The Universal Chiplet Interconnect Express (UCIe) 3.0 specification marks a decisive step in the industry’s shift from monolithic SoCs to modular, multi-die systems. Released on August 5, 2025, the new standard doubles peak link speed from 32 GT/s in UCIe 2.0 to 48 and 64 GT/s while adding a suite of manageability and efficiency
Semiconductor Intellectual Property
CAST Webinar About Supercharging Your Systems with Lossless Data Compression IPs
Much of advanced technology is data-driven. From the cloud and AI accelerators to automotive processing and edge computing, data storage and transmission efficiency are of critical importance. It turns out that lossless data compression is a key ingredient to deliver these requirements.
While there are both software and hardware… Read More
cHBM for AI: Capabilities, Challenges, and Opportunities
AI’s exponential growth is transforming semiconductor design—and memory is now as critical as compute. Multi-die architecture has emerged as the new frontier, and custom High Bandwidth Memory (cHBM) is fast becoming a cornerstone in this evolution. In a panel session at the Synopsys Executive Forum, leaders from AWS, Marvell,… Read More
Memory Innovation at the Edge: Power Efficiency Meets Green Manufacturing
By Tetsu Ho
With the ever-increasing global demand for smarter, faster electronic systems, the semiconductor industry faces a dual challenge: delivering high-performance memory while reducing environmental impact. Winbond is meeting this challenge head-on by embedding sustainability into every layer of its operations—from… Read More
Agile Analog Update at #62DAC
On the last day of DAC 2025 I met with Chris Morrison, VP of Product Marketing at Agile Analog, to get an update. Their company provides Analog IP, the way you want it, and I knew that they had internal tools and a novel methodology to speed up the development process. This year they have started talking more about their internal IP automation… Read More
Sophisticated soundscapes usher in cache-coherent multicore DSP
Digital audio processing is evolving into an art form, particularly in high-end applications such as automotive, cinema, and home theater. Innovation is moving beyond spatial audio technologies to concepts such as environmental correction and spatial confinement. These sophisticated soundscapes are driving a sudden increase… Read More
Alphawave Semi and the AI Era: A Technology Leadership Overview
The explosion of artificial intelligence (AI) is transforming the data center landscape, pushing the boundaries of compute, connectivity, and memory technologies. The exponential growth in AI workloads—training large language models (LLMs), deploying real-time inference, and scaling distributed applications—has … Read More
Podcast EP297: An Overview of sureCore’s New Silicon Services with Paul Wells
Dan is joined by sureCore CEO Paul Wells. Paul has worked in the semiconductor industry for over 25 years including two years as director of engineering for Pace Networks, where he led a multidisciplinary, 70 strong product development team creating a broadcast quality video & data mini-headend. Before that, he worked for… Read More
AI Booming is Fueling Interface IP 23.5% YoY Growth
AI explosion is clearly driving semi-industry since 2020. AI processing, based on GPU, need to be as powerful as possible, but a system will reach optimum only if it can rely on top interconnects. The various sub-system need to be interconnected with ever more bandwidth and lower latency, creating the need for ever advanced protocol… Read More
Arteris Simplifies Design Reuse with Magillem Packaging
Many know Arteris as the “network-on-chip”, or NoC, company. Through acquisitions and forward-looking development, the footprint for Arteris has grown beyond smart interconnect IP. At DAC this year, Arteris highlighted its latest expansion with a new SoC integration automation product called Magillem Packaging. The announcement… Read More
Can RISC-V Help Recast the DPU Race?