This year, DAC will be buzzing about AI from every direction. The debate of build vs. buy will also be a popular topic. And the debate of who owns the intellectual property embodied in chip designs and how to control it will also get a significant amount of airtime. These are all interesting and compelling discussion points. It turns… Read More
Author: Mike Gianfagna
Must-See DAC Panel – Build vs Buy: Who Owns the Intelligence Behind Tomorrow’s Chips?
Agentrys Weighs in on LLM Benchmarking for Chip Design at DAC 2026
Si2 is conducting quite a few sessions at DAC this year covering everything from power model standards to agentic AI. There is one session that is a bit different, focusing on LLM benchmarking. Since AI is popping up everywhere, the ability to accurately assess and measure the quality of new models becomes more important. That’s… Read More
Webinar: Caspia Shows You How to Fix Security Flaws Before It’s Too Late
Chip-level vulnerability is becoming an existential threat for virtually all systems. The time to ensure your chip designs are resistant to these attacks is now. Caspia presented a webinar recently that provides important information on how to build attack-resistant chips. If you missed it, don’t worry. A replay link is coming.… Read More
Why Real-Time Intelligence is the Next Differentiator in Semiconductor Test
Even with advances in AI, automation, and advanced process technology, many semiconductor test operations still rely on reports generated hours after production has occurred. This creates a significant and growing problem. By the time engineers discover a yield excursion, parametric drift, tester issue, or an increase in… Read More
How to Free Yourself from Inconsistent Engineering Documentation Before It’s Too Late
Embedded systems programs often fail because critical engineering documentation drifts out of alignment over time and distance. This results in a team that is correctly following the wrong instructions. All forms of engineering documentation suffer from this problem, and it really is the silent killer of many programs.
llmda.ai… Read More
How Samtec Blazes a Trail to 224/448 Gbps at DesignCon 26
I recently covered what Samtec was doing at DesignCon 26. Samtec has a tendency to dominate any show it attends in multiple dimensions. The prior post focused on the company’s contributions to the technical agenda and the high-profile experts in attendance. While all that is interesting and valuable, attending a large show like… Read More
WEBINAR: Engineering Documentation is a Critical Source of Truth – Do You Know if it’s Accurate?
Embedded systems programs rarely fail because of a lack of execution capability. They fail because critical engineering documentation drifts out of alignment over time and distance. Simply put, the team is correctly following the wrong instructions. This includes requirements, architecture, implementation, verification,… Read More
Learn How llmda Uses Agentic AI to Generate Hardware Docs & Keep Them Consistent
Accurate, complete, and consistent technical documentation is a critical element of success for any embedded system design project. This includes IP, SoCs, and the associated hardware and software infrastructure. When documentation contains errors, the consequences go beyond engineering inefficiency. Errors that drive… Read More
A Look at the High-Profile Speakers Presenting at #DAC2026
Many of us think of DAC as an important trade show for the Semiconductors and EDA industries. That is certainly part of the history of DAC, but the event is also a highly prestigious technical conference dating back to 1964. In fact, the exhibits at DAC began 20 years after the conference started. That long history as a premier technical… Read More
The Hidden Cost of Using Claude for Documentation
Engineering documentation has always been difficult to produce, maintain, and scale. But with the rise of generative AI, many organizations are asking a reasonable question: can a general-purpose large language model (LLM) like Claude automate the work? At first glance, the answer appears to be yes.
Modern LLMs can generate… Read More
TSMC CoWoS versus Intel EMIB Semiconductor Packaging