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HPC Bandwidth Explosion and 1.6T Ecosystem Interop Need
The exponential growth in data bandwidth requirements driven by HPC systems, AI, and ML applications has set the stage for an ever-increasing need for 1.6Tbps Ethernet. As data centers strive to manage vast data transfers with maximum efficiency, the urgency for interoperability… Read More
Hot on the heels of DVConUS 2025, the 35th annual Synopsys User Group (SNUG) Conference made its mark as a defining moment in the evolution of Synopsys—and the broader electronic design automation (EDA) industry. This year’s milestone event not only underscored Synopsys’ continued innovation but also affirmed the vision… Read More
In today’s rapidly evolving digital landscape, the security of electronic systems is of the highest priority. This importance is underscored by technological advancements and increasing regulatory demands. Multi-die designs which integrate multiple dies (also called chiplets) into a single package, introduce … Read More
I’ve watched the EDA industry change the level of design abstraction starting from transistor-level to gate-level, then RTL, and finally using High Level Synthesis (HLS). Another emerging software trend is the use of generative AI to make coding RTL more automated. There’s a new EDA company called Rise Design Automation that… Read More
Generative AI is dramatically changing the compute power that must be delivered by advanced designs. This demand has risen by more than 10,000 times in the past five to six years. This increased demand has impacted the entire SoC design flow. We are now faced with going beyond 1 trillion transistors per chip, and systems now consist… Read More
We have been hearing so much lately about the power of AI and the potential of technologies like agentic AI to address the productivity gap and complexities of semiconductor designs of today and tomorrow. Currently, however, the semiconductor industry has been slow to adopt generative and agentic AI for RTL design code. There… Read More
In part one of this webinar series, Keysight and Modelithics looked at the use of 3D passive vendor component models supporting highly accurate, automated 3D EM-circuit co-simulation of high-frequency RF board designs. Part two continues the exploration of RF board design flows for simulating active circuits on boards, again… Read More
The 2025 Design and Verification Conference (DVCon) was a four-day event packed with insightful discussions, cutting-edge technology showcases, and thought-provoking debates. The conference agenda included a rich mix of tutorial sessions, a keynote presentation, a panel discussion, and an exhibit hall with Electronic… Read More
Traditional RF board design strategies based on circuit simulation worked at lower frequencies and relatively large spacing between components. Higher frequencies and densification dominate RF designs now, where corresponding wider bandwidths and tighter layouts with closely spaced components produce more complex 3D… Read More
There were many announcements and significant demonstrations of new technology at the recent DesignCon. The show celebrated its 30th anniversary this year and it has grown quite a bit. As in past years Samtec had a commanding presence at the show. There will be more about that in a moment, but first I want to focus on a substantial … Read More
AI RTL Generation versus AI RTL Verification