Webinar: Accelerating Automotive SoC Design with Chiplets

Join us for an insightful webinar series, where we explore the rapidly evolving automotive landscape. We will focus on the rise of autonomous and electric vehicles, highlighting key trends such as ADAS, software-defined vehicles, and zonal architectures.

Learn how Cadence’s advanced automotive solutions address the increasing compute demands and in-vehicle networking requirements while prioritizing power efficiency and safety. Gain valuable insights into high-performance centralized computing, cloud-native software development, and system design innovations that are reshaping the industry and creating new opportunities.

Equip yourself with the knowledge to thrive in this dynamic environment.  We look forward to traveling this road together!

This webinar will explore how 3D-IC architectures can integrate multiple homogenous and heterogeneous dies/chiplets, such as logic, memory, analog, and RF into a single design. Chiplets have the potential to revolutionize vehicle performance and the functionality of future automotive SoCs using a standardized interconnect structure such as the Universal Chiplet Interconnect Express (UCIe). Cadence offers the most comprehensive integrated 3D-IC design and interconnect IP solution for chiplet-based design. Learn how designers can pack more functionality into smaller form factors while improving productivity and reducing costs.

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