AI’s exponential growth is transforming semiconductor design—and memory is now as critical as compute. Multi-die architecture has emerged as the new frontier, and custom High Bandwidth Memory (cHBM) is fast becoming a cornerstone in this evolution. In a panel session at the Synopsys Executive Forum, leaders from AWS, Marvell,… Read More
Podcast EP299: The Current and Future Capabilities of Static Verification at Synopsys with Rimpy Chugh
Dan is joined by Rimpy Chugh, a Principal Product Manager at Synopsys with 14 years of varied experience in EDA and functional verification. Prior to joining Synopsys, Rimpy held field applications and verification engineering positions at Mentor Graphics, Cadence and HCL Technologies.
Dan explores the expanding role of static… Read More
Design-Technology Co-Optimization (DTCO) Accelerates Market Readiness of Angstrom-Scale Process Technologies
Design-Technology Co-Optimization (DTCO) has been a foundational concept in semiconductor engineering for years. So, when Synopsys referenced DTCO in their April 2025 press release about enabling Angstrom-scale chip designs on Intel’s 18A and 18A-P process technologies, it may have sounded familiar—almost expected. … Read More
SNUG 2025: A Watershed Moment for EDA – Part 2
At this year’s SNUG (Synopsys Users Group) conference, Richard Ho, Head of Hardware, OpenAI, delivered the second keynote, titled “Scaling Compute for the Age of Intelligence.” In his presentation, Richard guided the audience through the transformative trends and implications of the intelligence era now unfolding before… Read More
Automotive Functional Safety (FuSa) Challenges
Modern vehicles have become quite sophisticated, like a supercomputer on wheels. They integrate a vast number of electronic components, including thousands of chips, to deliver advanced functionalities ranging from infotainment to critical safety systems. This increasing complexity necessitates a robust approach to … Read More
Scaling AI Infrastructure with Next-Gen Interconnects
At the recent IPSoC Conference in Silicon Valley, Aparna Tarde gave a talk on the importance of Next-Gen Interconnects to scale AI infrastructure. Aparna is a Sr. Technical Product Manager at Synopsys. A synthesis of the salient points from her talk follows.
The rapid advancement of artificial intelligence (AI) is fundamentally… Read More
The Growing Importance of PVT Monitoring for Silicon Lifecycle Management
In an era defined by complex chip architectures, ever-shrinking technology nodes and very demanding applications, Silicon Lifecycle Management (SLM) has become a foundational strategy for optimizing performance, reliability, and efficiency across the lifespan of a semiconductor device. Central to effective SLM are Process,… Read More
Achieving Seamless 1.6 Tbps Interoperability for High BW HPC AI/ML SoCs: A Technical Webinar with Samtec and Synopsys
HPC Bandwidth Explosion and 1.6T Ecosystem Interop Need
The exponential growth in data bandwidth requirements driven by HPC systems, AI, and ML applications has set the stage for an ever-increasing need for 1.6Tbps Ethernet. As data centers strive to manage vast data transfers with maximum efficiency, the urgency for interoperability… Read More
SNUG 2025: A Watershed Moment for EDA – Part 1
Hot on the heels of DVConUS 2025, the 35th annual Synopsys User Group (SNUG) Conference made its mark as a defining moment in the evolution of Synopsys—and the broader electronic design automation (EDA) industry. This year’s milestone event not only underscored Synopsys’ continued innovation but also affirmed the vision… Read More
Synopsys Webinar: The Importance of Security in Multi-Die Designs – Navigating the Complex Landscape
In today’s rapidly evolving digital landscape, the security of electronic systems is of the highest priority. This importance is underscored by technological advancements and increasing regulatory demands. Multi-die designs which integrate multiple dies (also called chiplets) into a single package, introduce … Read More