#61DAC was buzzing with discussion of chiplet-based, heterogeneous design. This new design approach opens new opportunities for applications such as AI, autonomous driving and even quantum computing. A critical enabler for all this to work is reliable, cost-effective advanced packaging, and that is the topic of this post.… Read More
Codasip Makes it Easier and Safer to Design Custom RISC-V Processors #61DAC
RISC-V continued to be a significant force at #61DAC. There were many events that focused on its application in a wide variety of markets. As anyone who has used an embedded processor knows, the trick is how to be competitive. Using the same core as everyone else and differentiating in software is a strategy that tends to run out of … Read More
SEMICON West- Jubilant huge crowds- HBM & AI everywhere – CHIPS Act & IMEC
– We just finished the most happy SEMICON West in a long time
– IMEC stole the show- HBM has more impact than size dictates
– Has Samsung lost its memory mojo? Is SK the new leader?
– AI brings new tech issues with it – TSMC is still industry King
Report from SEMICON West
The crowds at Semicon West were both… Read More
Who Are the Next Anchor Tenants at DAC? #61DAC
#61DAC is evolving. The big get bigger and ultimately focus on other venues for customer outreach and branding. This is a normal evolution in any industry. For EDA, it was noticed by many that Cadence and Synopsys have downsized their booths at DAC. Everyone knows CDNLive and SNUG are very successful events for these companies and… Read More
Breker Brings RISC-V Verification to the Next Level #61DAC
RISC-V is clearly gaining momentum across many applications. That was quite clear at #61DAC as well. Breker Verification Systems solves challenges across the functional verification process for large, complex semiconductors. Its Trek family of products is production-proven at many leading semiconductor companies worldwide.… Read More
Intel’s Gary Patton Shows the Way to a Systems Foundry #61DAC
#61DAC was buzzing this year with talk of AI and multi-die, heterogeneous design. The promise of making 2.5/3D design and a chiplet ecosystem mainstream reality was the focus of a lot of the panels and presentations at the conference. AI is certainly a driver for this new design style, but the conversation was broader than just AI,… Read More
My Experience #61DAC
The theme of this year’s DAC was Chips to Systems which is a full circle type of thing since systems companies used to make their own chips. Old school computer companies were the biggest chip makers when I started in the semiconductor industry. IDMs like Motorola and Intel replaced them at the chip level. Shortly after I joined… Read More
LIVE WEBINAR Maximizing SoC Energy Efficiency: The Role of Realistic Workloads and Massively Parallel Power Analysis
As the complexity of modern System-on-Chip (SoC) designs continues to rise, achieving energy efficiency measured as performance per watt has become a crucial design goal. With the increasing demand for powerful, multifunctional chips, balancing performance with power consumption has become essential. Realistic workloads… Read More
Daniel Nenni at the 2024 Design Automation Conference
This year’s live semiconductor ecosystem conferences have been well attend and I expect the same for #61DAC next week. I will be at the conference from Sunday afternoon to Wednesday evening, if you would like to meet let me know. Networking is an important part of the semiconductor ecosystem so let’s make it happen.… Read More
Breker Verification Systems at the 2024 Design Automation Conference
Breker Verification Systems will demonstrate its new RISC-V CoreAssurance™ and SoCReady™ SystemVIP™ along with its Trek Test Suite Synthesis portfolio during the 61st Design Automation Conference (DAC) in Booth #2447. DAC will be held from Monday, June 24, through Wednesday, June 26, from 10 a.m. until 6 p.m. at Moscone West… Read More
Electrical Rule Checking in PCB Tools