Unique IO & ESD Solutions @ DAC 2023!

Unique IO & ESD Solutions @ DAC 2023!
by Daniel Nenni on 06-29-2023 at 6:00 am

DAC photo Certus Semiconductor

The semiconductor industry continues to drive innovation and constantly seeks methods to lower costs and improve performance. The advantages of custom I/O libraries versus free libraries can be seen as cost-savings or, more importantly, new markets, new customers, and new business
opportunities.

At DAC 2023, Certus SemiconductorRead More


Samsung Foundry on Track for 2nm Production in 2025

Samsung Foundry on Track for 2nm Production in 2025
by Daniel Nenni on 06-27-2023 at 3:00 pm

Samsung Foundry Forum 2023

On the heels of the TSMC Symposium and the Intel Foundry update, Samsung held their Foundry Forum today live in Silicon Valley. As usual it was a well attended event with hundreds of people and dozens of ecosystem partners. The theme was the AI Era which is appropriate. As I have mentioned before, AI will touch most every chip and there… Read More


Ansys Revving up for Automotive and 3D-IC Multiphysics Signoff at DAC 2023

Ansys Revving up for Automotive and 3D-IC Multiphysics Signoff at DAC 2023
by Daniel Nenni on 06-26-2023 at 10:00 am

dac 2023 600x100

 

Highlights:

  • Ansys CTO Prith Banerjee will be delivering the Visionary Speaker opening address on Tuesday 11th
  • There will be technical presentations every hour in the Ansys Booth Theater (#1539)
  • Get yourself a complimentary sit-down breakfast and a discussion on automotive electronics by registering for the Ansys DAC
Read More

Efabless Celebrates AI Design Challenge Winners!

Efabless Celebrates AI Design Challenge Winners!
by Daniel Nenni on 06-23-2023 at 6:00 am

Efabless AI Challenge SemiWiki

The first AI Generated Open-Source Silicon Design Challenge invited participants to use generative AI to design an open-source silicon chip and tape it out in just three weeks. The contestants were required to create Verilog code from natural language prompts, and then implemented their designs using the chipIgnite platform… Read More


The Updated Legacy of Intel CEOs

The Updated Legacy of Intel CEOs
by Daniel Nenni on 06-21-2023 at 10:00 am

Intel HQ 2023

(First published December 24, 2014)

A list of the best and worst CEOs in 2014 was recently published. The good news is that none of our semiconductor CEOs were on the worst list. The bad news is that none of our semiconductor CEOs were on the best list either. I will be writing about the CEOs that made our industry what it is today starting… Read More


Keynote Sneak Peek: Ansys CEO Ajei Gopal at Samsung SAFE Forum 2023

Keynote Sneak Peek: Ansys CEO Ajei Gopal at Samsung SAFE Forum 2023
by Daniel Nenni on 06-19-2023 at 10:00 am

Image

As one of the world’s leading chip foundries, Samsung occupies a vital position in the semiconductor value chain. The annual Samsung Advanced Foundry Ecosystem (SAFE™) Forum is a must-go event for semiconductor and electronic design automation (EDA) professionals. Ajei Gopal, President and CEO of Ansys, has the honor of delivering… Read More


Requirements for Multi-Die System Success

Requirements for Multi-Die System Success
by Daniel Nenni on 06-16-2023 at 6:00 am

Synopsys Chiplet Report 2023

Chiplets continue to be a hot topic on SemiWiki, conferences, white papers, webinars and one of the most active chiplet enabling vendors we work with is Synopsys. Synopsys is the #1 EDA and #1 IP company so that makes complete sense.

As you may have read, I moderated a panel on Chiplets at the last SNUG which we continue to write about.

Read More

S2C Accelerates Development Timeline of Bluetooth LE Audio SoC

S2C Accelerates Development Timeline of Bluetooth LE Audio SoC
by Daniel Nenni on 06-15-2023 at 6:00 am

actt

S2C has been shipping FPGA prototyping platforms for SoC verification for almost two decades, and many of its customers are developing SoCs and silicon IP for Bluetooth applications.  Prototyping Bluetooth designs before silicon has yielded improved design efficiencies through more comprehensive system validation, and… Read More


TSMC Doubles Down on Semiconductor Packaging!

TSMC Doubles Down on Semiconductor Packaging!
by Daniel Nenni on 06-14-2023 at 6:00 am

TSMC 3DFabric Integration

Last week TSMC announced the opening of an advanced backend fab for the expansion of the TSMC 3DFabric System Integration Technology. It’s a significant announcement as the chip packaging arms race with Intel and Samsung is heating up.

Fab 6 is TSMC’s first all-in-one advanced packaging and testing fab which is part of the… Read More


WEBINAR: Revolutionizing Chip Design with 2.5D/3D-IC Design Technology

WEBINAR: Revolutionizing Chip Design with 2.5D/3D-IC Design Technology
by Daniel Nenni on 06-12-2023 at 10:00 am

Figure 1 (2)

In the 3D-IC (Three-dimensional integrated circuit) chip design method, chiplets or wafers are stacked vertically on top of each other and are connected using Through Silicon Vias (TSVs) or hybrid bonding.

The 2.5D-IC design method places multiple chiplets alongside each other on a silicon interposer. Microbumps and interconnect… Read More