The semiconductor industry is experiencing a significant transformation with the advent of chiplet design, a modular approach that breaks down complex chips into smaller, functional blocks called chiplets. A chiplet-based design approach offers numerous advantages, such as improved performance, reduced development … Read More
Artificial Intelligence
CEO Interview: Yogish Kode of Glide Systems
Yogish Kode is a senior solutions architect with substantial experience in product lifecycle management for over 20 years. His focus has been on semiconductor PLM and IP management. Prior to founding Glide Systems, he was a global solutions architect at Dassault Systèmes, an IT lead at Xilinx, and a senior programmer/analyst… Read More
The Future of Logic Equivalence Checking
Logic equivalence checking (LEC) is an automated process to verify that modified versions of a design evolving through implementation remain logically equivalent to the functionally signed-off RTL. This becomes important when accounting for retiming optimizations and for necessary implementation-stage ECOs which must… Read More
Mitigating AI Data Bottlenecks with PCIe 7.0
During a recent LinkedIn webcast, Dr. Ian Cutress, Chief Analyst at More than Moore and Host at TechTechPotato, and Priyank Shukla, Principal Product Manager at Synopsys, shared their thoughts regarding the industry drivers, design considerations, and critical advancements in compute interconnects enabling data center… Read More
Theorem Proving for Multipliers. Innovation in Verification
An explosion in multiplier types/combinations lacking well-established C reference models for equivalence checking is prompting a closer look at theorem proving methods for verification. Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO and now Silvaco… Read More
TSMC’s Business Update and Launch of a New Strategy
What looks like a modest market expansion strategy is all but modest.
Insights into the Semiconductor Industry and the Semiconductor Supply Chain.
As usual, when TSMC reports, the Semiconductor industry gets a spray of insights that help understand what goes on in other areas of the industry. This time, TSMC gave more insight … Read More
Alphawave Semi Tapes Out Industry-First, Multi-Protocol I/O Connectivity Chiplet for HPC and AI Infrastructure
In the rapidly evolving landscape of high-performance computing (HPC) and artificial intelligence (AI), the demand for increased processing power, efficiency, and scalability is ever-growing. Traditional monolithic chip designs are increasingly unable to keep pace with these demands, leading to the emergence of chiplets… Read More
Empowering AI, Hyperscale and Data Center Connectivity with PAM4 SerDes Technology
The rapid expansion of data-intensive applications, such as artificial intelligence (AI), high-performance computing (HPC), and 5G, necessitates connectivity solutions capable of handling massive amounts of data with high efficiency and reliability. The advent of 224G/112G Serializer/Deserializer (SerDes) technology,… Read More
A New Class of Accelerator Debuts
I generally like to start my blogs with an application-centric viewpoint; what end-application is going to become faster, lower power or whatever because of this innovation? But sometimes an announcement defies such an easy classification because it is broadly useful. That’s the case for a recent release from Quadric, based… Read More
CEO Interview: Orr Danon of Hailo
Orr Danon is the CEO and Co-Founder of Hailo. Prior to founding Hailo, Orr spent over a decade working at a leading IDF Technological Unit. During this time he led some of the largest and most complex interdisciplinary projects in the Israeli intelligence community. For the projects he developed and managed, Danon received the … Read More
Flynn Was Right: How a 2003 Warning Foretold Today’s Architectural Pivot