For decades, semiconductor teams have relied on traditional methods such as corner-based analysis, surrogate monitors, and population-level statistical screening for post-silicon validation. These methods served well when variability was modest, and timing paths behaved predictably. However, today’s advanced nodes… Read More
Semiconductor Intellectual Property
United Micro Technology and Ceva Collaborate for 5G RedCap SoC and Why it Matters
In the ultra competitive automotive technology race the integration of advanced connectivity is no longer a luxury but a necessity. As vehicles transition from isolated machines to intelligent nodes in a vast ecosystem, seamless, reliable communication becomes paramount. On November 11, 2025, Ceva, Inc., a leading licensor… Read More
Podcast EP319: What Makes Agile Analog a Unique Company with Chris Morrison
Daniel is joined by Chris Morrison, vice president of product marketing at Agile Analog, the customizable analog IP company. Chris has over 18 years’ experience developing strong relationships with key partners across the semiconductor industry and delivering innovative analog, digital, power management and audio products.… Read More
Live Webinar: Considerations When Architecting Your Next SoC: NoC with Arteris and Aion Silicon
The explosive growth of AI and accelerated computing is placing unprecedented demands on system-on-chip (SoC) design. Modern AI workloads require extremely high bandwidth, ultra-low latency, and energy-efficient data movement across increasingly heterogeneous architectures. As SoCs scale to incorporate clusters of… Read More
Modern Trends in I/O and ESD Design at TSMC OIP
It was very clear at the recent 2025 TSMC OIP Ecosystem Forum that the semiconductor I/O landscape has undergone a profound transformation over the past 25 years, evolving from simple general-purpose input/output (GPIO) cells in 180nm nodes to highly complex, multi-protocol, feature-rich libraries in advanced 16nm and 22nm… Read More
Mixel Company Update 2025
Mixel, Inc., a longtime leader in mixed-signal and MIPI® interface IP, entered a new chapter in its history following its acquisition by Silvaco Group, Inc., a global provider of design software and semiconductor IP. The acquisition, completed earlier in 2025, marks a strategic move that combines Silvaco’s deep expertise in… Read More
A Tour of Advanced Data Conversion with Alphacore
There is always a lot of buzz about advanced AI workloads at trade shows. How to train them and how to run them. Advanced chip and multi-die designs are how AI is brought to life, so it was a perfect fit for discussion at a show. But there is another side of this discussion. Much of the work going on in AI workloads has to do with processing… Read More
Silicon Creations Company Update 2025
Arm FCSA and the Journey to Standardizing Open Chiplet-Based Design
I have written before about an inter-chiplet communication challenge to realizing the dream of multi-die designs built around open-market chiplets. Still a worthy dream but it’s going to take a journey to get there. Arm recently donated their Foundation Chiplet System Architecture (FCSA) to the Open Compute Project (OCP) as… Read More
Ceva Unleashes Wi-Fi 7 Pulse: Awakening Instant AI Brains in IoT and Physical Robots
In the rapidly evolving landscape of connected devices, where artificial intelligence meets the physical world, Ceva has unveiled a groundbreaking solution: the Ceva-Waves Wi-Fi 7 1×1 client IP. Announced on October 21, 2025, this IP core is designed to supercharge AI-enabled IoT devices and pioneering physical AI systems,… Read More


Quantum Computing Technologies and Challenges