Ceva is expanding the reach of its neural processing technology with a next-generation NeuPro portfolio designed to serve everything from always-on sensors to AI infrastructure. The announcement introduces four NPU families sharing a common architecture and unified software stack, giving semiconductor developers a consistent… Read More
Semiconductor Intellectual Property
S2C Targets Faster RISC-V Bring-Up With Prototyping and AI
S2C showcased FPGA prototyping and AI-assisted debugging at the sixth RISC-V Summit China, outlining how developers can validate complex processor designs and begin software development before first silicon. Its demonstrations connected three stages of that effort: running substantial RISC-V systems on FPGA hardware,… Read More
CEO Interview with Lisa Spelman of Cornelis
Lisa Spelman is CEO of Cornelis, where she leads the company’s efforts to advance high-performance networking for AI and HPC infrastructure. She brings more than 20 years of experience across AI, cloud, enterprise infrastructure, data center operations, product strategy, and go-to-market leadership.
Before joining Cornelis,… Read More
Inside the Silicon: Analog Bits N2P2 Test Chip
The future of intelligent computing depends on silicon that delivers more performance within tighter power and thermal limits. Combining TSMC’s advanced process technology with Analog Bits’ analog and mixed-signal expertise, we help designers address those demands through local power regulation, supply monitoring, precision… Read More
Arteris FlexGen Opens Up Multi-Die Traffic Management for Non-Coherent Networks
Last year I wrote about Arteris’ introduction of multi-die support for coherent NoCs. This is a very big deal because hyperscalers and OEMs are now building large systems that depend on multi-chiplet architectures and require efficient traffic management between chiplets, in one case as many as 12 compute, fabric/cache and … Read More
Interview with Eric Hong, VP of Engineering at Mixel, a Silvaco Company
Eric Hong is Vice President of Engineering at Mixel, a Silvaco company, where he leads the development of analog and mixed-signal IP, including high-speed PHY and SerDes solutions. Prior to Mixel, he held engineering leadership and technical roles at Nvidia, eSilicon, Samsung Electro-Mechanics, and Intel, leading the development… Read More
Chips&Media targets AI memory bottlenecks with new compression IP
Chips&Media has announced a data compression technology aimed at one of the constraints in artificial intelligence hardware: moving data fast enough to keep processors busy. The South Korean semiconductor intellectual property supplier says its new Feature Map Compression IP marks an expansion beyond video applications… Read More
Overcoming the Edge AI Power Wall with Low-Voltage Foundation IP
As artificial intelligence (AI) workloads migrate to endpoint hardware, edge AI devices face immense pressure to deliver real-time inference within highly restrictive power and thermal envelopes. Traditional silicon scaling no longer yields the power-density returns it once did. To compensate, engineering teams are turning… Read More
WEBINAR: The Convergence of Edge Accelerators
The rapid growth of AI at the edge is forcing SoC architects to rethink traditional processor designs. Dedicated NPUs deliver impressive performance for today’s models, but evolving AI workloads, increasing system complexity and growing pressure on power and silicon budgets are exposing the limitations of fixed-function… Read More
From Blueprint to Production: How Rambus Brings Commercial-Grade Caliptra Security to AI SoCs
Semiconductor designers today face a critical hurdle: how to smoothly transition from an open-source hardware blueprint to a commercially hardened, production-ready silicon implementation. As semiconductors play an increasingly essential role in powering the AI era, safeguarding these hardware foundations has become… Read More


Why America’s Semiconductor Manufacturing Capacity Matters