TechInsights has been in the semiconductor analysis business for more than 35 years and is THE most trusted source of semiconductor information. TechInsights started as a reverse engineering and IP analysis company but has grown into much more. I remember waiting for the teardown reports before buying electronics to make sure… Read More
Intel Presents the Final Frontier of Transistor Architecture at IEDM
IEDM was buzzing with many presentations about the newest gate-all-around transistor. Both Intel and TSMC announced processes based on nanosheet technology. This significant process innovation allows the fabrication of silicon RibbonFET CMOS devices, which promise to open a new era of transistor scaling, keeping Moore’s… Read More
TSMC Unveils the World’s Most Advanced Logic Technology at IEDM
There was a lot of discussion at IEDM about the coming shift to gate-all-around (GAA) transistor structures. This new device brings many benefits to continue device scaling, both at the monolithic device level as well as for multi-die design. The path to GAA is not simple, there are new material, process and design considerations… Read More
An Invited Talk at IEDM: Intel’s Mr. Transistor Presents The Incredible Shrinking Transistor – Shattering Perceived Barriers and Forging Ahead
IEDM turned 70 last week. This was cause for much celebration in the form of special events. One such event was a special invited paper on Tuesday afternoon from Intel’s Tahir Ghani, or Mr. Transistor as he is known. Tahir has been driving innovation at Intel for a very long time. He is an eyewitness to the incredible impact of the Moore’s… Read More
IEDM Opens with a Big Picture Keynote from TSMC’s Yuh-Jier Mii
The main program for the 70th IEDM opened on Monday morning in San Francisco with an excellent keynote from Dr. Yuh-Jier Mii, Executive Vice President and Co-Chief Operating Officer at TSMC. Dr. Mii joined TSMC in 1994. Since then, he has contributed to the development and manufacturing of advanced CMOS technologies in both fab
PDF Solutions Hosts Executive Conference December 12 on AI’s Power to Transform Semiconductor Design and Manufacturing
PDF Solutions, Inc. will host an AI Executive Conference Thursday, December 12, in San Francisco featuring keynotes, presentations, panels and demonstrations offering insights into the power of AI to transform semiconductor design and manufacturing. The conference immediately follows the 70th Annual IEEE International… Read More
WEBINAR: Elevate Your Analog Layout Design to New Heights
Analog IC layout is a demanding endeavor as it entails conforming to complex layout design rules, interpreting design intentions from the schematics and understanding arcane topics like transistor matching, noise tolerance, parasitics and latch up. These skills are often handed down from one generation to the next, one on … Read More
Silicon Creations is Fueling Next Generation Chips
Next generation semiconductor design puts new stress on traditionally low-key parts of the design process. One example is packaging, which used to be the clean-up spot at the end of the design. Thanks to chiplet-based design, package engineers are now rock stars. Analog design is another one of those disciplines.
Not long ago,… Read More
I will see you at the Substrate Vision Summit in Santa Clara
WIth packaging being one of the top sources of traffic on SemiWiki, I am expecting a big crowd at this event. A semiconductor substrate is a foundational material used in the fabrication of semiconductor devices. Substrates are a critical part of the manufacturing process and directly affect the performance, reliability, and… Read More
Alchip is Paving the Way to Future 3D Design Innovation
At the recent TSMC OIP Ecosystem Forum in Santa Clara, there was an important presentation that laid the groundwork for a great deal of future innovation. Alchip and its IP and EDA partner Synopsys presented Efficient 3D Chiplet Stacking Using TSMC SoIC. The concept of 3D, chiplet-based design certainly isn’t new. SemiWiki maintains… Read More
IEDM 2025 – TSMC 2nm Process Disclosure – How Does it Measure Up?