Multi-die system design is clearly gaining momentum. Part of this momentum focuses on chiplets and a chiplet ecosystem. A “building block” approach for design will work better if there is a way to get verified, quality building blocks in the form of chiplets. The recent Chiplet Summit became an epicenter for this topic. The conference… Read More
Author: Mike Gianfagna
Synopsys and Alchip Accelerate IO & Memory Chiplet Design for Multi-Die Systems
proteanTecs Addresses Growing Power Consumption Challenge with New Power Reduction Solution
proteanTecs is a unique company, delivering electronics visibility from within. Its core mission is to enable the electronics industry to continue to scale. The company achieves this goal by first embedding on-chip monitors, called Agents, during the design process to generate deep data on the chip’s profiling, health, and… Read More
A Rare Offer from The SHD Group – A Complimentary Look at the RISC-V Market
The web is a wonderful place to find information on almost any topic. While top-level information is easy to find, a deep dive often requires the services of a market research firm. These organizations specialize in “going deep” on many technology topics, offering insights not available with a Google search. And these services… Read More
How Codasip Unleashed CHERI and Created a Paradigm Shift for Secured Innovation
At the recent RISC-V Summit, Dr. Ron Black, CEO of Codasip unveiled a significant new capability to create a more secure environment for innovation. Rather than re-writing trillions of lines of code to solve the security problem, Ron described a much more practical approach. One that brought a research topic into mainstream deployment.… Read More
Analog Bits Enables the Migration to 3nm and Beyond
The world is abuzz with 3nm and 2nm technology availability. These processes offer the opportunity to pack far more on a single die than ever before. The complex digital systems contemplated will bring new AI algorithms to life and much more. But there is another side of the technology migration story. With all that digital processing… Read More
Achieving a Unified Electrical/Mechanical PCB Design Flow – The Siemens Digital Industries Software View
Let’s face it, designs are getting harder, much harder. Gone are the days when the electrical and mechanical design of a system occurred separately. Maybe ten years ago this practice was acceptable. Once the electrical design was completed (either the chip or the board) the parameters associated with the design were then given… Read More
SPIE 2023 Buzz – Siemens Aims to Break Down Innovation Barriers by Extending Design Technology Co-Optimization
Preventing the propagation of systematic defects in today’s semiconductor design-to-fabrication process requires many validation, analysis and optimization steps. Tools involved in this process can include design rule checking (DRC), optical proximity correction (OPC) verification, mask writing and wafer printing… Read More
Giving Back – The Story of One Silicon Valley Veteran’s Journey
The concept of giving back is something many of us have contemplated. Giving back to the community or to support a particular cause. How to respond to those inquiries from our alma mater is another example. These conversations typically focus on giving money to provide needed support. As engineers, we are surrounded by a massive… Read More
Seven Silicon Catalyst Companies to Exhibit at CES, the Most Powerful Tech Event in the World
According to its website, CES® Is the global stage for innovation, delivering the most powerful tech event in the world — the proving ground for breakthrough technologies and global innovators. Owned and produced by the Consumer Technology Association (CTA)®, it is the only trade show that showcases the entire tech landscape… Read More
RISC-V Summit Buzz – Launchpad Showcase Highlights Smaller Company Innovation
One of the goals of the recent RISC-V Summit was to demonstrate that the RISC-V movement is real – major programs by large organizations committing to development around the RISC-V ISA. I would say this goal was achieved. Many high-profile announcements and aggressive, new architectures based on RISC-V were presented. On day … Read More
Unlocking the cloud: A new era for post-tapeout flow for semiconductor manufacturing