WP_Term Object
(
    [term_id] => 21
    [name] => Ceva
    [slug] => ceva
    [term_group] => 0
    [term_taxonomy_id] => 21
    [taxonomy] => category
    [description] => 
    [parent] => 178
    [count] => 186
    [filter] => raw
    [cat_ID] => 21
    [category_count] => 186
    [category_description] => 
    [cat_name] => Ceva
    [category_nicename] => ceva
    [category_parent] => 178
    [is_post] => 
)
            
Ceva 2023 color positive no R RGB 250x125
WP_Term Object
(
    [term_id] => 21
    [name] => Ceva
    [slug] => ceva
    [term_group] => 0
    [term_taxonomy_id] => 21
    [taxonomy] => category
    [description] => 
    [parent] => 178
    [count] => 186
    [filter] => raw
    [cat_ID] => 21
    [category_count] => 186
    [category_description] => 
    [cat_name] => Ceva
    [category_nicename] => ceva
    [category_parent] => 178
    [is_post] => 
)

UWB Without the Integration Headache: Ceva and LG Bring Precision to More Chips

UWB Without the Integration Headache: Ceva and LG Bring Precision to More Chips
by Daniel Nenni on 09-15-2026 at 8:00 am

UWB Without the Integration Headache Ceva and LG Bring Precision to More Chips

Ceva and LG Electronics have joined forces to remove one of the biggest obstacles to ultra-wideband adoption: integrating a complete radio, baseband and software stack into a production system-on-chip. Their joint platform combines Ceva-Waves UWB baseband intellectual property and software with an RF front end developed… Read More


2026 Ceva Edge Symposium: Building Intelligence Beyond the Cloud

2026 Ceva Edge Symposium: Building Intelligence Beyond the Cloud
by Daniel Nenni on 09-09-2026 at 6:00 am

Ceva Edge Symposium

The 2026 Ceva Edge Symposium will bring together engineers, technology leaders, ecosystem partners, and innovators to explore a major shift in computing: moving artificial intelligence from distant cloud infrastructure into the devices that interact directly with the physical world. Scheduled for November 2 in Hsinchu,… Read More


New Audio SoCs Combine Bluetooth HDT with Dual-RF Technology

New Audio SoCs Combine Bluetooth HDT with Dual-RF Technology
by Daniel Nenni on 08-06-2026 at 2:00 pm

Next generation Bluetooth audio ecosystem

Ceva and Actions Technology have expanded their longstanding partnership with the introduction of the ATS296X series, a new family of Bluetooth audio chips designed to bring High Data Throughput technology into commercial wireless products. Powered by the Ceva-Waves Bluetooth HDT platform, the series is positioned as one… Read More


Intelligence at the Edge, Leverage at the Core

Intelligence at the Edge, Leverage at the Core
by Daniel Nenni on 08-06-2026 at 10:00 am

CEVA Q2 2026

Ceva’s second-quarter 2026 performance demonstrates how an intellectual-property supplier converts design activity into high-margin revenue before customer products reach production. Total revenue increased 13% year over year to $29.0 million, led by licensing and related revenue of $18.2 million, up 21% and the highest… Read More


Ceva Targets PC Gaming Audio Market With RealSpace Elevate for Windows

Ceva Targets PC Gaming Audio Market With RealSpace Elevate for Windows
by Daniel Nenni on 06-30-2026 at 10:00 am

CEVA Realspace Microsoft

Ceva has launched RealSpace™ Elevate for Windows, a Microsoft-certified spatial audio software solution aimed at PC gaming headsets and PC OEMs. The product is delivered as a licensable Windows Audio Processing Object, or APO, giving device makers a production-ready way to add branded, customizable spatial audio to gaming… Read More


CEVA Accelerates Wireless Edge Innovation with Bluetooth HDT and Integrated RF Design Win

CEVA Accelerates Wireless Edge Innovation with Bluetooth HDT and Integrated RF Design Win
by Daniel Nenni on 05-26-2026 at 10:00 am

ChatGPT Image Jun 14, 2026, 11 22 03 AM

CEVA, the leading licensor of wireless connectivity and smart sensing technologies, is advancing its full-stack wireless strategy with the introduction of next-generation Bluetooth High Data Throughput (HDT) capabilities and a major integrated RF subsystem design win. The announcement underscores CEVA’s growing role… Read More


All in One Bluetooth Audio: A Complete Solution on a TSMC 12nm Single Die

All in One Bluetooth Audio: A Complete Solution on a TSMC 12nm Single Die
by Daniel Nenni on 04-27-2026 at 6:00 am

All in One Bluetooth Audio A Complete Solution on a TSMC 12nm Single Die

The rapid evolution of wireless audio has placed unprecedented demands on system integration, power efficiency, and performance. Against this backdrop, the webinar “All-in-One Bluetooth Audio: A Complete Solution on a TSMC 12nm Single Die” offers a timely and technically rich exploration of how modern semiconductor design… Read More


From Satellites to 5G: Ceva’s PentaG-NTN™ Lowers Barriers for Terminal Innovators

From Satellites to 5G: Ceva’s PentaG-NTN™ Lowers Barriers for Terminal Innovators
by Daniel Nenni on 03-05-2026 at 8:00 am

unnamed (3)

Ceva, Inc., a leading provider of silicon and software IP for the Smart Edge, has unveiled PentaG-NTN™, its groundbreaking 5G Advanced modem IP subsystem tailored for satellite user terminals in Low Earth Orbit (LEO) and Medium Earth Orbit (MEO) constellations. Announced at Mobile World Congress 2026 in Barcelona on March 3,… Read More


Ceva IP: Powering the Era of Physical AI

Ceva IP: Powering the Era of Physical AI
by Daniel Nenni on 02-17-2026 at 2:00 pm

Ceva IP Powering the Era of Physical AI

Artificial intelligence is rapidly moving beyond the digital domain and into the physical world. From autonomous robots and smart factories to intelligent vehicles and connected consumer devices, AI systems are increasingly expected to perceive their surroundings, make real-time decisions, and act on them instantly. This… Read More


Ceva Wi-Fi 6 and Bluetooth IPs Power Renesas’ First Combo MCUs for IoT and Connected Home

Ceva Wi-Fi 6 and Bluetooth IPs Power Renesas’ First Combo MCUs for IoT and Connected Home
by Daniel Nenni on 02-10-2026 at 8:00 am

unnamed (2)

The rapid expansion of IoT, smart home, and industrial automation markets is reshaping how connectivity is designed into embedded systems. Developers increasingly require highly integrated wireless solutions that deliver strong performance, ultra-low power consumption, and design flexibility, while also shortening… Read More