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Synopsys Accelerates First-Pass Silicon Success for Banias Labs’ Networking SoC

Synopsys Accelerates First-Pass Silicon Success for Banias Labs’ Networking SoC
by Kalar Rajendiran on 04-24-2023 at 8:00 am

Image to Depict Optical SoC

Banias Labs is a semiconductor company that develops infrastructure solutions for next-generation communications. Its target market is the high-performance computing infrastructure market including hyperscale data center, networking, AI, optical module, and Ethernet switch SoCs for emerging high-performance computing… Read More


Multi-Die Systems: The Biggest Disruption in Computing for Years

Multi-Die Systems: The Biggest Disruption in Computing for Years
by Daniel Nenni on 04-14-2023 at 6:00 am

SNUG Panel 1

At the recent Synopsys Users Group Meeting (SNUG) I had the honor of leading a panel of experts on the topic of chiplets. The discussion was based on a report published by the MIT Technology Review Insights in cooperation with Synopsys. This is a very comprehensive report (12 pages) that is available online HERE.

Here is the prefaceRead More


Taking the Risk out of Developing Your Own RISC-V Processor with Fast, Architecture-Driven, PPA Optimization

Taking the Risk out of Developing Your Own RISC-V Processor with Fast, Architecture-Driven, PPA Optimization
by Daniel Nenni on 04-12-2023 at 10:00 am

Updated Speaker Slide

Are you developing or thinking about developing your own RISC-V processor? You’re not alone. The use of the RISC-V ISA to develop processors for SoCs is a growing trend. RISC-V offers a lot of flexibility with the ability to customize or create ISA and microarchitectural extensions to differentiate your design no matter your application… Read More


Feeding the Growing Hunger for Bandwidth with High-Speed Ethernet

Feeding the Growing Hunger for Bandwidth with High-Speed Ethernet
by Madhumita Sanyal on 04-10-2023 at 6:00 am

Picture2

The increasing demands for massive amounts of data are driving high-performance computing (HPC) to advance the pace in the High-speed Ethernet world. This in turn, is increasing the levels of complexity when designing networking SoCs like switches, retimers, and pluggable modules. This growth is accelerating the need for … Read More


Takeaways from SNUG 2023

Takeaways from SNUG 2023
by Bernard Murphy on 04-07-2023 at 6:00 am

Aart keynote

Synopsys pulled out all the stops for this event. I attended the first full day, tightly scripted from Aart’s keynote kick off to 1×1 interviews with Synopsys executives to a fireside chat between Sassine Ghazi (President and COO) and Rob Aitken (ex-Fellow at Arm, now Distinguished Architect at Synopsys). That’s a lot of … Read More


Full-Stack, AI-driven EDA Suite for Chipmakers

Full-Stack, AI-driven EDA Suite for Chipmakers
by Kalar Rajendiran on 04-03-2023 at 6:00 am

Synopsys.ai Industry First AI driven Full EDA Suite

Semiconductor technology is among the most complex of technologies and the semiconductor industry is among the most demanding of industries. Yet the ecosystem has delivered incredible advances over the last six decades from which the world has benefitted tremendously. Yes, of course, the markets want that break-neck speed… Read More


Power Delivery Network Analysis in DRAM Design

Power Delivery Network Analysis in DRAM Design
by Daniel Payne on 03-27-2023 at 10:00 am

IR drop plot min

My IC design career started out with DRAM design back in 1978, so I’ve kept an eye on the developments in this area of memory design to note the design challenges, process updates and innovations along the way. Synopsys hosted a memory technology symposium in November 2022, and I had a chance to watch a presentation from SK hynix… Read More


Intel Keynote on Formal a Mind-Stretcher

Intel Keynote on Formal a Mind-Stretcher
by Bernard Murphy on 03-22-2023 at 6:00 am

Intellectual understanding min

Synopsys has posted on the SolvNet site a fascinating talk given by Dr. Theo Drane of Intel Graphics. The topic is datapath equivalency checking. Might sound like just another Synopsys VC Formal DPV endorsement but you should watch it anyway. This is a mind-expanding discussion on the uses of and considerations in formal which … Read More


Multi-Die Systems Key to Next Wave of Systems Innovations

Multi-Die Systems Key to Next Wave of Systems Innovations
by Kalar Rajendiran on 03-07-2023 at 10:00 am

Shift to Multi Die Systems is Happening Now

These days, the term chiplets is referenced everywhere you look, in anything you read and in whatever you hear. Rightly so because the chiplets or die integration wave is taking off. Generally speaking, the tipping point that kicked off the move happened around the 16nm process technology when large monolithic SoCs started facing… Read More


PCIe 6.0: Challenges of Achieving 64GT/s with PAM4 in Lossy, HVM Channels

PCIe 6.0: Challenges of Achieving 64GT/s with PAM4 in Lossy, HVM Channels
by Kalar Rajendiran on 02-14-2023 at 6:00 am

Multi Level Challenges

As the premier high-speed communications and system design conference, DesignCon 2023 offered deep insights from various experts on a number of technical topics. In the area of high-speed communications, PCIe has a played a crucial role over the years in supporting increasingly higher communications speed with every new revision.… Read More