WEBINAR: UCIe PHY Modeling and Simulation with XMODEL

WEBINAR: UCIe PHY Modeling and Simulation with XMODEL
by Daniel Nenni on 06-05-2023 at 6:00 am

UCIe image2

Join this webinar and see UCIe in action! This webinar presents the SystemVerilog models of a Universal Chiplet Interconnect Express (UCIe) interface, including both the analog circuits in the electrical layer and digital FSMs in the logical layer. The whole physical layer (PHY) model can be efficiently simulated in SystemVerilog,… Read More


WEBINAR: Driving Forward with UWB Radar: Enhancing Child Safety in Automotive

WEBINAR: Driving Forward with UWB Radar: Enhancing Child Safety in Automotive
by Daniel Nenni on 06-01-2023 at 6:00 am

CEVA UWB Radar Webinar Email Invitation 230521

 

The rapid advancement of UWB (Ultra-Wideband) wireless technology has garnered significant attention and interest, thanks to its adoption by leading smartphone brands and its versatile range of applications. Within the automotive industry, UWB has already emerged as the preferred choice for Digital Keys in the premium… Read More


Investing in a sustainable semiconductor future: Materials Matter

Investing in a sustainable semiconductor future: Materials Matter
by Daniel Nenni on 05-31-2023 at 6:00 am

EMD LinkedIn Twitter Materials Matter

In 2020 TSMC established its Net Zero Project with a goal of net zero emissions by 2050. I remember wondering how could this possibly be done before 2050 or at all for that matter. After working with TSMC for 20+ years I have learned never to bet against them on any topic and green manufacturing is one of them, absolutely.

TSMC presented… Read More


WEBINAR: An Ideal Neural Processing Engine for Always-sensing Deployments

WEBINAR: An Ideal Neural Processing Engine for Always-sensing Deployments
by Daniel Nenni on 05-29-2023 at 10:00 am

Option 1

Always-sensing cameras are a relatively new method for users to interact with their smartphones, home appliances, and other consumer devices. Like always-listening audio-based Siri and Alexa, always-sensing cameras enable a seamless, more natural user experience. However, always-sensing camera subsystems require specialized… Read More


CEO Interview: Issam Nofal of IROC Technologies

CEO Interview: Issam Nofal of IROC Technologies
by Daniel Nenni on 05-24-2023 at 6:00 am

Dr.Issam AL ZAHER NOUFAL (1)

Issam Nofal is the CEO of IROC Technologies and has held various positions with the company for over 23 years as Product Manager, Project Leader, and R&D Engineer. He has authored several papers on test and reliability of Integrated Circuits. He holds a PhD in Microelectronics from Grenoble INP.

What is IROC Technologies’
Read More

Why Generative AI for Chip Design is a Game Changer

Why Generative AI for Chip Design is a Game Changer
by Daniel Nenni on 05-22-2023 at 10:00 am

Efabless AI Generated Design Challenge SemiWiki 1

AI-generated chip design is progressing at an incredible pace!

Earlier this week, I wrote about the Efabless AI Generated Open–Source Silicon Design Challenge.  If you haven’t done so already, take a closer look at the challenge and see first-hand what this is all about.  In talking to Mike Wishart and Mohamed Kassem, co-founders… Read More


US giant swoops for British chipmaker months after Chinese sale blocked on national security grounds

US giant swoops for British chipmaker months after Chinese sale blocked on national security grounds
by Daniel Nenni on 05-21-2023 at 6:00 pm

UK US CHina Semiconductor Battle

According to UK based The Telegraph Pulsic is a chip maker and Cadence is a swooping US giant.  I guess you have to stretch the truth to get those precious clicks these days. Even so this is a strategic acquisition for Cadence.

Pulsic is a 20+ year old EDA software company that offers chip planning and implementation software for custom… Read More


Chiplet Q&A with John Lee of Ansys

Chiplet Q&A with John Lee of Ansys
by Daniel Nenni on 05-19-2023 at 6:00 am

SNUG Panel

At the recent Synopsys Users Group Meeting (SNUG) I had the honor of leading a panel of experts on the topic of chiplets. One of those panelists was John Lee, Head of Electronics, Semiconductors and Optics at Ansys.

How is the signoff flow evolving and what is being done to help mitigate the growing signoff complexity challenge?

With… Read More


eFPGA Enabled Chiplets!

eFPGA Enabled Chiplets!
by Daniel Nenni on 05-18-2023 at 10:00 am

Achronix eFPGA IP

With our continuing chiplet coverage I found this of great interest. I have always felt that eFPGAs and chiplets are a natural fit for the next generation of chip design and this is an excellent example. As we design with chiplets one of the challenges is verification/validation in regards to performance and interoperability. … Read More


Ansys Acquires Another!

Ansys Acquires Another!
by Daniel Nenni on 05-16-2023 at 4:00 pm

Diakopto logo

The headline is: Ansys Signs Definitive Agreement to Acquire Diakopto, Expands Multiphysics Simulation Portfolio for Semiconductor Designers. The acquisition complements Ansys’ existing signoff solutions and enables integrated circuit (IC) designers to detect problems earlier in the design flow.

Which is certainly… Read More