IMGTC Webinar SemiWIki
WP_Term Object
(
    [term_id] => 178
    [name] => IP
    [slug] => ip
    [term_group] => 0
    [term_taxonomy_id] => 178
    [taxonomy] => category
    [description] => Semiconductor Intellectual Property
    [parent] => 0
    [count] => 2082
    [filter] => raw
    [cat_ID] => 178
    [category_count] => 2082
    [category_description] => Semiconductor Intellectual Property
    [cat_name] => IP
    [category_nicename] => ip
    [category_parent] => 0
    [is_post] => 
)

Silicon Creations: 15 Years of Learning, Designing and Growing Together

Silicon Creations: 15 Years of Learning, Designing and Growing Together
by Daniel Nenni on 09-24-2026 at 6:00 am

Silicon Creations CC interview

When I interviewed with Silicon Creations 15 years ago, I met directly with the company’s two founders, Jeff Galloway and Randy Caplan. I joined in 2011 as a circuit designer, and the three of us were the entire company. Today, Silicon Creations has grown to nearly 200 employees across multiple locations and serves almost 600 customers… Read More


The Intelligence Revolution: TSMC’s OIP Ecosystem Forges the Path to Trillion-Transistor AI Systems

The Intelligence Revolution: TSMC’s OIP Ecosystem Forges the Path to Trillion-Transistor AI Systems
by Kalar Rajendiran on 09-23-2026 at 2:00 pm

Broadest Portfolio of Silicon Validated IP

At the 2026 OIP Ecosystem Forum, the industry narrative shifted from incremental scaling to what TSMC defines as the “Intelligence Revolution.” Akin to the 18th-century Industrial Revolution which transitioned human physical labor to mechanical power, the current era is augmenting human ingenuity through … Read More


Weebit Nano’s FY26 ESG Performance: Technical Progress and Strategic Importance

Weebit Nano’s FY26 ESG Performance: Technical Progress and Strategic Importance
by Daniel Nenni on 09-22-2026 at 8:00 am

Weebit Nano’s FY26 ESG Performance Technical Progress and Strategic Importance

Weebit Nano’s FY26 ESG Report shows how sustainability, governance and operational resilience are becoming integrated into the company’s commercialisation of resistive random-access memory (ReRAM). This integration matters because Weebit’s value is not derived from manufacturing and selling finished chips directly.… Read More


Analog Bits Targets the Power Challenge at the Heart of Next-Generation Chips

Analog Bits Targets the Power Challenge at the Heart of Next-Generation Chips
by Daniel Nenni on 09-21-2026 at 6:00 am

Analog Bits Targets the Power Challenge at the Heart of Next Generation Chips

Analog Bits is expanding its role in advanced semiconductor design with new intellectual property aimed at one of the industry’s most difficult problems: delivering, monitoring, and managing power inside increasingly complex chips.

The company announced that its IP will be included in an upcoming customer test-chip tapeout… Read More


CEO Interview with Charlie Cheng of CEO of TeRAM

CEO Interview with Charlie Cheng of CEO of TeRAM
by Daniel Nenni on 09-18-2026 at 6:00 am

Charlie Cheng Headshot

Charlie Cheng is CEO of TeRAM, with four decades of technology experience focused on microprocessor architecture and semiconductor memory. Before TeRAM, he worked on several AI processors, including multiple generations of Meta’s MTIA accelerators beginning in 2019. Previously, he served as CEO of Kilopass, a semiconductor… Read More


Arm targets the agentic AI era with new edge, cloud and robotics platforms

Arm targets the agentic AI era with new edge, cloud and robotics platforms
by Daniel Nenni on 09-16-2026 at 8:00 am

Arm targets the agentic AI era with new edge, cloud and robotics platforms

Arm is expanding its computing platform for an era in which artificial intelligence does more than respond to individual prompts. The company expects AI agents to operate continuously across phones, data centers, vehicles, robots and other physical systems—perceiving their surroundings, reasoning about objectives and … Read More


UWB Without the Integration Headache: Ceva and LG Bring Precision to More Chips

UWB Without the Integration Headache: Ceva and LG Bring Precision to More Chips
by Daniel Nenni on 09-15-2026 at 8:00 am

UWB Without the Integration Headache Ceva and LG Bring Precision to More Chips

Ceva and LG Electronics have joined forces to remove one of the biggest obstacles to ultra-wideband adoption: integrating a complete radio, baseband and software stack into a production system-on-chip. Their joint platform combines Ceva-Waves UWB baseband intellectual property and software with an RF front end developed… Read More


PCIe 7 Switch IP with Time Division Multiplexing: Powering the Next Generation of AI Connectivity

PCIe 7 Switch IP with Time Division Multiplexing: Powering the Next Generation of AI Connectivity
by Admin on 09-15-2026 at 6:00 am

PCIe 7 Switch IP with Time Division Multiplexing

By Tim Messegee, Senior Director of Solutions Marketing at Rambus

PCI Express (PCIe), PCIe switches, Time Division Multiplexing (TDM), Network Interface Cards (NICs), and SmartNICs are all well-established technologies that have formed the backbone of computing and networking systems for years. More recently, SuperNICs… Read More


CAST Moves the Full TCP/IP Stack into Hardware at 100 Gbps

CAST Moves the Full TCP/IP Stack into Hardware at 100 Gbps
by Daniel Nenni on 09-14-2026 at 10:00 am

CAST TCPIP 100G PressFigure

CAST has introduced TCPIP-100G, a synthesizable intellectual-property core that implements a complete TCP/IP stack in hardware for ASICs and FPGAs. The core is designed to transmit and receive at up to 100 Gbps without depending on a host processor. That distinction is important: this is not simply a checksum engine or a network-interface… Read More


2026 Ceva Edge Symposium: Building Intelligence Beyond the Cloud

2026 Ceva Edge Symposium: Building Intelligence Beyond the Cloud
by Daniel Nenni on 09-09-2026 at 6:00 am

Ceva Edge Symposium

The 2026 Ceva Edge Symposium will bring together engineers, technology leaders, ecosystem partners, and innovators to explore a major shift in computing: moving artificial intelligence from distant cloud infrastructure into the devices that interact directly with the physical world. Scheduled for November 2 in Hsinchu,… Read More