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In a DACtv session on July 9, 2025, Pedro Pires from Keysight’s Design Engineering Software addressed the critical role of data management in modern semiconductor engineering projects. The presentation highlighted why data has become a bottleneck, how Keysight’s SOS (Save Our Source) platform mitigates these challenges,… Read More
On July 9, 2025, a DACtv session with Zackary Glazewski of ChipAgents AI introduced Waveform Agents, an AI-driven solution by Chip Agents designed to tackle the complex challenge of waveform debugging in semiconductor design. The speaker highlighted the difficulties of traditional waveform debugging and demonstrated how… Read More
In a DACtv session on July 9, 2025, Abhi Kolpekwar, Vice-President & General Manager at Siemens EDA, illuminated the transformative role of artificial intelligence (AI) in addressing the escalating challenges of semiconductor design verification. The presentation underscored the limitations of traditional methods… Read More
On July 9, 2025, a compelling session at DACtv by Vishal Moondrha of Perfroce addressed a critical challenge in the semiconductor industry: building trust in AI-generated code. The speaker highlighted the unique hurdles of integrating generative AI into semiconductor design, emphasizing issues like data provenance, quality,… Read More
At a recent conference session on July 9, 2025, Prashant Varshney, head of the Silicon and Physics Industry Vertical for Microsoft’s Discovery and Quantum Division, unveiled the transformative potential of the Microsoft Discovery Platform. This innovative platform, announced at Microsoft’s Build event, aims to redefine… Read More
Much of advanced technology is data-driven. From the cloud and AI accelerators to automotive processing and edge computing, data storage and transmission efficiency are of critical importance. It turns out that lossless data compression is a key ingredient to deliver these requirements.
While there are both software and hardware… Read More
Designing a system-on-chip (SoC) has never been more complex—or more critical. With accelerating demands across AI, automotive, and high-performance compute applications, today’s SoC architects face a series of high-stakes tradeoffs from the very beginning. Decisions made during the earliest phases of design—regarding… Read More
3D IC was a very popular topic at DAC. The era of heterogeneous, multi-chip design is here. There were a lot of research results and practical examples presented. What stood out for me was a panel at the end of day two of DAC that was hosted by Siemens. This panel brought together an impressive group of experts to weigh in on what was really… Read More
As AI models grow exponentially, the infrastructure supporting them is struggling under the pressure. At DAC, one company stood out with a solution that doesn’t just monitor chips, it empowers them to adapt in real time to these new workload requirements.
Unlike traditional telemetry or post-silicon debug tools, proteanTecs… Read More
As the new name reflects, chip and system design were a major focus at DAC. So was the role of AI to enable those activities. But getting an AI-enabled design flow to work effectively across chip, subsystem and system-level design presents many significant challenges. One important one is effectively managing the vast amount of… Read More
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MediaTek Develops Chip Utilizing TSMC’s 2nm Process, Achieving Milestones in Performance and Power Efficiency