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Podcast EP356: An Oveview of the Unique Skills and Broad Impact of Alphacore with Andrew Levy

Podcast EP356: An Oveview of the Unique Skills and Broad Impact of Alphacore with Andrew Levy
by Daniel Nenni on 07-17-2026 at 2:00 pm
Categories: Alphacore, IP

Daniel is joined by Andrew Levy, Vice President of Business Development, IP & ASIC at Alphacore. Andrew leads strategic growth initiatives, customer engagement, technology commercialization, and business development activities for the company’s semiconductor IP, ASIC design services, and advanced microelectronics… Read More

July 16, 2026July 16, 2026

WAVE-P: Hardware Acceleration for the APV Professional Video Codec

WAVE-P: Hardware Acceleration for the APV Professional Video Codec
by Daniel Nenni on 07-16-2026 at 10:00 am
Categories: Chips&Media, IP

Professional video workflows demand a difficult combination of image quality, editing responsiveness, high throughput, and manageable silicon cost. Chips&Media’s WAVE-P addresses that combination as a dedicated hardware IP core for the Advanced Professional Video, or APV, codec. Designed for professional and prosumer… Read More

July 16, 2026July 16, 2026

PCIe 7 Switch IP with Time Division Multiplexing: Powering the Next Generation of AI Connectivity

PCIe 7 Switch IP with Time Division Multiplexing: Powering the Next Generation of AI Connectivity
by Kalar Rajendiran on 07-16-2026 at 6:00 am
Categories: AI, IP, Rambus

PCI Express (PCIe), PCIe switches, Time Division Multiplexing (TDM), Network Interface Cards (NICs), and SmartNICs are all well-established technologies that have formed the backbone of computing and networking systems for years. More recently, SuperNICs have emerged as the next generation of networking devices optimized… Read More

July 15, 2026July 19, 2026

DAC 2026 See Analog Bits TSMC N2P IP portfolio and meet with its engineering experts!

DAC 2026 See Analog Bits TSMC N2P IP portfolio and meet with its engineering experts!
by Daniel Nenni on 07-15-2026 at 2:00 pm
Categories: Analog Bits, Events, GlobalFoundries, Intel Foundry, IP, Samsung Foundry, TSMC

Analog Bits, Inc. is an established provider of mixed-signal semiconductor IP that integrates into advanced system-on-chip (SoC) designs to enable intelligent energy and power management. Its full portfolio of IP blocks includes precision clocking macros, power and temperature sensors including LDO and regulators, programmable… Read More

July 15, 2026July 19, 2026

Arteris at DAC 2026 Connecting Innovation for Silicon Success

Arteris at DAC 2026 Connecting Innovation for Silicon Success
by Daniel Nenni on 07-15-2026 at 6:00 am
Categories: Arteris, Chiplet, Events, IP

The semiconductor industry has entered a new era as AI workloads, chiplets, heterogeneous computing, software-defined vehicles, and intelligent edge devices are transforming how chips are designed.

Silicon success is no longer determined by transistor counts alone, but by how efficiently data moves across increasingly… Read More

July 14, 2026July 19, 2026

DAC 2026: Certus Semiconductor Brings Two New I/O Libraries to GlobalFoundries 12nm

DAC 2026: Certus Semiconductor Brings Two New I/O Libraries to GlobalFoundries 12nm
by Daniel Nenni on 07-14-2026 at 2:00 pm
Categories: Certus Semiconductor, IP

Certus Semiconductor, a trusted leader in custom I/O and ESD solutions, will exhibit at Booth 839 during DAC 2026, July 27–29 in Long Beach. This year, Certus is announcing two new developments in GlobalFoundries 12LP and 12LP+ Processes: one I/O library built for commercial SoC and ASIC design teams, and one library purpose-built… Read More

July 9, 2026July 16, 2026

Consolidation and Competition: Who is Winning the $4.5 Billion Interface IP Race?

Consolidation and Competition: Who is Winning the $4.5 Billion Interface IP Race?
by Kalar Rajendiran on 07-09-2026 at 2:00 pm
Categories: AI, Chiplet, IP, IPnest, Semiconductor Services
1 Comment

The semiconductor landscape is currently undergoing a structural transformation as the “Data-Centric Shift” moves the industry’s center of gravity from smartphones toward High-Performance Computing (HPC) and AI infrastructure.

This transition is clearly validated by TSMC’s 2025 filings, which show… Read More

July 6, 2026July 6, 2026

Executive Interview with Chris Morrison, VP Product Marketing at Agile Analog

Executive Interview with Chris Morrison, VP Product Marketing at Agile Analog
by Daniel Nenni on 07-06-2026 at 6:00 am
Categories: Agile Analog, CEO Interviews, IP

Chris Morrison is VP Product Marketing at Agile Analog, the customizable analog IP company. He has over 18 years’ experience of developing strong relationships with key partners across the semiconductor industry and delivering innovative analog, digital, power management and audio products, working for international companies… Read More

July 1, 2026July 6, 2026

Chips&Media Strengthens Codec Leadership With Next-Gen AV2 Licensing Deal

Chips&Media Strengthens Codec Leadership With Next-Gen AV2 Licensing Deal
by Daniel Nenni on 07-01-2026 at 2:00 pm
Categories: Chips&Media, IP

Chips&Media has signed a next-generation AV2 video IP licensing agreement with a major North American Big Tech company, marking an important step in the commercialization of the next wave of video compression technology. The deal includes Chips&Media’s AV2 decoder IP along with multi-standard codec support for H.264/AVC,… Read More

June 30, 2026June 29, 2026

Ceva Targets PC Gaming Audio Market With RealSpace Elevate for Windows

Ceva Targets PC Gaming Audio Market With RealSpace Elevate for Windows
by Daniel Nenni on 06-30-2026 at 10:00 am
Categories: Ceva, IP

Ceva has launched RealSpace™ Elevate for Windows, a Microsoft-certified spatial audio software solution aimed at PC gaming headsets and PC OEMs. The product is delivered as a licensable Windows Audio Processing Object, or APO, giving device makers a production-ready way to add branded, customizable spatial audio to gaming… Read More

TSMC CoWoS versus Intel EMIB Semiconductor Packaging
I think the picture is bit of wrong for the scalability EMIB mentioned as 6X in 26 and CoWoS-L is…

— siliconbruh999 on July 17, 2026
Consolidation and Competition: Who is Winning the $4.5 Billion Interface IP Race?
HPC can be Chiplet. Wondering why UCIe is not considered. Internally AMBA neither

— chiro.lentz on July 11, 2026
The Packaging PDK Is the Missing Layer for Co-Packaged Optics
Thank you to Daniel Nenni and SemiWiki for publishing my latest article: The Packaging PDK Is the Missing Layer for…

— moh.kolb on July 8, 2026
The Packaging PDK Is the Missing Layer for Co-Packaged Optics
Very interesting. Thanks.

— U235 on July 8, 2026
Why Huawei Says It Will Match TSMC’s Most Advanced Chips by 2031
N+3 is denser than N6: https://newsletter.semianalysis.com/p/steel-smic-n3-teardown?open=false

— Fred Chen on July 5, 2026
Why Huawei Says It Will Match TSMC’s Most Advanced Chips by 2031
Fixed, thank you.

— Daniel Nenni on July 4, 2026
Why Huawei Says It Will Match TSMC’s Most Advanced Chips by 2031
The article is not correct. EUV equipment is not primarily produced by ASML. It is only produced by ASML. It…

— AndyG on July 4, 2026
Intel 18A vs Intel 18A-P: What Is the Difference and Why Does It Matter?
Nice writeup

— Rahul Razdan on June 27, 2026

10th Edition — IEEE International Test Conference INDIA 2026

Webinar: When Compute Outruns Data: Rethinking AI Connectivity

LucidShape User Group Meeting – North America

DAC 2026

Solido AI in action: Transforming every step of custom IC design & verification workflow

Podcast EP356: An Oveview of the Unique Skills and Broad Impact of Alphacore with Andrew Levy

WAVE-P: Hardware Acceleration for the APV Professional Video Codec

PCIe 7 Switch IP with Time Division Multiplexing: Powering the Next Generation of AI Connectivity

DAC 2026 See Analog Bits TSMC N2P IP portfolio and meet with its engineering experts!

Arteris at DAC 2026 Connecting Innovation for Silicon Success

DAC 2026: Certus Semiconductor Brings Two New I/O Libraries to GlobalFoundries 12nm

Consolidation and Competition: Who is Winning the $4.5 Billion Interface IP Race?

Executive Interview with Chris Morrison, VP Product Marketing at Agile Analog

Chips&Media Strengthens Codec Leadership With Next-Gen AV2 Licensing Deal

Ceva Targets PC Gaming Audio Market With RealSpace Elevate for Windows

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TSMC CoWoS versus Intel EMIB Semiconductor Packaging

Consolidation and Competition: Who is Winning the $4.5 Billion Interface IP Race?

The Packaging PDK Is the Missing Layer for Co-Packaged Optics

The Packaging PDK Is the Missing Layer for Co-Packaged Optics

Why Huawei Says It Will Match TSMC’s Most Advanced Chips by 2031

Why Huawei Says It Will Match TSMC’s Most Advanced Chips by 2031

Why Huawei Says It Will Match TSMC’s Most Advanced Chips by 2031

Intel 18A vs Intel 18A-P: What Is the Difference and Why Does It Matter?