Soitec is a unique company that is at the center of major changes in our industry. Technology megatrends are fueling massive demand for semiconductors and this has increased the adoption of engineered substrates. As a global leader in the development of engineered substrates, Soitec is a company to watch. While this technology… Read More
Author: Mike Gianfagna
Soitec Delivers the Foundation for Next-Generation Interconnects
Semidynamics Shakes Up Embedded World 2024 with All-In-One AI IP to Power Nextgen AI Chips
Semidynamics takes a non-traditional approach to design enablement. Not long ago, the company’s Founder and CEO, Roger Espasa unveiled extreme customization at the RISC-V Summit. That announcement focused on a RISC-V Tensor Unit designed for ultra-fast AI solutions. Recently, at Embedded World 2024 the company took this … Read More
Intel is Bringing AI Everywhere
On April 8 and 9 Intel held its Intel Vision event in Phoenix Arizona. This is Intel’s premier event for business and technology executive leaders to come together and learn about the latest industry trends and solutions in advancements from client, to edge, to data center and cloud. The theme of this year’s event was Bringing AI … Read More
sureCore Brings 16nm FinFET to Mainstream Use With a New Memory Compiler
Semiconductor processes can have a rather long and interesting life cycle. At first, a new process defines the leading edge. This is cost-no-object territory, where performance is king. The process is new, the equipment to make it is expensive, and its use is reserved for those that have a market (and budget) big enough to justify… Read More
yieldHUB Improves Semiconductor Product Quality for All
We all know that building advanced semiconductors is a team sport. Many design parameters and processes must come together in a predictable, accurate and well-orchestrated way to achieve success. The players are diverse and cover the globe. Assembling all the information required to optimize the project in one place, with the… Read More
MZ Technologies Enables Multi-Die Design with GENIO
MZ Technologies is a unique company that enables multi-die design by providing critical planning and analysis tools that sit above the traditional EDA design flow. Chip and package design tools are good at what they do. Given a set of constraints, they will deliver a good result. The question is, what is the right set of constraints? … Read More
Weebit Nano Brings ReRAM Benefits to the Automotive Market
Non-volatile memory (NVM) is a critical building block for most electronic systems. The most popular NVM technology has traditionally been flash. As a discrete part, the technology can be delivered in various form factors. For embedded applications flash presents scaling challenges, however. A new NVM technology developed… Read More
sureCore Enables AI with Ultra-Low Power Memory IP
We all know that AI is becoming pervasive in a wide array of products to make them smarter, safer and feature rich. Just look at the announcements from the recent CES show in Las Vegas to see some examples. These AI workloads demand a lot of compute power. Fueling this trend is the need for significant arrays of embedded memory on chip,… Read More
Synopsys Enhances PPA with Backside Routing
Complexity and density conspire to make power delivery very difficult for advanced SoCs. Signal integrity, power integrity, reliability and heat can seem to present unsolvable problems when it comes to efficient power management. There is just not enough room to get it all done with the routing layers available on the top side… Read More
Can Correlation Between Simulation and Measurement be Achieved for Advanced Designs?
“What you simulate is what you get.” This is the holy grail of many forms of system design. Achieving a high level of accuracy between predicted and actual performance can cut design time way down, resulting in better cost margins, time to market and overall success rates. Achieving a high degree of confidence in predicted performance… Read More
Intel’s IDM 2.0