Daniel is joined by Dr. Debendra Das Sharma, a Senior Fellow and Chief I/O architect in the Data Platforms and Artificial Intelligence Group at Intel. He is a member of the National Academy of Engineering (NAE), Fellow of IEEE, and Fellow of International Academy of AI Sciences. He is a leading expert on I/O subsystem and interface… Read More
AI isn’t having an easy ride. The media and Wall Street swing wildly between extremes on any hint of a shift in AI sentiment. Dickens saw this coming: “It was the best of times, it was the worst of times, it was the age of wisdom, it was the age of foolishness, it was the epoch of belief, it was the epoch of incredulity, it was the season of … Read More
During my frequent trips to Taiwan as a foundry relationship professional I remember meeting Frankwell Lin, CEO of Andes, in Taiwan 15+ years ago. As I walked to TSMC HQ from the Hotel Royal (my second home for many years) Andes was about mid point and Frankwell’s door was always open. Sometimes just tea, sometimes technology,… Read More
In the rapidly evolving landscape of semiconductor technology, the Universal Chiplet Interconnect Express (UCIe) emerges as a groundbreaking open standard designed to revolutionize on-package chiplet integrations. Presented by Dr. Debendra Das Sharma, Chair of the UCIe Consortium and Intel Senior Fellow, at the Chiplet… Read More
Ceva, Inc., a leading provider of silicon and software IP for the Smart Edge, has unveiled PentaG-NTN™, its groundbreaking 5G Advanced modem IP subsystem tailored for satellite user terminals in Low Earth Orbit (LEO) and Medium Earth Orbit (MEO) constellations. Announced at Mobile World Congress 2026 in Barcelona on March 3,… Read More
RVA23 marks a turning point in how mainstream CPUs are expected to scale performance. By making the RISC-V Vector Extension (RVV) mandatory, it elevates structured, explicit parallelism to the same architectural status as scalar execution. Vectors are no longer optional accelerators bolted onto speculation-heavy cores.… Read More
by Jagadish Nayak
RISC-V adoption continues to accelerate across commercial and government microelectronics programs. Whether open-source or commercially licensed, most RISC-V processor cores are integrated as third-party IP (3PIP), potentially introducing supply chain security challenges that demand structured,… Read More
The rapid evolution of automotive technology has intensified the demand for highly reliable, high-performance semiconductor memory solutions. Modern vehicles increasingly rely ADAS driving features, and complex infotainment platforms, all of which require memory that can operate flawlessly under extreme environmental… Read More
Non-volatile memory choices are becoming more complex as SoC designs push into advanced nodes, and new requirements driven by AI, new sensor technologies and stringent quality standards.
The second annual 2025 NVM Survey, completed in December, captures a market that still hangs on established technologies but is increasingly… Read More
As computing expands from data centers to edge devices, semiconductor designers face increasing pressure to optimize both performance and energy efficiency. Advanced process nodes continue to provide transistor-level improvements, but scaling alone cannot meet the demands of hyperscale AI infrastructure or ultra-low-power… Read More
Intel Foundry: How They Got Here and Scenarios for Improvement