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The rapid evolution of semiconductor design has elevated chiplets from a niche concept to a foundational strategy for next-generation computing. At the upcoming Chiplet Summit – February 17–19, 2026 Santa Clara Convention Center. Silicon Catalyst will play a central role in shaping this conversation, highlighting… Read More
The Design Automation Chips to Systems Conference is the preeminent international event for professionals involved in electronic design, system architecture, and EDA. Formerly known simply as the Design Automation Conference or DAC has evolved over more than six decades into a forward-looking forum that spans the entire… Read More
AI, hyperscale data centers, and data-intensive workloads are driving unprecedented demands for performance, bandwidth, and energy efficiency. As the economic returns of traditional transistor scaling diminish, advanced IC packaging and heterogeneous integration have become the primary levers for system-level scaling.… Read More
As semiconductor design pushes into increasingly complex territory, driven by Ai, ML, HPC, and heterogeneous system architectures, designers are challenged to balance performance, power, and time-to-market pressures. In this landscape, network-on-chip (NoC) architectures have emerged as a foundational building block… Read More
Tell us a little bit about yourself and your company.
I’m Nilesh Kamdar, General Manager of the Keysight EDA business unit. Keysight is an S&P 500 company that provides design, emulation, and test solutions to help engineers develop and deploy faster with less risk. On the EDA side, we focus on RFMW, high-speed digital,… Read More
Daniel is joined by John Ferguson, senior director of product management for the Calibre products in the 3DIC space at Siemens EDA. He manages the vision and product offerings in the Calibre domain for 3DIC design solutions.
Dan explores the challenges of 3DIC and chiplet-based design with John, who describes the broad range of… Read More
In a significant move aimed at empowering semiconductor and systems-design engineers, MZ Technologies has announced the launch of a new video series focused on advanced packaging design. This initiative comes at a time when the semiconductor industry is rapidly shifting toward multi-die, 2.5D/3D integration, heterogeneous… Read More
Tarun Verma, Managing Partner of Silicon Catalyst, delivered a keynote at Verification Futures Austin titled “Revitalizing Semiconductor StartUps.” Drawing from his role in the world’s only accelerator focused on the global semiconductor industry, Tarun outlined the sector’s resurgence, persistent… Read More
Dr. Zou is one of the industry’s leading experts in power delivery for high performance processors. Before founding PowerLattice, he held technical leadership roles at Qualcomm/NUVIA, Huawei and Intel, where he led the multidisciplinary teams advancing integrated voltage regulator technologies across magnetic materials,… Read More
By Todd Burkholder and Per Viklund, Siemens EDA
The landscape of advanced IC packaging is rapidly evolving, driven by the imperative to support innovation on increasingly complex and high-capacity products. The broad industry trend toward heterogeneous integration of diverse die and chiplets into advanced semiconductor… Read More
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