When considering best-fit applications for RISC-V, the appeal of extending the instruction set and competitive pricing for storage and edge applications has been pretty clear. But I have always struggled to understand the appeal in head-on competition with Arm in premium applications such as servers and infrastructure systems.… Read More
Semiconductor Intellectual Property
Silicon Creations at DAC 2026: Solutions for clocking, SerDes, and sensing in 2nm (and beyond)
Silicon Creations provides world-class IP for precision and general-purpose timing (PLLs and oscillators), high-performance multi-protocol, latency optimized and protocol-specific SerDes, high-speed I/Os, and accurate VT sensors. Applications include high-performance computing for AI, smart phones, wearables,… Read More
The Architecture of Success: Why a Unified Semiconductor IP Strategy Is the Foundation of Modern SoC Design
As architects push toward advanced nodes and increasingly demanding workloads, modern silicon design has entered an era of unprecedented complexity. A single design respin can cost millions of dollars and delay market entry. Against this backdrop, designs must be balanced for performance, bandwidth, power efficiency, security… Read More
Podcast EP356: An Oveview of the Unique Skills and Broad Impact of Alphacore with Andrew Levy
Daniel is joined by Andrew Levy, Vice President of Business Development, IP & ASIC at Alphacore. Andrew leads strategic growth initiatives, customer engagement, technology commercialization, and business development activities for the company’s semiconductor IP, ASIC design services, and advanced microelectronics… Read More
WAVE-P: Hardware Acceleration for the APV Professional Video Codec
Professional video workflows demand a difficult combination of image quality, editing responsiveness, high throughput, and manageable silicon cost. Chips&Media’s WAVE-P addresses that combination as a dedicated hardware IP core for the Advanced Professional Video, or APV, codec. Designed for professional and prosumer… Read More
PCIe 7 Switch IP with Time Division Multiplexing: Powering the Next Generation of AI Connectivity
PCI Express (PCIe), PCIe switches, Time Division Multiplexing (TDM), Network Interface Cards (NICs), and SmartNICs are all well-established technologies that have formed the backbone of computing and networking systems for years. More recently, SuperNICs have emerged as the next generation of networking devices optimized… Read More
DAC 2026 See Analog Bits TSMC N2P IP portfolio and meet with its engineering experts!
Analog Bits, Inc. is an established provider of mixed-signal semiconductor IP that integrates into advanced system-on-chip (SoC) designs to enable intelligent energy and power management. Its full portfolio of IP blocks includes precision clocking macros, power and temperature sensors including LDO and regulators, programmable… Read More
Arteris at DAC 2026 Connecting Innovation for Silicon Success
The semiconductor industry has entered a new era as AI workloads, chiplets, heterogeneous computing, software-defined vehicles, and intelligent edge devices are transforming how chips are designed.
Silicon success is no longer determined by transistor counts alone, but by how efficiently data moves across increasingly… Read More
DAC 2026: Certus Semiconductor Brings Two New I/O Libraries to GlobalFoundries 12nm
Certus Semiconductor, a trusted leader in custom I/O and ESD solutions, will exhibit at Booth 839 during DAC 2026, July 27–29 in Long Beach. This year, Certus is announcing two new developments in GlobalFoundries 12LP and 12LP+ Processes: one I/O library built for commercial SoC and ASIC design teams, and one library purpose-built… Read More
Consolidation and Competition: Who is Winning the $4.5 Billion Interface IP Race?
The semiconductor landscape is currently undergoing a structural transformation as the “Data-Centric Shift” moves the industry’s center of gravity from smartphones toward High-Performance Computing (HPC) and AI infrastructure.
This transition is clearly validated by TSMC’s 2025 filings, which show… Read More


TSMC CoWoS versus Intel EMIB Semiconductor Packaging