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WEBINAR Unpacking System Performance: Supercharge Your Systems with Lossless Compression IPs

WEBINAR Unpacking System Performance: Supercharge Your Systems with Lossless Compression IPs
by Daniel Nenni on 07-03-2025 at 6:00 am

CAST Compression IP Webinar 400x400

In today’s data-driven systems—from cloud storage and AI accelerators to automotive logging and edge computing—every byte counts. The exponential growth in data volumes, real-time processing demands, and constrained bandwidth has made efficient, lossless data compression a mission-critical requirement. Software-based… Read More


Siemens EDA Unveils Groundbreaking Tools to Simplify 3D IC Design and Analysis

Siemens EDA Unveils Groundbreaking Tools to Simplify 3D IC Design and Analysis
by Kalar Rajendiran on 07-01-2025 at 10:00 am

Innovator3D IC Solution Suite

In a major announcement at the 2025 Design Automation Conference (DAC), Siemens EDA introduced a significant expansion to its electronic design automation (EDA) portfolio, aimed at transforming how engineers design, validate, and manage the complexity of next-generation three-dimensional integrated circuits (3D ICs).… Read More


Podcast EP294: An Overview of the Momentum and Breadth of the RISC-V Movement with Andrea Gallo

Podcast EP294: An Overview of the Momentum and Breadth of the RISC-V Movement with Andrea Gallo
by Daniel Nenni on 06-27-2025 at 10:00 am

Dan is joined by Andrea Gallo, CEO of RISC-V International, the non-profit home of the RISC-V instruction set architecture standard, related specifications, and stakeholder community. Prior to joining RISC-V International, Gallo worked in leadership roles at Linaro for over a decade. He built Linaro’s server engineering… Read More


Flynn Was Right: How a 2003 Warning Foretold Today’s Architectural Pivot

Flynn Was Right: How a 2003 Warning Foretold Today’s Architectural Pivot
by Jonah McLeod on 06-24-2025 at 10:00 am

Table 1

In 2003, legendary computer architect Michael J. Flynn issued a warning that most of the industry wasn’t ready to hear. The relentless march toward more complex CPUs—with speculative execution, deep pipelines, and bloated instruction handling—was becoming unsustainable. In a paper titled “Computer Architecture … Read More


Enabling RISC-V & AI Innovations with Andes AX45MPV Running Live on S2C Prodigy S8-100 Prototyping System

Enabling RISC-V & AI Innovations with Andes AX45MPV Running Live on S2C Prodigy S8-100 Prototyping System
by Daniel Nenni on 06-24-2025 at 6:00 am

Andesbanner

Qualifying an AI-class RISC-V SoC demands proving that wide vectors, deep caches, and high-speed I/O operate flawlessly long before tape-out. At the recent Andes RISC-V Conference, Andes Technology and S2C showcased this by successfully booting a lightweight large language model (LLM) inference on a single S2C Prodigy™ S8-100… Read More


Arteris at the 2025 Design Automation Conference #62DAC

Arteris at the 2025 Design Automation Conference #62DAC
by Daniel Nenni on 06-22-2025 at 8:00 am

62nd DAC SemiWiki

Key Takeaways:

  • Expanded Multi-Die Solution: Arteris showcases its foundational technology for rapid chiplet-based innovation. Check out the multi-die highlights video.
  • Ecosystem compatibility: Supported through integration with products from major EDA and foundry partners, including Cadence, Synopsys, and global
Read More

Arteris Expands Their Multi-Die Support

Arteris Expands Their Multi-Die Support
by Bernard Murphy on 06-18-2025 at 6:00 am

multi die use cases min

I am tracking the shift to multi-die design, so it’s good to see Arteris extend their NoC expertise, connecting chiplets across an interposer. After all, network connectivity needs don’t stop at the boundaries of chiplets. A multi-die package is at a logical level just a scaled-up SoC for which you still need traffic routing and… Read More


Agile Analog at the 2025 Design Automation Conference #26DAC

Agile Analog at the 2025 Design Automation Conference #26DAC
by Daniel Nenni on 06-17-2025 at 10:00 am

62nd DAC SemiWiki

See Agile Analog at DAC in the EE Times Chiplet Pavilion (Booth 2308, Level 2)

Learn how to enhance security and performance with our customizable analog IP

Agile Analog is delighted to announce that we will be back exhibiting at the Design Automation Conference (DAC). Come join us in the EE Times Chiplet Pavilion (booth 2308) to … Read More


Silicon Creations at the 2025 Design Automation Conference #62DAC

Silicon Creations at the 2025 Design Automation Conference #62DAC
by Daniel Nenni on 06-16-2025 at 6:00 am

62nd DAC SemiWiki

Silicon Creations provides world-class IP for precision and general-purpose timing (PLLs and oscillators), high-performance multi-protocol and protocol-specific SerDes, high-speed I/Os, and accurate PVT sensors. Applications include high performance computing for AI, smart phones, wearables, consumer devices, … Read More


Certus Semiconductor at the 2025 Design Automation Conference #62DAC

Certus Semiconductor at the 2025 Design Automation Conference #62DAC
by Daniel Nenni on 06-15-2025 at 10:00 am

62nd DAC SemiWiki

Certus Semiconductor Brings High-Performance Custom I/O and ESD IP to DAC 2025

Certus Semiconductor, a trusted leader in custom I/O and ESD solutions, will exhibit at booth #1731 during DAC 2025, June 23–27 in San Francisco. Known for its robust, customer-proven IP tailored for challenging applications, Certus will highlight… Read More