Join this webinar and see UCIe in action! This webinar presents the SystemVerilog models of a Universal Chiplet Interconnect Express (UCIe) interface, including both the analog circuits in the electrical layer and digital FSMs in the logical layer. The whole physical layer (PHY) model can be efficiently simulated in SystemVerilog,… Read More
Author: Daniel Nenni
WEBINAR: Driving Forward with UWB Radar: Enhancing Child Safety in Automotive
The rapid advancement of UWB (Ultra-Wideband) wireless technology has garnered significant attention and interest, thanks to its adoption by leading smartphone brands and its versatile range of applications. Within the automotive industry, UWB has already emerged as the preferred choice for Digital Keys in the premium… Read More
Investing in a sustainable semiconductor future: Materials Matter
In 2020 TSMC established its Net Zero Project with a goal of net zero emissions by 2050. I remember wondering how could this possibly be done before 2050 or at all for that matter. After working with TSMC for 20+ years I have learned never to bet against them on any topic and green manufacturing is one of them, absolutely.
TSMC presented… Read More
WEBINAR: An Ideal Neural Processing Engine for Always-sensing Deployments
Always-sensing cameras are a relatively new method for users to interact with their smartphones, home appliances, and other consumer devices. Like always-listening audio-based Siri and Alexa, always-sensing cameras enable a seamless, more natural user experience. However, always-sensing camera subsystems require specialized… Read More
CEO Interview: Issam Nofal of IROC Technologies
Issam Nofal is the CEO of IROC Technologies and has held various positions with the company for over 23 years as Product Manager, Project Leader, and R&D Engineer. He has authored several papers on test and reliability of Integrated Circuits. He holds a PhD in Microelectronics from Grenoble INP.
What is IROC Technologies’
… Read MoreWhy Generative AI for Chip Design is a Game Changer
AI-generated chip design is progressing at an incredible pace!
Earlier this week, I wrote about the Efabless AI Generated Open–Source Silicon Design Challenge. If you haven’t done so already, take a closer look at the challenge and see first-hand what this is all about. In talking to Mike Wishart and Mohamed Kassem, co-founders… Read More
US giant swoops for British chipmaker months after Chinese sale blocked on national security grounds
According to UK based The Telegraph Pulsic is a chip maker and Cadence is a swooping US giant. I guess you have to stretch the truth to get those precious clicks these days. Even so this is a strategic acquisition for Cadence.
Pulsic is a 20+ year old EDA software company that offers chip planning and implementation software for custom… Read More
Chiplet Q&A with John Lee of Ansys
At the recent Synopsys Users Group Meeting (SNUG) I had the honor of leading a panel of experts on the topic of chiplets. One of those panelists was John Lee, Head of Electronics, Semiconductors and Optics at Ansys.
How is the signoff flow evolving and what is being done to help mitigate the growing signoff complexity challenge?
With… Read More
eFPGA Enabled Chiplets!
With our continuing chiplet coverage I found this of great interest. I have always felt that eFPGAs and chiplets are a natural fit for the next generation of chip design and this is an excellent example. As we design with chiplets one of the challenges is verification/validation in regards to performance and interoperability. … Read More
Ansys Acquires Another!
The headline is: Ansys Signs Definitive Agreement to Acquire Diakopto, Expands Multiphysics Simulation Portfolio for Semiconductor Designers. The acquisition complements Ansys’ existing signoff solutions and enables integrated circuit (IC) designers to detect problems earlier in the design flow.
Which is certainly… Read More
Weebit Nano Moves into the Mainstream with Customer Adoption