There is ample evidence that technologies such as high-performance computing, next-generation servers, and AI accelerators are fueling unprecedented demands in data processing speed with massive data storage, lower latency, and lower power. Heterogeneous system integration, more commonly called 2.5 and 3D IC design, … Read More
Enhancing System Reliability with Digital Twins and Silicon Lifecycle Management (SLM)
As industries become more reliant on advanced technologies, the importance of ensuring the reliability and longevity of critical systems grows. Failures in components, whether in autonomous vehicles, high performance computing (HPC), healthcare devices, or industrial automation, can have far-reaching consequences.… Read More
A Master Class with Ansys and Synopsys, The Latest Advances in Multi-Die Design
2.5D and 3D multi-die design is rapidly moving into the mainstream for many applications. HPC, GPU, mobile, and AI/ML are application areas that have seen real benefits. The concept of “mix/match” for chips and chiplets to form a complex system sounds deceptively simple. In fact, the implementation and analysis techniques required… Read More
The Immensity of Software Development and the Challenges of Debugging Series (Part 4 of 4)
The Impact of AI on Software and Hardware Development
Part 4 of this series analyzes how AI algorithmic processing is transforming software structures and significantly modifying processing hardware. It explores the marginalization of the traditional CPU architecture and demonstrates how software is increasingly dominating… Read More
Synopsys-Ansys 2.5D/3D Multi-Die Design Update: Learning from the Early Adopters
The demand for high-performance computing (HPC), data centers, and AI-driven applications has fueled the rise of 2.5D and 3D multi-die designs, offering superior performance, power efficiency, and packaging density. However, these benefits come with myriads of challenges, such as multi-physics, which need to be addressed.… Read More
The Immensity of Software Development and the Challenges of Debugging (Part 3 of 4)
Part 3 of this 4-part series analyzes methods and tools involved in debugging software at different layers of the software stack.
Software debugging involves identifying and resolving issues ranging from functional misbehaviors to crashes. The essential requirement for validating software programs is the ability to monitor… Read More
Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design
Synopsys made significant announcements during the recent TSMC OIP Ecosystem Forum, showcasing a range of cutting-edge solutions designed to address the growing complexities in semiconductor design. With a strong emphasis on enabling next-generation chip architectures, Synopsys introduced both new technologies and … Read More
The Immensity of Software Development and the Challenges of Debugging Series (Part 2 of 4)
Part 2 of this 4-part series reviews the role of virtual prototypes as stand-alone tools and their use in hybrid emulation for early software validation, a practice known as the “shift-left” methodology. It assesses the differences among these approaches, focusing on their pros and cons.
Synopsys Powers World’s Fastest UCIe-Based Multi-Die Designs with New IP Operating at 40 Gbps
As the demand for higher performance computing solutions grows, so does the need for faster, more efficient data communication between components in complex multi-die system-on-chip (SoC) designs. In response to these needs, Synopsys has introduced the world’s fastest UCIe-based IP solution, capable of operating at a groundbreaking… Read More
Synopsys IP Processor Summit 2024
Now that live events are filling up there are even more live events especially here in Silicon Valley. Synopsys, the #1 full IP provider, will host a processor summit here in Santa Clara next month. Given the popularity of anything RISC-V, I would expect this event to be very well attended so be sure and register in advance.
The networking… Read More