The rapid advancement of technology, including generative AI, IoT, and autonomous vehicles, is revolutionizing industries and enhancing efficiency. At the same time, such advances also generate huge amounts of data to be transmitted and processed to make sense and provide value to consumers and society as a whole. In essence,… Read More
MZ Technologies Enables Multi-Die Design with GENIO
MZ Technologies is a unique company that enables multi-die design by providing critical planning and analysis tools that sit above the traditional EDA design flow. Chip and package design tools are good at what they do. Given a set of constraints, they will deliver a good result. The question is, what is the right set of constraints? … Read More
Unleash the Power: NVIDIA GPUs, Ansys Simulation
In the realm of engineering simulations, the demand for faster, more accurate solutions to complex multiphysics challenges is ever-growing.
Simulation is a vital tool for engineers to design, test, and optimize complex systems and products. It helps engineers reduce costs, improve quality, and accelerate innovation. However,… Read More
2024 Outlook with Elad Alon of Blue Cheetah Analog Design
We have been working with Blue Cheetah Analog Design for three years now with great success. With new process nodes coming faster than ever before and with chiplets being pushed to the forefront of technology, the die-to-die interconnect traffic on SemiWiki has never been greater and chiplets is one of our top search terms.
Tell… Read More
Cadence Debuts Celsius Studio for In-Design Thermal Optimization
Continuing the multiphysics theme, I talked recently with Melika Roshandell (Product Management Director at Cadence) on the continuing convergence between MCAD and ECAD. You should know first that Melika has a PhD in mechanical engineering and an extensive background in thermal engineering at Broadcom and Qualcomm, all very… Read More
Chiplet ecosystems enable multi-vendor designs
Chiplets dominate semiconductor industry conversations right now – and after the recent Chiplet Summit, we expect the intensity to go up a couple of notches. One company name often heard is Blue Cheetah, and we had the opportunity to sit down with them recently to discuss their views and their just-announced design win at Tenstorrent.… Read More
Synopsys and Alchip Accelerate IO & Memory Chiplet Design for Multi-Die Systems
Multi-die system design is clearly gaining momentum. Part of this momentum focuses on chiplets and a chiplet ecosystem. A “building block” approach for design will work better if there is a way to get verified, quality building blocks in the form of chiplets. The recent Chiplet Summit became an epicenter for this topic. The conference… Read More
Moderating Our Open Chiplet Enthusiasm. A NoC Perspective
I recently talked with Frank Schirrmeister (Solutions & Business Development, Arteris) on the state of progress to the open chiplet ideal. You know – where a multi-die system in package can be assembled with UCIe (or other) connections seamlessly connecting data flows between dies. If artificial general intelligence and… Read More
ESD Alliance and Silicon Assurance Host Industry Panel Discussion on Chiplet Security
Security threats are a hot topic of discussion today as they can have a profound impact on the electronic infrastructure and devices that are the backbone of our global economies. It is also clear that these threats can be introduced during the design of the very devices that we rely on in our daily lives.
Chiplet-based design is … Read More
What ChatGPT has to say about the Chiplet Summit
Quite a few of the articles I now see about the semiconductor industry use AI. It is not hard to tell, especially for someone like myself, a 40 year experienced semiconductor professional who also writes. In the last 13 years (yes SemiWiki is now a teenager) we have published 9,058 blogs. SemiWiki was the first of now many semiconductor… Read More
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