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In a rapidly evolving semiconductor landscape, where AI demands unprecedented computational power and efficiency, Synopsys has deepened its partnership with TSMC to pioneer advancements in AI-driven designs and multi-die systems. Announced during the TSMC OIP Ecosystem Summit last week, this collaboration leverages … Read More
At the AI Infra Summit 2025, Synopsys showed how artificial intelligence has become inseparable from the process of creating advanced silicon. The company’s message was clear: AI is an end-to-end engine that drives every phase of chip development. Three Synopsys leaders illustrated this from distinct vantage points. Godwin… Read More
Synopsys has deepened its collaboration with TSMC certifying the Ansys portfolio of simulation and analysis tools for TSMC’s cutting-edge manufacturing processes including N3C, N3P, N2P, and A16. This partnership empowers chip designers to perform precise final checks on designs, targeting applications in AI acceleration,… Read More
In the fast-paced semiconductor industry Synopsys has redefined EDA with its Synopsys.ai Copilot, a generative AI tool. Since its launch in November 2023, and yes I was at the launch and very skeptical, Copilot has evolved to address the industry’s growing design complexity and projected 15-30% workforce gap by 2030. Let’s… Read More
Introduction: The Historical Roots of Hardware-Assisted Verification
The relentless pace of semiconductor innovation continues to follow an unstoppable trend: the exponential growth of transistor density within a given silicon area. This abundance of available semiconductor fabric has fueled the creativity of design… Read More
The rapid evolution of artificial intelligence (AI) is transforming industries, from autonomous vehicles to data centers, demanding unprecedented computational power and efficiency. As highlighted in Synopsys’ guide, the global AI chip market is projected to reach $383 billion by 2032, growing at a 38% CAGR. This … Read More
The march toward higher-speed networking continues to be guided by the same core objectives as has always been : increase data rates, lower latency, improve reliability, reduce power consumption, and maintain or extend reach while controlling cost. For the next generation of high-speed interconnects, these requirements … Read More
As we all know, the age of multi-die design has arrived. And along with it many new design challenges. There is a lot of material discussing the obstacles to achieve more mainstream access to this design architecture, and some good strategies to conquer those obstacles. Synopsys recently published a webinar that took this discussion… Read More
On July 9, 2025, Vikram Bhatia, head of product management for Synopsys’ cloud platform, and Sashi Obilisetty, his R&D engineering counterpart, presented a DACtv session on Synopsys FlexEDA, as seen in the YouTube video. Drawing from three and a half years of data, the session showcased how this cloud-based, pay-per-use… Read More
AI’s exponential growth is transforming semiconductor design—and memory is now as critical as compute. Multi-die architecture has emerged as the new frontier, and custom High Bandwidth Memory (cHBM) is fast becoming a cornerstone in this evolution. In a panel session at the Synopsys Executive Forum, leaders from AWS, Marvell,… Read More
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