The rapid escalation of cyberattacks over the past two decades has exposed a fundamental weakness at the core of modern computing systems: the lack of memory safety. Industry data consistently shows that the majority of critical software vulnerabilities stem from memory corruption issues such as buffer overflows, use-after-free… Read More
Author: Daniel Nenni
CHERI: Hardware-Enforced Capability Architecture for Systematic Memory Safety
Apple’s iPhone 17 Series 5G mmWave Antenna Module Revealed to be Powered by Soitec FD-SOI Substrates
Apple’s iPhone 17 Series 5G mmWave Antenna Module Revealed to be Powered by Soitec FD-SOI Substrates
Recent independent teardown and technical analyses have confirmed that the 5G mmWave antenna module powering Apple’s latest iPhone 17 lineup relies on advanced SOITEC based Fully Depleted Silicon-On-Insulator (FD-SOI) substrate technology. The discovery highlights a significant architectural shift in high-frequency… Read More
Advancing Automotive Memory: Development of an 8nm 128Mb Embedded STT-MRAM with Sub-ppm Reliability
The rapid evolution of automotive technology has intensified the demand for highly reliable, high-performance semiconductor memory solutions. Modern vehicles increasingly rely ADAS driving features, and complex infotainment platforms, all of which require memory that can operate flawlessly under extreme environmental… Read More
CEO Interview with Echo Yang of CSCERAMIC
Echo Yang is the CEO of CSCERAMIC, a China-based manufacturer specializing in advanced ceramic materials and precision ceramic components for industrial and laboratory applications. With a background spanning international trade, manufacturing coordination, and engineering-driven supply chain development, Echo leads… Read More
Memory Matters: Signals from the 2025 NVM Survey
Non-volatile memory choices are becoming more complex as SoC designs push into advanced nodes, and new requirements driven by AI, new sensor technologies and stringent quality standards.
The second annual 2025 NVM Survey, completed in December, captures a market that still hangs on established technologies but is increasingly… Read More
Akeana Partners with Axiomise for Formal Verification of Its Super-Scalar RISC-V Cores
Akeana Inc. announced a key milestone in the development of its advanced RISC-V technology: a successful partnership with Axiomise Limited to formally verify its super-scalar test chip, Alpine. The collaboration highlights the growing importance of formal verification in ensuring correctness, performance, and efficiency
Caspia Technologies Unveils A Breakthrough in RTL Security Verification Paving the Way for Agentic Silicon Security
In a significant advancement for the semiconductor industry, Caspia Technologies announced the broad availability of CODAx V2026.1, its flagship RTL security analyzer. The new release strengthens early-stage hardware security verification and positions the company to deliver fully agentic workflows that automate vulnerability… Read More
Designing the Future: AI-Driven Multi-Die Innovation in the Era of Agentic Engineering
At the 2026 Chiplet Summit, Synopsys presented a bold vision for the future of semiconductor innovation: AI-driven multi-die design powered by agentic intelligence. As the semiconductor industry shifts rapidly toward chiplet-based architectures and 3D stacking, the complexity of design, verification, and system integration… Read More
Siemens to Deliver Industry-Leading PCB Test Engineering Solutions
Siemens has strengthened its position in EDA and manufacturing by acquiring ASTER Technologies, a specialist in test and reliability solutions for printed circuit boards. The acquisition represents a strategic step in Siemens’ broader vision to deliver a fully integrated, end-to-end digital thread for electronics design,… Read More
Smarter ECOs: Inside Easy-Logic’s ASIC Optimization Engine
Easy-Logic Technology Ltd. is a specialized Electronic Design Automation (EDA) company focused on solving one of the most complex and time-sensitive challenges in semiconductor design: functional Engineering Change Orders (ECOs). Founded in 2014 and headquartered in Hong Kong, the company has built its reputation around
A Detailed History of Samsung Semiconductor