Webinar: Automated AFM for Inline Hybrid Bonding Metrology in the Semiconductor Industry

In this webinar, we will illustrate how Automated AFM can be applied in the most current hybrid bonding technology nodes and wafer processing steps, and its suitability for labs and fabs working on new bonding device design. The following topics will be discussed:

• Key Automated AFM features for process control in high volume manufacturing of bonded wafers
• High resolution imaging and analysis for critical bond pad metrology
• Large-area scanning of areas of up to 100s of mm2 for large scan topography in wafer-to-wafer bonding
• Automated bevel edge metrology for hybrid bonding
• Patterned and bare/blanket wafer defect review

Don’t miss the opportunity to speak to our experts in the Q&A session!