In part one of this webinar series, Keysight and Modelithics looked at the use of 3D passive vendor component models supporting highly accurate, automated 3D EM-circuit co-simulation of high-frequency RF board designs. Part two continues the exploration of RF board design flows for simulating active circuits on boards, again… Read More
Author: Don Dingee
Webinar: RF board design flow examples for co-simulating active circuits
Semidynamics adds NoC partner and ONNX for RISC-V AI applications
When Semidynamics added support for int4 and fp8 data types to their RISC-V processors, it clearly indicated their intent to target AI inference with hundreds or perhaps thousands of concurrent threads running in their advanced caching and pipelining scheme. Two recent announcements around Embedded World 2025 reinforce their… Read More
TRNG for Automotive achieves ISO 26262 and ISO/SAE 21434 compliance
The security of a device or system depends mainly on being unable to infer or guess an alphanumeric code needed to gain access to it or its data, be that a password or an encryption key. In automotive applications, the security requirement goes one step further – an attacker may not gain access per se, but if they can compromise vehicle… Read More
Webinar: RF design success hinges on enhanced models and accurate simulation
Traditional RF board design strategies based on circuit simulation worked at lower frequencies and relatively large spacing between components. Higher frequencies and densification dominate RF designs now, where corresponding wider bandwidths and tighter layouts with closely spaced components produce more complex 3D… Read More
Crosstalk, 2kAmp power delivery, PAM4, and LPDDR5 analysis at DesignCon
High-speed digital (HSD) designers have long tested the limits of realizable speed. GHz frequencies are now the norm, and multi-level signaling is pushing rates higher while the long-awaited transition to optical signaling and even higher rates looms ever closer. Power density is also climbing, and data-hungry applications… Read More
Chiplet integration solutions from Keysight at Chiplet Summit
Chiplets continue gaining momentum, fueled in large part by applications for AI and 5G/6G RFICs. Keysight has a strong presence at this year’s Chiplet Summit in Santa Clara, which includes Simon Rance in a super panel discussing “Chiplets: The Key to Solving the AI Energy Gap” and Nilesh Kamdar with a keynote… Read More
AI PC momentum building with business adoption anticipated
And just like that, the AI PC arrived. It will be hard to miss high-profile advertising campaigns like the one just launched by Microsoft touting them. Gartner said this September that AI PCs will be 43% of all PC shipments in 2025 (with 114M units projected) and that by 2026, AI PCs will be the only choice for business laptop users. … Read More
Ultra Ethernet and UALink IP solutions scale AI clusters
AI infrastructure requirements are booming. Larger AI models carry hefty training loads and inference latency requirements, driving an urgent need to scale AI acceleration clusters in data centers. Advanced GPUs and NPUs offer solutions for the computational load. However, insufficient bandwidth or latency between servers… Read More
Certification for Post-Quantum Cryptography gaining momentum
A crucial step in helping any new technology specification gain adoption is certification. NIST has been hard at work establishing more than post-quantum cryptography algorithms – they’ve also integrated the new algorithms into their process for third-party validation testing to ensure implementations are as advertised.… Read More
GaN HEMT modeling with ANN parameters targets extensibility
Designers choosing gallium nitride (GaN) transistors may face a surprising challenge when putting the devices in their context. While the Advanced SPICE Model for GaN HEMTs (ASM-HEMT) model captures many behaviors like thermal and trapping effects, it grapples with accuracy over a wide range of bias conditions. Foundries … Read More
Rethinking Multipatterning for 2nm Node