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For the 2024 SEMI International Strategy Symposium I was challenged by members of the organizing committee to look at where logic will be in ten years from a technology, economics, and sustainability perspective. The following is a discussion of my presentation.
To understand logic, I believe it is useful to understand what makes… Read More
There are trillions of dollars at stake with AI and huge geopolitical consequences. However, the weak foundation to American technological power is their dependence on Taiwan and TSMC, which is where most advanced silicon is manufactured. America has also been taking China to the ropes lately in their economic/technology proxy… Read More
Chiplets (die stacking) is not new. The origins are deeply rooted in the semiconductor industry and represent a modular approach to designing and manufacturing integrated circuits. The concept of chiplets has been energized as a response to the recent challenges posed by the increasing complexity of semiconductor design. … Read More
There is a lot being said about Intel getting the lead back from TSMC with their 18A process. Like anything else in the semiconductor industry there is much more here than meets the eye, absolutely.
From the surface, TSMC has a massive ecosystem and is in the lead as far as process technologies and foundry design starts but Intel is … Read More
I attended the recent International Electron Devices Meeting (IEDM) last week. Many of the sessions are too technical and too far away from high volume manufacture to make good topics for a blog post. As a Fellow from IBM said about 5nm at and earlier IEDM, “none of these ideas will impact 5nm. It takes ten years for a solution to from… Read More
I confess I am reading tea leaves in this blog, but why not? Arm recently announced Arm Total Design, an expansion of their Compute Subsystems (CSS) offering which made me wonder about the motivation behind this direction. They have a lot of blue-chip partners lined up for this program yet only a general pointer to multi-die systems… Read More
The 15th TSMC Open Innovation Platform® (OIP) event was held recently. This event is a focal point across the industry for cutting-edge development and industry-level collaboration. Appropriately, advanced packaging, paving the way for multi-die design was a focal point for the event. You can get a good overview of what was … Read More
TSMC has been offering foundry services since 1987, and their first 3nm node was called N3 and debuted in 2022; now they have an enhanced 3nm node dubbed N3E that has launched. Every new node then requires IP that is carefully designed, characterized and validated in silicon to ensure that the IP specifications are being met and … Read More
The 15th TSMC Open Innovation Platform® (OIP) was held last week. In preparation we did a podcast with one of the original members of the TSMC OIP team Dan Kochpatcharin. Dan and I talked about the early days before OIP when we did reference flows together. Around 20 years ago I did a career pivot and focused on Strategic Foundry Relationships.… Read More
TSMC originally brought the pure-play foundry business to the United States in 1996 through a joint venture with customers Altera, Analog Devices, ISSI, and private investors (no government money). Altera is now part of Intel but ADI is still a top TSMC customer and enthusiastic supporter. I have seen the ADI CEO Vincent Roche … Read More
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[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_whenSaveable:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[populated:protected] => 1
)