TCAD for 3D Silicon Simulation

TCAD for 3D Silicon Simulation
by Daniel Payne on 06-03-2025 at 10:00 am

Silvaco TCAD min

Semiconductor fabs aim to have high yields and provide processes that attract design firms and win new design starts, but how does a fab deliver their process nodes in a timely manner without having to run lots of expensive silicon through the line? This is where simulation and TCAD tools come into play, and to learn more about this… Read More


Automotive Functional Safety (FuSa) Challenges

Automotive Functional Safety (FuSa) Challenges
by Daniel Payne on 04-29-2025 at 10:00 am

silicon lifecycle management slm diagram min

Modern vehicles have become quite sophisticated, like a supercomputer on wheels. They integrate a vast number of electronic components, including thousands of chips, to deliver advanced functionalities ranging from infotainment to critical safety systems. This increasing complexity necessitates a robust approach to … Read More


High-speed PCB Design Flow

High-speed PCB Design Flow
by Daniel Payne on 04-24-2025 at 10:00 am

PCB design phases min

High-speed PCB designs are complex, often requiring a team with design engineers, PCB designers and SI/PI engineers working together to produce a reliable product, delivered on time and within budget. Cadence has been offering PCB tools for many years, and they recently wrote a 10-page white paper on this topic, so I’ll share … Read More


Verifying Leakage Across Power Domains

Verifying Leakage Across Power Domains
by Daniel Payne on 04-21-2025 at 10:00 am

leakage contention

IC designs need to operate reliably under varying conditions and avoid inefficiencies like leakage across power domains. But how do you verify that connections between IP blocks has been done properly? This is where reliability verification, Electrical Rule Checking (ERC) tools and dynamic simulations all come into play particularly… Read More


Generative AI Comes to High-Level Design

Generative AI Comes to High-Level Design
by Daniel Payne on 04-10-2025 at 10:00 am

high level agents min

I’ve watched the EDA industry change the level of design abstraction starting from transistor-level to gate-level, then RTL, and finally using High Level Synthesis (HLS). Another emerging software trend is the use of generative AI to make coding RTL more automated. There’s a new EDA company called Rise Design Automation that… Read More


Speeding Up Physical Design Verification for AMS Designs

Speeding Up Physical Design Verification for AMS Designs
by Daniel Payne on 03-10-2025 at 6:00 am

mismatch min

Custom and analog/mixed-signal IC designs have some unique IP and symmetry checking requirements for physical design. Waiting until the end of the IC layout process to verify IP instances for correctness or proper symmetry will cause project delays, so an approach to perform earlier physical verification makes more sense. … Read More


Getting Faster DRC Results with a New Approach

Getting Faster DRC Results with a New Approach
by Daniel Payne on 02-04-2025 at 10:00 am

Run time improvements using Calibre nmDRC Recon

As IC designs become increasingly complex, traditional Design Rule Checking (DRC) methods are struggling to keep up. The old “construct by correction” approach, initially developed for simpler, custom layouts, is creating substantial runtime and resource bottlenecks. Traditional DRC relies on an iterative, sequential… Read More


Automating Formal Verification

Automating Formal Verification
by Daniel Payne on 01-30-2025 at 10:00 am

LUBIS on cloud min

Formal verification methods are being adopted at a fast pace as a complement to traditional verification methods like functional simulation for IP blocks in SoC designs. I had a video meeting with Max Birtel, co-founder of LUBIS EDA and learned more about their history, products and vision. This company started recently in 2020… Read More


Heterogeneous 2D/3D Packaging Challenges

Heterogeneous 2D/3D Packaging Challenges
by Daniel Payne on 01-27-2025 at 10:00 am

Innovator3D IC flow min

A growing trend in system design is the use of multiple ICs mounted in advanced packages, especially in high-performance computing and AI. These modern packages now integrate multiple ICs, often with high-bandwidth memory (HBM), resulting in hundreds of thousands of connections that need proper verification. Traditional… Read More


CES 2025 and all things Cycling

CES 2025 and all things Cycling
by Daniel Payne on 01-06-2025 at 10:00 am

UrbanGlide 3

CES 2025 was held from January 7-10, once again in Las Vegas, so I attended virtually to gather together all of the tech and trends related to cycling, which is becoming more electrified each year. E-bikes return as the biggest category and from my cycling rides I can see how popular these bikes are becoming in Oregon for commuters … Read More