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Chiplets Open Pandora’s Box

Chiplets Open Pandora’s Box
by Daniel Nenni on 01-31-2024 at 6:00 am

Chiplet

Chiplets have simplified one area of design but opened pandora’s box on another front. The simulation complexity of each chiplet is lower but now the chiplet-to-chiplet interconnect has become complex. Folks are experimenting with different interconnect protocols, variations of UCIe, modifying UCIe settings, interface… Read More


Chiplet Summit 2024 Preview

Chiplet Summit 2024 Preview
by Daniel Nenni on 01-22-2024 at 10:00 am

Chiplet Summit 2024 Logo

The second annual Chiplet Summit is coming up and if it is anything like the first one it will not disappoint. Chiplets are a disruptive semiconductor technology that are already being used by the top semiconductor companies like Intel, Nvidia, AMD and others. These companies design their own chiplets so they are blazing the trail… Read More


How Disruptive will Chiplets be for Intel and TSMC?

How Disruptive will Chiplets be for Intel and TSMC?
by Daniel Nenni on 01-15-2024 at 10:00 am

UCIe Consortium

Chiplets (die stacking) is not new. The origins are deeply rooted in the semiconductor industry and represent a modular approach to designing and manufacturing integrated circuits. The concept of chiplets has been energized as a response to the recent challenges posed by the increasing complexity of semiconductor design. … Read More


Synopsys Geared for Next Era’s Opportunity and Growth

Synopsys Geared for Next Era’s Opportunity and Growth
by Kalar Rajendiran on 01-11-2024 at 6:00 am

SassineGhazi

As semiconductor industry folks know, Synopsys is a behemoth of a company. At $5.84B in FY2023 revenue (FY Nov-Oct), approximately 20,000 employees and a market cap of about $74B, it leads the silicon-to-systems design solutions space within the industry. From humble beginnings in 1986 as a disruptive startup, the company has… Read More


2024 Outlook with Matt Burns of Samtec

2024 Outlook with Matt Burns of Samtec
by Daniel Nenni on 01-04-2024 at 6:00 am

Matt Burns Samtec

Matt develops go-to-market strategies for Samtec’s Silicon to Silicon solutions. Over the course of 20+ years, he has been a leader in design, technical sales and marketing in the telecommunications, medical and electronic components industries. It has been an honor working with Matt and his team for the last 3 years and I value… Read More


2024 Big Race is TSMC N2 and Intel 18A

2024 Big Race is TSMC N2 and Intel 18A
by Daniel Nenni on 01-01-2024 at 6:00 am

Intel PowerVia backside power delivery

There is a lot being said about Intel getting the lead back from TSMC with their 18A process. Like anything else in the semiconductor industry there is much more here than meets the eye, absolutely.

From the surface, TSMC has a massive ecosystem and is in the lead as far as process technologies and foundry design starts but Intel is … Read More


Will Chiplet Adoption Mimic IP Adoption?

Will Chiplet Adoption Mimic IP Adoption?
by Eric Esteve on 12-28-2023 at 6:00 am

Adoption theory

If we look at the semiconductor industry expansion during the last 25 years, adoption of design IP in every application appears to be one of the major factors of success, with silicon technology incredible development by a x100 factor, from 250nm in 2018 to 3nm (if not 2nm) in 2023. We foresee the move to chiplet-based architecture… Read More


Unleashing the 1.6T Ecosystem: Alphawave Semi’s 200G Interconnect Technologies for Powering AI Data Infrastructure

Unleashing the 1.6T Ecosystem: Alphawave Semi’s 200G Interconnect Technologies for Powering AI Data Infrastructure
by Kalar Rajendiran on 12-19-2023 at 6:00 am

Alphawave Semi 224G SerDes 1st TestChip

In the rapidly evolving landscape of artificial intelligence (AI) and data-intensive applications, the demand for high-performance interconnect technologies has never been more critical. Even the 100G Interconnect is already not fast enough for infrastructure applications. AI applications, with their massive datasets… Read More


When Will Structured Assembly Cross the Chasm?

When Will Structured Assembly Cross the Chasm?
by Bernard Murphy on 12-13-2023 at 6:00 am

Trends in assembly min

First, a quick definition. By “structured assembly,” I mean the collection of tools to support IP packaging with standardized interfaces, SoC integration based on those IPs together with bus fabric and other connectivity hookups, register definition and management in support of hardware/software interface definition, Read More


UCIe InterOp Testchip Unleashes Growth of Open Chiplet Ecosystem

UCIe InterOp Testchip Unleashes Growth of Open Chiplet Ecosystem
by Kalar Rajendiran on 12-11-2023 at 6:00 am

Pike Creek UCIe Test chip

Intel recently made headlines when CEO Pat Gelsinger unveiled the world’s first UCIe interoperability test chip demo at Innovation 2023. The test chip built using advanced packaging technology is codenamed Pike Creek and is used to demonstrate interoperability across chiplets designed by Intel and Synopsys. More details … Read More