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Chiplet
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Synopsys Webinar: The Importance of Security in Multi-Die Designs – Navigating the Complex Landscape

Synopsys Webinar: The Importance of Security in Multi-Die Designs – Navigating the Complex Landscape
by Daniel Nenni on 04-11-2025 at 6:00 am
Categories: 3D IC, Chiplet, EDA, Events, Synopsys

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In today’s rapidly evolving digital landscape, the security of electronic systems is of the highest priority. This importance is underscored by technological advancements and increasing regulatory demands. Multi-die designs which integrate multiple dies (also called chiplets) into a single package, introduce … Read More

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Synopsys Executive Forum: Driving Silicon and Systems Engineering Innovation

Synopsys Executive Forum: Driving Silicon and Systems Engineering Innovation
by Kalar Rajendiran on 04-09-2025 at 10:00 am
Categories: 3D IC, AI, Automotive, Chiplet, EDA, IP, Quantum Computing, Synopsys

Sassine Keynote (with Satya)

The annual SNUG (Synopsys Users Group) conference, now in its 35th year, once again brought together key stakeholders to showcase accomplishments, discuss challenges, and explore opportunities within the semiconductor and electronics industry. With approximately 2,500 attendees, SNUG 2025 served as a dynamic hub for collaboration… Read More

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Compute and Communications Perspectives on Automotive Trends

Compute and Communications Perspectives on Automotive Trends
by Bernard Murphy on 03-19-2025 at 6:00 am
Categories: AI, Cadence, Chiplet, EDA

Automotive Growth Pillars min

Automotive electronics is a fast-moving space, especially around sensing and distilling intelligence from that sensing. This serves three main pillars: autonomy, electrification and advances in the car cockpit. Autonomy at multiple levels remains an important goal and continues to advance, technically and geographically.… Read More

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Powering the Future: How Engineered Substrates and Material Innovation Drive the Semiconductor Revolution

Powering the Future: How Engineered Substrates and Material Innovation Drive the Semiconductor Revolution
by Kalar Rajendiran on 03-03-2025 at 6:00 am
Categories: 3D IC, 5G, AI, Automotive, Chiplet, FD-SOI, Foundries, Lithography, Mobile, Soitec

Substrate Vision Summit Engineered Substrate Panel Session

Engineered substrate technology is driving an evolution within the semiconductor industry. As Moore’s Law reaches its limits, the focus is shifting from traditional planar wafer scaling to innovative material engineering and 3D integration. Companies like Soitec, Intel and Samsung are pioneering this transition, unlocking… Read More

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2025 Outlook with Dr. Rui Tang of MSquare Technology

2025 Outlook with Dr. Rui Tang of MSquare Technology
by Daniel Nenni on 02-25-2025 at 10:00 am
Categories: Chiplet, IP

Tang Rui 18 10 04 113961

Tell us a little bit about yourself and your company. 

I am Rui Tang, co-founder and VP of MSquare Technology. With a Ph.D. in Computer Engineering from Northeastern University and a master’s degree in management science and engineering from Stanford University, I bring over 23 years of experience in the IC industry. Prior to MSquare,… Read More

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Synopsys Expands Hardware-Assisted Verification Portfolio to Address Growing Chip Complexity

Synopsys Expands Hardware-Assisted Verification Portfolio to Address Growing Chip Complexity
by Kalar Rajendiran on 02-25-2025 at 6:00 am
Categories: 3D IC, Chiplet, EDA, Emulation, FPGA, IP, Prototyping, Synopsys

Synopsys HAV Product Family

Last week, Synopsys announced an expansion of their Hardware-Assisted Verification (HAV) portfolio to accelerate semiconductor design innovations. These advancements are designed to meet the increasing demands of semiconductor complexity, enabling faster and more efficient verification across software and hardware… Read More

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Harnessing Modular Vector Processing for Scalable, Power-Efficient AI Acceleration

Harnessing Modular Vector Processing for Scalable, Power-Efficient AI Acceleration
by Jonah McLeod on 02-24-2025 at 6:00 am
Categories: AI, Chiplet, RISC-V

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The dominance of GPUs in AI workloads has long been driven by their ability to handle massive parallelism, but this advantage comes at the cost of high-power consumption and architectural rigidity. A new approach, leveraging a chiplet-based RISC-V vector processor, offers an alternative that balances performance, efficiency,… Read More

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Outlook 2025 with David Hwang of Alchip

Outlook 2025 with David Hwang of Alchip
by Daniel Nenni on 02-17-2025 at 10:00 am
Categories: 3D IC, AI, Alchip, Chiplet, Semiconductor Services

Dave Huang

Dave Hwang joined Alchip in 2021 as General Manager of Alchip’s North America Business Unit.  He also serves as Senior Vice President, Business Development.  Prior to join Alchip, Dave served as Vice President, Worldwide Sales and Marketing for Global Unichip and in a variety of management and technical roles at TSMC.  He holds… Read More

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2025 Outlook Anna Fontanelli MZ Technologies

2025 Outlook Anna Fontanelli MZ Technologies
by Daniel Nenni on 02-12-2025 at 10:00 am
Categories: 3D IC, Chiplet, EDA, MZ Technologies

ANNA

Anna Fontanelli, CEO of MZ Technologies, is a silicon executive with more than 35 years of expertise in managing complex R&D organizations/programs to give birth to innovative EDA technologies. Strong communication skills and proven ability to lead distributed, cross functional teams in international environments.… Read More

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Embracing the Chiplet Journey: The Shift to Chiplet-Based Architectures

Embracing the Chiplet Journey: The Shift to Chiplet-Based Architectures
by Kalar Rajendiran on 02-12-2025 at 6:00 am
Categories: 3D IC, Automotive, Cadence, Chiplet, EDA, IP

Chiplets A New Abstraction Layer

The semiconductor industry is facing a paradigm shift. Traditional scaling, once driven by Moore’s Law, is slowing down. For years, moving to smaller process nodes led to lower transistor costs and better performance. However, scaling from node to node now offers fewer benefits as wafer costs rise much more than the historical… Read More