SEMICON Japan is the premier event that brings together the semiconductor manufacturing supply chain for the latest insights, trends and innovations as the industry powers digital transformation. SEMICON Japan 2025 will highlight Smart applications powered by semiconductor technology such as automotive and Internet of Things (IoT). REGISTER HERE
December 17, 2025 | 10:00 AM PST Join us to discover how Keysight Design Data Management (SOS) Enterprise Collaboration, as the backbone for modern engineering enterprises, enables teams to build organizational knowledge, secure collaboration, and prepare their data for AI and agentic workflows that drive measurable competitive advantage. The biggest challenges today are managing complexity, ensuring governance, and preparing …
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Essential Debugging Techniques Workshop This workshop is for hardware engineers, system architects, and anyone who wants to learn best practices for debugging challenging issues encountered while developing FPGAs, SoCs, PCBs, and embedded systems using the Vivado Design Suite. The features and capabilities of the Vivado Integrated Logic Analyzer are covered in lectures and demonstrations, along with …
January 5, 2026 - 11:00 AM EST January 6, 2026 – 10:00 AM JST/KST Discover the 5 Critical Mobile Market Trends Reshaping Semiconductors in 2026 Mobile AI, shifting supply chains, and new form factors—what’s next for the mobile semiconductor industry. The mobile semiconductor market faces an inflection point in 2026. While trade and tariff uncertainties …
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The world’s most powerful tech event is your place to experience the innovations transforming how we live. This is where global brands get business done, meet new partners and where the industry's sharpest minds take the stage to unveil their latest releases and boldest breakthroughs. Get a real feel for the latest solutions to the …
Join us at the Ritz-Carlton in Half Moon Bay, CA to get the latest insights on economic trends, market drivers, geopolitics, technology, and what these will mean for the near future to help drive your business forward. The cooperative platform of ISS and its tremendous collective assets will serve to help power your strategies for …
About this event Next-generation AI systems are pushing electrical, optical, and packaging technologies to their limits. Join Keysight experts as they share insights on validating 224G / 448G SerDes, preparing for emerging IEEE 1.6T optical standards, advancing silicon photonics, and strengthening die-to-die interconnects for chiplet-based architectures. This is your chance to learn directly from the engineers shaping the …
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As the quantum threat moves from theory to reality, attacks put all long-lifecycle designs at risk. In this early PQC era, simply implementing the new NIST algorithms isn't enough. Implementations will evolve, and new physical attacks like side-channel analysis present a major threat to the security of these complex new algorithms. The solution requires both …
Discover the 5 Critical Manufacturing Market Trends Reshaping Semiconductors in 2026 AI-driven investments, sustainability, and advanced materials—what’s next for semiconductor manufacturing. The semiconductor manufacturing industry is undergoing a transformative period as AI-driven investments accelerate, sustainability pressures mount, and foundries navigate capacity expansion amid weak consumer demand. In this live TechInsights webinar, our manufacturing experts will …
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About this event Start the new year off right with fresh insights and sharp skills. Join Keysight experts in Calgary for an all-day Advanced Measurements Seminar and cocktail reception. This hands-on technical event features live demonstrations with the latest RF and high-speed digital technologies. Gain practical, lab-ready insights to enhance accuracy, reduce uncertainty, and push your measurement capabilities further in 2026. Lunch and cocktails are on us. …
This workshop is a fast-paced, one-day program led by Prof. Dragica Vasileska and Prof. Stephen M. Goodnick. Spend the morning grounding yourself in semiconductor physics and transport, then transition in the afternoon to instructor-led, hands-on Silvaco TCAD labs (e.g., MOS Capacitors, MOSFETs, SOI Devices, FinFETs). The workshop is offered in a hybrid format. Participants have …
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Share your work, insights, and breakthroughs. The 2026 call for papers is open. SPIE Photonics West is the world’s largest optics and photonics technologies event. Present your research in biomedical optics, biophotonics, industrial lasers, optoelectronics, microfabrication, displays, quantum, and emerging vision technologies. Conferences and Courses: 17–22 January This is the place to be in January …
January 22-23, 2026, hosted by SEMI International, Silicon Valley, CA USA Note: HBS’26 is a hybrid event, with both in-person and virtual participation via WebEx. Download the Call for Presentations! Hybrid Bonding has emerged as the technology of choice in the semiconductor and heterogeneous integration industries for ultra-fine-pitch interconnection. With significant benefits for interconnect density and device …
About this event Stay connected with the latest optical design product innovations across CODE V, LightTools, RSoft, ImSym, and our optical scattering measurement solutions. Get tips and tricks on design best practices from our experts, and network with industry peers and the Keysight Optical Design Engineering team. The user conference is held in parallel with …
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On October 17-18, 2024, Israel launched a deadly attack on Hezbollah in Lebanon and Syria using tampered pager and walkie-talkie devices, nicknamed “Operation Grim Beeper.” The exploding pager attack illustrates the vulnerability of the electronics supply chain to a dedicated nation-state adversary. We will explain how the supply was compromised and focus specifically on the …
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Timing closure is one of the most challenging aspects of ASIC design. While traditionally seen as a backend process, its resolution begins at the architectural level and extends through the implementation stages. This webinar examines the key obstacles designers encounter and demonstrates how our timing closure solutions deliver comprehensive support throughout the entire design process. …
In this webinar, we will explore the growing threat that AI-fueled cyberattacks pose to chip designs and how to add expert-level security verification to your design flow to minimize those risks. We will expose some of the details of the existential risk for electronic systems with real examples. We will then describe technology that easily …
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About ISSCC The International Solid-State Circuits Conference is the foremost global forum for presentation of advances in solid-state circuits and systems-on-a-chip. The Conference offers a unique opportunity for engineers working at the cutting edge of IC design and application to maintain technical currency, and to network with leading experts. What’s New Download the ISSCC 2026 …
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All the Solutions for Developing Chiplets 2025 Keynote Addresses from Industry Leaders: Alphawave Semi, Arm, Cadence Design Systems, Keysight, Open Compute Project, Synopsys, Teradyne 2025’s Main Topics Included: AI/ML Acceleration, Open Chiplet Economy, Advanced Packaging Methods, Die-to-die Interfaces, Working with Foundries signup to be a 2026 SPONSOR / Exhibitor REGISTER HERE
Formatting Advanced Packaging for the Next Generation The evolution of Advanced Package Technology is experiencing substantial changes as system designs directly drive package performance requirements—an unprecedented development in the industry. Historically, architects constructed circuits within packaging constraints to prevent undesirable outcomes. Nevertheless, increasing transistor expenses and the demand for improved power efficiency necessitate advancing package …
Semiconductor and integrated circuit developments continue to proceed at an incredible pace. For example, today's application-specific ICs and microprocessors can contain upwards of 100 million transistors. Traditional testing relies on the stuck-at-fault (SAF) to model defect behavior. Unfortunately, the SAF model is a poor model for defects. Other models and strategies are required to catch …
From materials to metrology: pushing the limits of lithography Share your research, challenges, and breakthroughs at this leading semiconductor conference in San Jose Submit your abstract and connect with leading researchers advancing solutions in optical lithography, EUVL, patterning technologies, metrology, and process integration for semiconductor manufacturing and related applications. Call for papers is now open. …
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Semiconductor and integrated circuit developments continue to proceed at an incredible pace. The industry as a whole has gotten to this point of incredible complexity through the process of countless breakthroughs and developments in wafer fab processing. Today's wafer fab contains some of the most complex and intricate procedures ever developed by mankind. Wafer Fab Processing is …
FLEX 2026 | TECHNOLOGY SUMMIT | FEBRUARY 24-26, 2026 THE WIGWAM ARIZONA RESORT | PHOENIX, AZ A 25th Anniversary Celebration Escape the winter and celebrate 25 years of innovation with us at The Wigwam Arizona Resort in Phoenix, AZ. FLEX—Technology Summit is a vibrant networking event designed to foster community building. Connect with like-minded professionals, share ideas, and forge …
Failure and Yield Analysis is an increasingly difficult and complex process. Today, engineers are required to locate defects on complex integrated circuits. In many ways, this is akin to locating a needle in a haystack, where the needles get smaller and the haystack gets bigger every year. Engineers are required to understand a variety of …
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DVCon is the premier conference on the application of languages, tools, and methodologies for the design and verification of electronic systems and integrated circuits. The focus of the conference is the usage of specialized design and verification languages such as SystemVerilog, Verilog, VHDL, PSS, SystemC and e, as well as general purpose languages such as …
Making way for The IQ Era Much can happen in a year within our ecosystem of innovation and connectivity. As we build on the success of MWC25 and engage with MWC26 to activate a new theme – The IQ Era – the world is already shifting to greater heights of digital awareness. In this new age of intelligence, the way to a better future is through smarter connection: human …
Product reliability and qualification continues to evolve with the electronics industry. New electronics applications require new approaches to reliability and qualification. In the past, reliability meant discovering, characterizing and modeling failure mechanisms, and determining their impact on the reliability of the circuit. Today, reliability can involve tradeoffs between performance and reliability; assessing the impact of …
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Global platform for the embedded community The embedded world Exhibition&Conference provides a global platform and a place to meet for the entire embedded community, including leading experts, key players and industry associations. It offers unprecedented insight into the world of embedded systems, from components and modules to operating systems, hardware and software design, M2M communication, …
Explore the Ever-Expanding Optical Networking and Communications Industry Plenary Session Esteemed industry luminaries from Coherent, NVIDIA and Tesat-Spacecom will headline the event Tuesday, 17 March. These distinguished speakers will explore cutting-edge technologies, and provide invaluable insights into the evolving landscape of optical networking and communications. Learn more. The Exhibition The exhibition features more than 700 industry-leading companies representing the entire …
Electrical Overstress (EOS) and Electrostatic Discharge (ESD) account for most of the field failures observed in the electronics industry. Although EOS and ESD damage can at times look quite similar to each other, the source each and the solution can be quite different. Therefore, it is important to be able to distinguish between the two …
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About IRPS For over 60 years, IRPS has been the premiere conference for engineers and scientists to present new and original work in the area of microelectronics reliability. Drawing participants from the United States, Europe, Asia, and all other parts of the world, IRPS seeks to understand the reliability of semiconductor devices, integrated circuits, and …
SENSORIZATION: ENABLING A NEW INTELLIGENCE The MEMS and Sensors Executive Conference 2024 is designed for senior executives across the MEMS and sensors supply chain and adjacent industries. Industry economic, business updates will be covered from different aspects of the ecosystem, together with forward-looking strategic and technology trends. The opportunities and challenges brought about by key …
Make plans to share your work with other experts in April 2026 Present your research at the only cross-disciplinary event highlighting compelling optics and photonics technologies—from digital optics to quantum technologies to optical imaging, sensing, and metrology. Additional topics include THz photonics, 3D printed optics, photonic glasses, photosensitive materials, and biophotonics. Call for papers is …
Design, Automation and Test in Europe Conference | The European Event for Electronic System Design & Test Call for Papers The DATE conference is the main European event bringing together designers and design automation users, researchers and vendors, as well as specialists in hardware and software design, test, and manufacturing of electronic circuits and systems. …
