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At the recent Synopsys Users Group Meeting (SNUG) I had the honor of leading a panel of experts on the topic of chiplets. One of those panelists was the very personable Dr. Henry Sheng, Group Director of R&D in the EDA Group at Synopsys. Henry currently leads engineering for 3DIC, advanced technology and visualization.
There were quite a few announcements at the TSMC Technical Symposium last week but the most important, in my opinion, were based on TSMC N3 tape-outs. Not only is N3 the leading 3nm process it is the only one in mass production which is why all of the top tier semiconductor companies are using it. TSMC N3 will be the most successful node… Read More
Mobiveil Marks 11th Anniversary
Ravi Thummarukudy is Mobiveil’s Chief Executive Officer and a founder. He and I recently spent an enjoyable afternoon getting acquainted as I learned more about Mobiveil. It’s an inspiring story of a technology company in the semiconductor space helping customers and prospering.
Eleven-year-old… Read More
TSMC also covered manufacturing excellence. The TSMC “Trusted Foundry” tagline has many aspects to it, but manufacturing is a critical one. TSMC is the foundry capacity leader but there is a lot more to manufacturing as you will read here. Which brings us to the manufacturing accomplishments from the briefing:
TSMC covered their specialty technologies in great detail. Specialty is what we inside the ecosystem used to call weird stuff meaning non-mainstream and fairly difficult to do on leading edge processes. Specialty technologies will play an even more important part of semiconductor design with the advent of chiplets where die… Read More
TSMC’s 3DFabric initiative was a big focus at the symposium, as it should be. I remember when TSMC first went public with CoWos the semiconductor ecosystem, including yours truly, let out a collective sigh wondering why TSMC is venturing into the comparatively low margin world of packaging. Now we know why and it is absolutely… Read More
The next topic I would like to cover is an update to the TSMC process node roadmap starting with N3. As predicted, N3 will be the most successful node in the TSMC FinFET family. The first version of N3 went into production at the end of last year (Apple) and will roll out with other customers in 2023. There is a reported record amount of … Read More
The TSMC 2023 North America Technology Symposium happened today so I wanted to start writing about it as there is a lot to cover. I will do summaries and other bloggers will do more in-depth coverage on the technology side in the coming weeks. Having worked in the fabless semiconductor ecosystem the majority of my 40 year semiconductor… Read More
S2C, a leading provider of FPGA-based prototyping solutions, has helped a client achieve high-performance secure GPU chip verification. With the help of S2C’s Prodigy prototyping solution, the client was able to start software development and hardware-software co-design early, leading to accelerated time-to-market… Read More
At the recent Synopsys Users Group Meeting (SNUG) I had the honor of leading a panel of experts on the topic of chiplets. The discussion was based on a report published by the MIT Technology Review Insights in cooperation with Synopsys. This is a very comprehensive report (12 pages) that is available online HERE.
Here is the preface… Read More
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Quantum Computing Technologies and Challenges