue, Austin, TX, United States

The IEEE/ACM International Symposium on Microarchitecture® is the premier forum for presenting, discussing, and debating innovative microarchitecture ideas and techniques for advanced computing and communication systems. This symposium brings together researchers in …

APCCAS 2024

CHANG YUNG-FA FOUNDATION International Convention Center (CYFF) No.11, Zhongshan S. Rd., Taipei City, Taiwan

The APCCAS is a major international forum for researchers, scientists, educators, students and engineers to exchange their latest findings in circuits and systems. It covers a wide range of topics …

IEEE International Conference on PHYSICAL ASSURANCE and INSPECTION of ELECTRONICS (PAINE)

Huntsville Marriott at the Space & Rocket Center 5 Tranquility Base, Huntsville, AL, United States

About PAINE Physical inspection of electronics has grown significantly over the past decade and is becoming a major focus for the chip designers, original equipment manufacturers, and system developers. The …

SEMICON Europa 2024

Messe Munchen Munich, Germany

SEMICON Europa 2024 is co-located with electronica and will take place in November 12-15, 2024 in Munich, Germany. This year’s theme Innovation and Collaboration: Powering Sustainable Exponential Growth expresses SEMICON Europa support to the European semiconductor ecosystem, highlighting the important role in driving sustainable exponential growth through innovation and strategic collaborations. Only by fostering collaborative efforts, the …

Advanced Design & Manufacturing Montréal 2024

Palais des congrès de Montréal 1001 Place Jean-Paul-Riopelle, Montréal, Québec, Canada

Montréal's End-to-End Design and Manufacturing Show Returns Advanced Design & Manufacturing Montréal brings together five advanced manufacturing areas — Design & Manufacturing, Automation Technology Expo, PACK EX, EXPOPLAST, and Powder & Bulk Solids. This all-in-one, industry-wide event lets you explore the latest trends and technologies shaping the future in advanced design and manufacturing across automation, …

TSMC Open Innovation Platform® Ecosystem Forum 2024 – China

Hyatt Regency Beijing Wangjing 8 Guangshun South Street, Beijing, China

The TSMC Open Innovation Platform® Ecosystem Forum is a unique event that brings together the semiconductor design community and TSMC customers. The OIP Forum will feature multi-track technical presentation sessions along with an Ecosystem Pavilion. The Forum provides an ideal venue to build relationships with TSMC customers. We have set the dates for our 2024 global …

Advanced Packaging Conference (APC) 2024

Messe Munchen Munich, Germany

Chiplets and Heterogenous Integration: The Next Frontier in Performance and Efficiency Innovation and Collaboration: New types of Neural Networks (Large Language Models), such as ChatGPT and other text generator, as well as Artificial Intelligence (AI) applications of different kind, are pushing the demands for High Performance Computing (HPC) to new levels. Chiplets, Heat Dissipation, Miniaturization, …