WP_Term Object
(
[term_id] => 23705
[name] => 3D IC
[slug] => 3dic
[term_group] => 0
[term_taxonomy_id] => 23705
[taxonomy] => category
[description] =>
[parent] => 0
[count] => 51
[filter] => raw
[cat_ID] => 23705
[category_count] => 51
[category_description] =>
[cat_name] => 3D IC
[category_nicename] => 3dic
[category_parent] => 0
[is_post] =>
)
In the 3D-IC (Three-dimensional integrated circuit) chip design method, chiplets or wafers are stacked vertically on top of each other and are connected using Through Silicon Vias (TSVs) or hybrid bonding.
The 2.5D-IC design method places multiple chiplets alongside each other on a silicon interposer. Microbumps and interconnect… Read More
IEDM 2025 – TSMC 2nm Process Disclosure – How Does it Measure Up?