CEO Interview with Jonas Sundqvist of AlixLabs

Jonas Sundqvist received his PhD in inorganic chemistry from Uppsala University, Department for Materials Chemistry at The Ångström Laboratory in 2003 where he developed ALD and CVD processes for metal oxide ALD and CVD processes using metal iodides. Jonas is in charge of the daily business at AlixLabs – as a co-founder, he’s been with the company since day one in 2019.

Tell us about your company?
AlixLabs is the world’s only pure-play Atomic Layer Etch (ALE) equipment company, pioneering a breakthrough technique called APS (ALE Pitch Splitting). Our technology enables precise, atomic-scale feature definition in semiconductor manufacturing, helping chipmakers achieve critical dimensions below 10 nm at dense line pitch. By reducing the number of process steps in advanced patterning, we offer a more cost-effective and sustainable alternative to multi-patterning and extreme ultraviolet (EUV) lithography.

What problems are you solving?
We address the growing challenges in semiconductor manufacturing as the industry continues to scale down feature sizes. Traditional multi-patterning approaches introduce complexity, cost, and yield loss. APS streamlines the patterning process, reducing lithography steps, improving throughput, and lowering costs by up to 40% per multi patterning mask layer. Additionally, our solution minimizes energy and material consumption, supporting a more sustainable semiconductor industry.

What application areas are your strongest?
Our APS technology is particularly valuable for advanced logic (leading-edge node processors and GPUs) and DRAM memory. Our focus is on high-volume leading edge 300 mm semiconductor manufacturing, where reducing cost and improving yield are critical.

What keeps your customers up at night?
Chipmakers are constantly seeking ways to improve yield, reduce costs, and extend Moore’s Law. The increasing complexity of patterning techniques, rising lithography costs, and sustainability concerns around energy and material use are major challenges. Our APS technology directly addresses these pain points by simplifying manufacturing, lowering cost per wafer, and improving process efficiency and limiting the use of fluorinated gases with high GWP and PFAS issues.

What does the competitive landscape look like and how do you differentiate?
The advanced patterning landscape is dominated by EUV lithography and multi-patterning techniques. Competitors include optical lithography equipment provider ASML and alternatives like Canon’s and EVG’s Nano Imprint Lithography and companies offering complex self-aligned multi-patterning solutions. AlixLabs differentiates itself by providing a complementary or alternative solution that significantly reduces the reliance on costly lithography steps. APS enables manufacturers to scale down features without the added process complexity and cost burden of traditional patterning methods.

What new features/technology are you working on?
We are continuously refining our APS process for even finer feature scaling and expanding our compatibility with additional wafer sizes and materials. Our R&D team is focused on optimizing APS for future semiconductor nodes and integrating it with emerging process flows to enhance manufacturability, yield, and sustainability.

How do customers normally engage with your company?
Our customers typically engage with us through early-stage evaluations and process development collaborations. We work closely with leading semiconductor manufacturers, foundries, and research institutes to qualify and integrate APS into their production workflows. Engagements range from feasibility studies and we are developing a Beta tool (RFP 3Q2025) for early pilot design verification and pilot production to be followed by full-scale implementation for high-volume manufacturing in 2027-2029.

Also Read:

CEO Interview with Dr. Thang Tran of Simplex Micro

CEO Interview with Fabrizio Del Maffeo of Axelera AI

CEO Interview with Dinesh Bettadapur of Irresistible Materials