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In the 3D-IC (Three-dimensional integrated circuit) chip design method, chiplets or wafers are stacked vertically on top of each other and are connected using Through Silicon Vias (TSVs) or hybrid bonding.
The 2.5D-IC design method places multiple chiplets alongside each other on a silicon interposer. Microbumps and interconnect… Read More
At the 2023 VLSI Symposium on Technology and Circuits, Intel presented two papers on their PowerVia technology. We received a pre-conference briefing on the technology embargoed until the conference began and received the papers.
Traditionally all interconnects have taken place on the front side of devices with signal and … Read More
Plan ahead now because Friday, June 30, is the deadline to submit nominations for the Phil Kaufman Award and the Phil Kaufman Hall of Fame for anyone you think is deserving of these honors. If you haven’t given it any thought, please consider nominating someone.
Before we look at both and the nomination requirements, here’s a thumbnail… Read More
PCIe (peripheral component interconnect express) is an interface standard for connecting high-speed components contained in PCs, MACs and other types of processors. Think graphics, storage arrays, Wi-Fi and the like. This communication standard has become incredibly popular. The first version of the standard was released… Read More
TSMC clarified CAPEX and revenue for 2023 last night at the Annual Shareholders Meeting. Last year TSMC guided up during this meeting but this year they guided down. CAPEX was guided down to the lower end of $36B-$32B. Revenue was guided down from low-single to mid-single digit so maybe down another percent or two. The TSMC Jan… Read More
Join this webinar and see UCIe in action! This webinar presents the SystemVerilog models of a Universal Chiplet Interconnect Express (UCIe) interface, including both the analog circuits in the electrical layer and digital FSMs in the logical layer. The whole physical layer (PHY) model can be efficiently simulated in SystemVerilog,… Read More
The rapid advancement of UWB (Ultra-Wideband) wireless technology has garnered significant attention and interest, thanks to its adoption by leading smartphone brands and its versatile range of applications. Within the automotive industry, UWB has already emerged as the preferred choice for Digital Keys in the premium… Read More
Always-sensing cameras are a relatively new method for users to interact with their smartphones, home appliances, and other consumer devices. Like always-listening audio-based Siri and Alexa, always-sensing cameras enable a seamless, more natural user experience. However, always-sensing camera subsystems require specialized… Read More
-AMAT reported inline resulted helped by trailing edge & China
-Memory remains at very low levels- Foundry remains uninspiring
-China seems to be buying anything they are allowed to buy
-The recovery is too far out & unknown to handicap
Quarter was OK and Guidance also OK
Revenue was $6.63B and EPS of $1.86 versus reduced… Read More
At the recent Synopsys Users Group Meeting (SNUG) I had the honor of leading a panel of experts on the topic of chiplets. One of those panelists was John Lee, Head of Electronics, Semiconductors and Optics at Ansys.
How is the signoff flow evolving and what is being done to help mitigate the growing signoff complexity challenge?
With… Read More
Quantum Computing Technologies and Challenges