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The semiconductor industry continues to drive innovation and constantly seeks methods to lower costs and improve performance. The advantages of custom I/O libraries versus free libraries can be seen as cost-savings or, more importantly, new markets, new customers, and new business
opportunities.
At DAC 2023, Certus Semiconductor… Read More
On the heels of the TSMC Symposium and the Intel Foundry update, Samsung held their Foundry Forum today live in Silicon Valley. As usual it was a well attended event with hundreds of people and dozens of ecosystem partners. The theme was the AI Era which is appropriate. As I have mentioned before, AI will touch most every chip and there… Read More
Highlights:
- Ansys CTO Prith Banerjee will be delivering the Visionary Speaker opening address on Tuesday 11th
- There will be technical presentations every hour in the Ansys Booth Theater (#1539)
- Get yourself a complimentary sit-down breakfast and a discussion on automotive electronics by registering for the Ansys DAC
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The first AI Generated Open-Source Silicon Design Challenge invited participants to use generative AI to design an open-source silicon chip and tape it out in just three weeks. The contestants were required to create Verilog code from natural language prompts, and then implemented their designs using the chipIgnite platform… Read More
(First published December 24, 2014)
A list of the best and worst CEOs in 2014 was recently published. The good news is that none of our semiconductor CEOs were on the worst list. The bad news is that none of our semiconductor CEOs were on the best list either. I will be writing about the CEOs that made our industry what it is today starting… Read More
As one of the world’s leading chip foundries, Samsung occupies a vital position in the semiconductor value chain. The annual Samsung Advanced Foundry Ecosystem (SAFE™) Forum is a must-go event for semiconductor and electronic design automation (EDA) professionals. Ajei Gopal, President and CEO of Ansys, has the honor of delivering… Read More
Chiplets continue to be a hot topic on SemiWiki, conferences, white papers, webinars and one of the most active chiplet enabling vendors we work with is Synopsys. Synopsys is the #1 EDA and #1 IP company so that makes complete sense.
As you may have read, I moderated a panel on Chiplets at the last SNUG which we continue to write about.
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S2C has been shipping FPGA prototyping platforms for SoC verification for almost two decades, and many of its customers are developing SoCs and silicon IP for Bluetooth applications. Prototyping Bluetooth designs before silicon has yielded improved design efficiencies through more comprehensive system validation, and… Read More
Last week TSMC announced the opening of an advanced backend fab for the expansion of the TSMC 3DFabric System Integration Technology. It’s a significant announcement as the chip packaging arms race with Intel and Samsung is heating up.
Fab 6 is TSMC’s first all-in-one advanced packaging and testing fab which is part of the… Read More
In the 3D-IC (Three-dimensional integrated circuit) chip design method, chiplets or wafers are stacked vertically on top of each other and are connected using Through Silicon Vias (TSVs) or hybrid bonding.
The 2.5D-IC design method places multiple chiplets alongside each other on a silicon interposer. Microbumps and interconnect… Read More
CES 2025 and all things Cycling