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Introduction
Cadence and ClioSoft made a webinar recently and I’ll summarize what I learned from it.
What’s New from Cadence in Virtuoso 6.1.5
- Back2Basics (28nm rule integration, Skill improved with object-oriented, OASIS support, HTML Publisher, Waveform re-written for better Analog support, smaller Waveform
…
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Introduction
3D field solvers produce the most accurate netlists of RC values of your IC layout that can then be used in SPICE circuit simulators however most of these solvers produce a flat netlist which tends to simulate rather slowly. Thankfully several years ago the first hierarchical SPICE tools were offered by Nassda (HSIM… Read More
Electro-static discharge (ESD) has been a problem since the beginning of IC production. Chips function on power supplies of up to a few volts (depending on the era) whereas ESD voltages are measured in the thousands of volts. When you reach out for your car door handle and a spark jumps across, that is ESD. If you were touching a chip… Read More
Reading the title you guessed it right, Mentor Graphics has three new board members today from the slate offered by billionaire activist Carl Icahn:
- José Maria Alapont, chief executive of the auto parts maker Federal-Mogul
- Gary Meyers, a director of the chip maker Exar
- David Schechter, an executive at Mr. Icahn’s investment firm
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If you just casually peruse most marketing presentations by EDA companies, you’d come to the conclusion most SoCs are designed from scratch, wrestlilng the monster to the ground with bare hands. But the reality is that most SoCs consist of perhaps 90% IP blocks (many of them memories). That still leaves the remaining 10% … Read More
Hard to believe a year has gone by since the big announcement of the Cadence Blueprint toBattle ‘Profitability Gap’; Counters Semiconductor Industry’s Greatest Threat! Having spent more time on it that I should have, here is my opinion on EDA360 on its first anniversary.
Richard Georing did a very nice anniversary piece “Ten Key… Read More
As the complexity of the chip-package-system (CPS) interactions has increased, the tradeoffs in doing a power and noise analysis has had to gradually increase. As is so often the case in semiconductor designs, issues first arise as second-order effects that can largely be ignored but each process node makes the problem worse … Read More
Apache at DACby Paul McLellan on 05-04-2011 at 2:38 pmCategories: Ansys, Inc., EDA
DAC is less than a month away, June 6-8th for the tradeshow, longer depending on what other events you might also be attending. Apache is in booth 2448 (marked in red on the DAC floorplan map.
Many of the presentations at the Apache booth will be customers (such as ARM, Xilinx, ST Ericsson, GlobalFoundries and TSMC) discussing various… Read More
Introduction
Today Cadence announced at the Embedded Systems Conference something of interest to systems designers.
What’s New?
The Rapid Prototyping Platform and Virtual System Platform are what’s new, and they intend to enable and automate concurrent hardware and software development. I can remember Mentor… Read More
Introduction
IC designs go through a layout process and then a verification of that layout to determine if the layout layer width and spacing rules conform to a set of manufacturing design rules. Adhering to the layout rules will ensure that your chip has acceptable yields.
At the 28nm node a typical DRC (Design Rule Check) deck will… Read More
Alphawave Semi is in Play!