Rapidus Corporation is a Japanese government-backed semiconductor company founded in August 2022 with the mission of establishing a domestic, advanced-node logic foundry capable of competing globally with TSMC, Intel Foundry Services, and Samsung Foundry. It aims to mass-produce 2nm and beyond process technologies by the late 2020s, revitalizing Japan’s leadership in semiconductor manufacturing.
The name “Rapidus” is derived from the Latin word for “rapid,” reflecting the company’s ambition to move swiftly toward cutting-edge chip production.
Headquarters
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Tokyo, Japan
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R&D Site: Beken, Chitose (Hokkaido)
Founding
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Established: August 10, 2022
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Legal Structure: Joint-stock company
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CEO: Dr. Atsuyoshi Koike (former President of Western Digital Japan and former IBM Japan executive)
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Chairman: Tetsuro Higashi (former President of Tokyo Electron)
Founding Investors
Rapidus is backed by a consortium of eight major Japanese corporations, including:
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Toyota Motor Corporation
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Sony Group
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NTT
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SoftBank
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Denso
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Kioxia
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NEC
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MUFG Bank
Additionally, the Japanese government (via the Ministry of Economy, Trade and Industry – METI) is investing billions of dollars to support Rapidus’s development, including subsidies for R&D, equipment, and fab construction.
Strategic Goals
| Objective | Details |
|---|---|
| 2nm Mass Production | Goal to achieve mass production of 2nm process by 2027 |
| Sovereign Capability | Reduce dependence on foreign foundries (TSMC, Samsung, etc.) |
| AI & HPC Focus | Targeting markets like AI, data centers, 5G/6G, and automotive |
| Economic Security | Part of Japan’s national strategy for economic and technological resilience |
| Open Foundry Model | Intends to operate as an open foundry for both domestic and global customers |
Key Partnerships
🇺🇸 IBM
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Technology Transfer: IBM is providing Rapidus with its 2nm GAA nanosheet transistor technology, first announced in 2021.
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Based on IBM’s Albany NanoTech platform.
🇺🇸 imec (Belgium)
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R&D Collaboration: Rapidus joined imec’s advanced semiconductor ecosystem to co-develop beyond-2nm technologies.
🇯🇵 Tokyo Electron, SCREEN, and Advantest
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Japanese equipment suppliers are deeply integrated into Rapidus’s supply chain.
Facility and Timeline
Chitose Fab (Hokkaido)
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Construction began in late 2023
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Target completion of pilot line in 2025
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Targeted 2nm mass production readiness by 2027
Roadmap Summary
| Year | Milestone |
|---|---|
| 2022 | Rapidus founded |
| 2023 | Partnership with IBM; construction of Chitose site begins |
| 2024 | Equipment installation and pilot line development |
| 2025 | Pilot production begins |
| 2027 | Volume production of 2nm logic devices |
Financial Support
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Over ¥920 billion ($6.2 billion USD) in combined public and private funding as of mid-2025
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Ongoing multi-phase government subsidies through METI
Strategic Importance
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Rapidus is part of Japan’s effort to reclaim its historical strength in semiconductors, which it dominated during the 1980s.
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Positioned as a trusted foundry for allied nations, particularly amid U.S.-China semiconductor tensions.
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Supports automotive and industrial electronics, a traditional strength of Japan.
Challenges
| Challenge | Description |
|---|---|
| Workforce | Shortage of experienced semiconductor engineers for advanced nodes |
| Time-to-Market | Must catch up with TSMC and Samsung’s head start on 2nm |
| Capital Intensity | Requires tens of billions in sustained investment |
| Global Supply Chain | Needs tight integration with U.S. and European tool vendors and material suppliers |
Public Perception
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Seen as a national symbol of technological resurgence
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Analysts are cautiously optimistic, with concerns about execution risk and capital scale
Leadership
Dr. Atsuyoshi Koike – CEO
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Former Managing Director at IBM Japan
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Deep experience in semiconductor R&D and operations
Tetsuro Higashi – Chairman
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Former President of Tokyo Electron (TEL)
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Veteran of the semiconductor equipment industry
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