SPI, invented some four decades ago, is so successful as a low-pin-count interface for microcontrollers and processor cores that it spurred memory makers to incorporate both the physical signaling interface and advanced memory command protocols into serial flash and serial pseudo-SRAM (PSRAM) devices. Those protocols, … Read More
Posts Search Results for "ISO 26262"
Speculation: Silicon’s Most Expensive Compulsion
How Time-Based Scheduling
Reclaims Silicon Wasted by Speculative Execution
By: Dr. Thang Tran, Founder and CTO, Simplex Micro
I have spent my career designing processor architectures, and I have reached an uncomfortable conclusion: a substantial fraction of the silicon area and power in modern high-performance processors… Read More
Effective Defense Against Hacks at the Edge
IoT permeates every aspect of our lives, in payment systems, access authorization, vehicles, utilities, factories, hospitals, and in so many other fields. Which makes these systems attractive targets for hacking and social disruption while also challenging to protect given the highly constrained resources that many such… Read More
Renesas Scalable Automotive SoC Design Using Arteris NoC
The increasing complexity of advanced driver assistance systems (ADAS) and automated driving architectures has driven a transition from traditional bus-based interconnects to scalable Network-on-Chip (NoC) fabrics. Renesas’ next-generation R-Car automotive SoC platforms adopt Arteris FlexNoC interconnect intellectual… Read More
CEO Interview with Steve Kim of Chips&Media
I’m Steve Kim, the CEO of Chips&Media. I’ve been immersed in the multimedia imaging industry for approximately two decades. Prior to joining Chips&Media, I spent over five years working within handset manufacturing companies. Following more than ten years here at Chips&Media in roles spanning Marketing, Sales,… Read More
NXP Expands Arteris NoC Deployment to Scale Edge AI Architectures
As edge AI systems become more centralized and compute-dense, on-chip data movement is increasingly the architectural bottleneck. NXP’s expanded deployment of Arteris network-on-chip (NoC) and cache-coherent interconnect IP highlights a broader industry trend: interconnect architecture is now a first-order design … Read More
From SoC to System-in-Package: Transforming Automotive Compute with Multi-Die Integration
Modern automotive electronics are undergoing a rapid transformation driven by increasing compute demands, functional safety requirements, and the shift toward scalable semiconductor architectures. One of the most significant technological developments enabling this transformation is the adoption of multi-die system… Read More
Operationalizing Secure Semiconductor Collaboration: Safely, Globally, and at Scale
Semiconductor manufacturing is among the most complex industrial activities in existence. As device geometries shrink and systems become more interconnected, software has become as critical as process technology itself. Modern fabs depend on extensive automation, real-time analytics, and deep integration between tools,… Read More
Functional Safety Analysis of Electronic Systems
Safety engineers, hardware designers and reliability specialists in safety-critical industries like automotive, aerospace, medical device and industrial automation use FMEDA (Failure Modes, Effects and Diagnostic Analysis). ISO 26262 compliance for ADAS, braking systems and ECUs require FMEDA in the automotive sector.… Read More
S2C, MachineWare, and Andes Introduce RISC-V Co-Emulation Solution to Accelerate Chip Development
MachineWare, and Andes Technology today announced a collaborative co-emulation solution designed to address the increasing complexity of RISC-V-based chip design. The solution integrates MachineWare’s SIM-V virtual platform, S2C’s Genesis Architect and Prodigy FPGA Prototyping Systems, and Andes’ high-performance… Read More








The Semiconductor Growth Numbers are Insane but the Real World Doesn’t Tally!