Among several topics dominating news streams these days, giant datacenters are a leading theme. They point to an AI-centric future while raising real concerns about sustainability and scalability. Certainly land, power and water demand are very present concerns for most of us, witness growing pushback against building new… Read More
Semiconductor Intellectual Property
Customized Foundation IP Enables the Next Generation of Automotive Compute
As vehicles become increasingly software-defined, automotive semiconductor suppliers face growing pressure to deliver higher compute performance while maintaining strict requirements for power efficiency, reliability, and long-term product support. Advanced driver assistance systems (ADAS), electrification, … Read More
Rambus Delivers Complete DDR5 Client Chipset for High-Speed CUDIMM and CSODIMM Memory Modules
The rapid emergence of AI-enabled personal computers is driving unprecedented demand for higher memory bandwidth, improved signal integrity and greater system reliability. To address these requirements, Rambus has introduced a complete client memory interface chipset for Clocked Unbuffered Dual In-Line Memory Modules… Read More
Weebit Nano ReRAM Reaches Commercial Tape-Out Milestone
Weebit Nano has achieved a critical milestone in the commercialization of Resistive Random Access Memory (ReRAM) technology with the successful tape-out of two customer products integrating its embedded non-volatile memory IP. One of the products has already returned first silicon and demonstrated functional operation,… Read More
Intel: Pushing EMIB Forward: Design Methodology Insights with Synopsys Tools
As advanced packaging becomes a critical enabler for next-generation semiconductor products, Intel continues to drive innovation through its Embedded Multi-die Interconnect Bridge (EMIB) technology. EMIB has emerged as a foundational packaging solution for heterogeneous integration, allowing multiple chiplets and… Read More
Why Europe Needs Its Own AI Supercomputing Platform
The strategic cooperation between Semidynamics and SiPearl to develop a European sovereign rack-scale AI compute platform is important for reasons that extend far beyond technology. It represents a major step toward Europe gaining greater control over its artificial intelligence infrastructure, reducing dependence on… Read More
Breaking the Clock Lane Barrier: MIPI C-PHY/D-PHY Combo IP on TSMC N2P
The transition to advanced process nodes is reshaping high-speed interface IP requirements for mobile, automotive, AR/VR, and AI edge devices. As SoC designers migrate to cutting-edge foundry technologies, the demand for highly optimized MIPI PHY solutions continues to grow. A key development in this space is the availability… Read More
CFrame60: Rewriting the Rules of Frame Compression
Chips&Media CFrame60 is a next-generation frame compression hardware IP designed to address the growing bandwidth and memory challenges in modern SoCs targeting imaging, video, AI, and display applications. Unlike conventional compression architectures that prioritize either bandwidth reduction or image quality,… Read More
SRAM compilers targeting automotive SoCs on advanced nodes
Processor IP garners the most attention in SoC design, but it’s not the only IP category begging for smart choices. Every processor core needs to be fed with data; however, frequent off-chip DRAM access incurs a large clock-cycle penalty each time. Architects now want SRAM blocks distributed throughout an SoC, putting data close… Read More
CEVA Accelerates Wireless Edge Innovation with Bluetooth HDT and Integrated RF Design Win
CEVA, the leading licensor of wireless connectivity and smart sensing technologies, is advancing its full-stack wireless strategy with the introduction of next-generation Bluetooth High Data Throughput (HDT) capabilities and a major integrated RF subsystem design win. The announcement underscores CEVA’s growing role… Read More


Intel: Pushing EMIB Forward: Design Methodology Insights with Synopsys Tools