The 2024 DVCon (Design and Verification) Europe conference took place on October 15 and 16, in its traditional location at the Holiday Inn Munich City Centre. Artificial intelligence and software were prominent topics, along with the traditional DVCon topics like virtual platforms, RTL verification, and validation.
Semiconductor Intellectual Property
Datacenter Chipmaker Achieves Power Reduction With proteanTecs AVS Pro
As semiconductor technology advances and nodes continue to shrink, designers are faced with increasing challenges related to device complexity, power consumption, and reliability. The delicate balance between high performance, low power usage, and long-term reliability is more critical than ever. This growing demand … Read More
Overcoming obstacles with mixed-signal and analog design integration
Mixed-signal and analog design are key aspects of modern electronics. Every chip incorporates some form of analog IP, as even digital logic is dependent on analog signals for critical functions. Many digital design engineers are known to be uncomfortable with the prospect of integrating analog components. However, the current… Read More
The RISC-V and Open-Source Functional Verification Challenge
Most of the RISC-V action at the end of June was at the RISC-V Summit Europe, but not all. In fact, a group of well-informed and opinionated experts took over the Pavilion stage at the Design Automation Conference to discuss functional verification challenges for RISC-V and open-source IP.
Technology Journalist Ron Wilson and … Read More
Analog Bits Builds a Road to the Future at TSMC OIP
The TSMC Open Innovation Platform (OIP) Ecosystem Forum has become the industry benchmark when it comes to showcasing industry-wide collaboration. The extreme design, integration and packaging demands presented by multi-die, chiplet-based design have raised the bar in terms of required collaboration across the entire … Read More
Mobile LLMs Aren’t Just About Technology. Realistic Use Cases Matter
Arm has been making noise about running large language models (LLMs) on mobile platforms. At first glance that sounds wildly impractical, other than Arm acting as an intermediary between a phone and a cloud-based LLM. However Arm are partnered with Meta to run Llama 3.2 on-device or in the cloud, apparently seamlessly. Running… Read More
How AI is Redefining Data Center Infrastructure: Key Innovations for the Future
Artificial intelligence (AI) is driving a transformation in data center infrastructure, necessitating cutting-edge technologies to meet the growing demands of AI workloads. As AI systems scale up and out, next-gen compute servers, switches, optical-electrical links, and flexible, redundant networking solutions are … Read More
Navigating Frontier Technology Trends in 2024
Many of you are already familiar with Silicon Catalyst and the value it brings to semiconductor startups, the industry and the electronics industry at large. Silicon Catalyst is an organization that supports early-stage semiconductor startups with an ecosystem that provides tools and resources needed to design, create, and… Read More
Maximizing 3DIC Design Productivity with 3DBlox: A Look at TSMC’s Progress and Innovations in 2024
At the 2024 TSMC OIP Ecosystem Forum, one of the technical talks by TSMC focused on maximizing 3DIC design productivity and rightfully so. With rapid advancements in semiconductor technology, 3DICs have become the next frontier in improving chip performance, energy efficiency, and density. TSMC’s focus on streamlining the… Read More
Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design
Synopsys made significant announcements during the recent TSMC OIP Ecosystem Forum, showcasing a range of cutting-edge solutions designed to address the growing complexities in semiconductor design. With a strong emphasis on enabling next-generation chip architectures, Synopsys introduced both new technologies and … Read More
Semiconductors Slowing in 2025