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A Deep Dive into SoC Performance Analysis: Optimizing SoC Design Performance Via Hardware-Assisted Verification Platforms

A Deep Dive into SoC Performance Analysis: Optimizing SoC Design Performance Via Hardware-Assisted Verification Platforms
by Lauro Rizzatti on 01-22-2025 at 10:00 am

A Deep Dive into SoC Performance Analysis Part 2 Figure 1

Part 2 of 2 – Performance Validation Across Hardware Blocks and Firmware in SoC Designs

Part 2 explores the performance validation process across hardware blocks and firmware in System-on-Chip (SoC) designs, emphasizing the critical role of Hardware-Assisted Verification (HAV) platforms. It outlines the validation workflow driven by real-world applications, and best practices for leveraging HAV platforms to ensure comprehensive performance validation and meet evolving design demands. Part 1 is found here

Performance Validation Models in the SoC Verification Flow

It is crucial to distinguish between performance validation and architectural exploration, as these processes serve different purposes in the design and development cycle. Architectural exploration focuses on selecting the optimal SoC architecture to achieve specific design goals, such as maximizing performance or minimizing silicon area. In contrast, performance validation evaluates the actual performance of an architectural implementation to ensure it meets the intended specifications and operational requirements.

Performance validation is a comprehensive, multi-phase process that begins at the architectural level and progressively refines through the abstraction hierarchy, culminating in post-silicon validation. Each stage ensures the design remains aligned with performance expectations, mitigating risks before final production.

In the pre-silicon phase, performance validation relies on two distinct abstraction models, in contrast to software validation, which can utilize hybrid modeling techniques:

  • Approximately Timed (AT) Models: These models are used for early performance estimations, emphasizing functional correctness and coarse-grained timing analysis. Typically written in SystemC, AT models help identify potential bottlenecks and provide an initial understanding of the system’s behavior.
  • Cycle-Accurate (CA) Models: Offering detailed, clock-level timing accuracy, CA models are essential for evaluating critical performance metrics such as cycles per second, frames per second, or packets per second. These metrics are key to assessing system efficiency and ensuring the design meets specified requirements. CA models are also implemented in SystemC. When CA models are unavailable, performance validation must be conducted using cycle-accurate RTL simulations.

As the design progresses from abstraction to physical implementation, the final phase of performance validation occurs during silicon engineering sample (ES) testing after the pre-silicon stage. This stage ensures that the actual silicon meets performance expectations under real-world operational conditions. It serves as the ultimate verification step to confirm that the device functions as intended and satisfies all specified requirements before mass production.

By differentiating these processes and employing appropriate tools at each stage, developers can optimize both the architecture and performance of their designs, reducing time-to-market and improving reliability.

As the following figure shows, that analysis first happens at the architectural level (AT modeling) where it is explored if a particular architecture can support a certain workload performance using models of workload and architecture, given the constraints that a multi-die implementation will pose. Later at the CA level the exact performance is measured using the actual software workload on the detailed target architecture.

Fig 1. Analyzing Performance KPIs for complex, multi-die designs at the architecture level.

Performance Validation Methods

Performance validation can be performed at two key points: at the I/O design boundary or within the design itself.

Performance Analysis at the DUT I/O Boundary

This method measures performance externally, using the Design Under Test (DUT) interface. It often involves PCI Monitors: to assess DUT performance at the pin level, enabling precise, cycle-accurate testing. Real applications, such as I/O meter tools are executed in virtual environments to simulate traffic. Cycle-Accurate Data Capture: Monitors at the RTL pin level collect detailed performance metrics, providing insights into the DUT’s behavior under test conditions.

Performance Analysis Inside the DUT

Internal analysis is employed to diagnose issues. This approach involves DPI calls and internal monitors: These tools, combined with post-simulation scripts, help pinpoint performance bottlenecks within the system. Performance tracking: data is typically logged and managed in spreadsheets, with a framework of test cases designed to evaluate specific performance metrics.

Role of Monitors

Monitors play different roles, with some designed for transaction-level debugging and others focused solely on performance validation. The distinction is crucial.

In performance validation, the design clocks must remain running without interruption. Parameters analyzed are typically minimal and focused on transaction counts, such as read latency, the gap between two reads, read-after-write timing, and other performance indicators. Monitors check these metrics on the bus to assess performance.

In contrast, transaction-level debugging involves snooping the entire bus and tracking each transaction, often causing delays. For performance validation, the analysis is more streamlined, focusing on gaps between transactions, response latency, bandwidth usage, throttling, and backpressure management.

Performance Validation: The Role of HAV

Meeting verification requirements under realistic stress conditions necessitates the use of HAV platforms instead of traditional RTL simulation. Unlike RTL simulations, which are slow and impractical for running actual performance traffic, HAV platforms offer an efficient solution for thorough stress testing and performance measurement. HAV makes it possible to measure performance under real-world software and workload conditions.

In addition to supporting software bring-up and system validation, HAV platforms are increasingly driven by the need for precise power and performance analysis. HAV excels in measuring critical metrics like throughput and latency by counting clock cycles with exact precision. Testing these metrics requires real-world application payloads, as simple directed test cases are insufficient. A high-speed system is essential to execute complex application workloads effectively, ensuring meaningful and reliable performance evaluations.

To meet these demands, up to one-third of HAV resources are often dedicated solely to performance measurement. This allocation highlights the pivotal role HAV platforms play in modern performance validation, enabling engineers to address the complexities of today’s high-performance systems.

Performance Validation at the Firmware Layer

HAV plays a crucial role in performance tuning at the firmware level, an area gaining significant attention. For example, SSD providers1 frequently release updated firmware specifically designed to enhance performance, leveraging HAV to ensure these improvements are both measurable and reliable.

Firmware testing on actual silicon has become a vital part of performance validation frameworks. A main reason for adopting HAV is to enable the execution of firmware, which is not feasible in traditional simulation environments. The faster the validation platform, the better the ability to run real firmware effectively.

Running real firmware requires a PHY (physical layer). While PHY models do not include the full physical/analog properties, they facilitate the optimization of register access and other firmware interactions that impact performance. This early tuning can have a significant effect on overall system performance and efficiency.

The primary purpose of using a PHY model is to optimize firmware performance in conjunction with pre-silicon RTL, not to modify the RTL itself. This approach shifts the focus from measuring and validating the design’s performance to evaluating and enhancing system performance, including firmware, before chip release. This shift-left strategy allows teams to begin performance optimization much earlier in the development cycle.

Getting to the best performance

As outlined above, achieving optimal performance involves two key steps.

First, defining the optimal architecture to meet performance goals. This requires approximately timed models and a simulation and analysis framework that supports modeling and rapid simulation of various architectures and scenarios. Synopsys Platform Architect has become the industry-standard tool for this task, offering robust capabilities for exploring and optimizing system-level architectures.

Second, performance validation through emulation. The Synopsys ZeBu product family is critical for this stage, providing the fastest emulation performance available. Additionally, its extensive support for performance validation solutions enables both internal and external measurements while ensuring the ability to run accurate models of Synopsys PHY IPs. These capabilities are instrumental in delivering high-confidence validation results.

The question isn’t whether design teams should use these advanced tools, it’s how much time and resources they should invest in them. Greater investment in pre-silicon performance analysis and validation significantly increases the likelihood of delivering silicon with highly differentiated capabilities.

Read Part 1 of this series – Essential Performance Metrics to Validate SoC Performance Analysis

 

References

1: Update the firmware of your Samsung SSD

Also Read:

A Deep Dive into SoC Performance Analysis: What, Why, and How

Synopsys Brings Multi-Die Integration Closer with its 3DIO IP Solution and 3DIC Tools

Enhancing System Reliability with Digital Twins and Silicon Lifecycle Management (SLM)


2025 Outlook with Dr Axel Y. Poschmann of PQShield

2025 Outlook with Dr Axel Y. Poschmann of PQShield
by Daniel Nenni on 01-22-2025 at 6:00 am

Axel Poschmann PQShield

Tell us a little bit about yourself and your company.

The PQShield team helped define the new PQC (post-quantum cryptography) standards that will be used to replace current encryption that is vulnerable to attack by quantum computers. Now, we work with international blue-chip organizations, disruptive scale-ups, and national bodies throughout the technology supply chain to deliver the secure transition to quantum safety.

I have worked in hardware security for the past 20 years across Asia, Europe, the US and Middle East in industry and academia. In a time when quantum computers will soon be able to break current cryptography methods, I am focused on empowering organizations, industries and nations with the quantum-resistant cryptography solutions they need to protect themselves.

What was the most exciting high point of 2024 for your company?

This year was a momentous one in the history of post-quantum cryptography with the publication of the NIST PQC standards FIPS 203, FIPS 204, and FIPS 205. This marked the culmination of eight years of hard work from the global cryptographic community and was also a high point for the PQShield team, who contributed to all three of the final standards.

But more exciting is what comes next. The NIST standards have fired the starting gun for the PQC transition, as businesses armed with these standards now have the tools to implement their PQC transition roadmaps. After years of discussions around crypto discovery, we can finally focus on the secure implementation of PQC, an area particularly close to my heart – particularly looking at hardware implementations and resistance to side-channel and fault injection attacks (SCA and FI).

What was the biggest challenge your company faced in 2024?

The challenge we face is that we are replacing RSA, ECDSA and similar encryption – well understood and thoroughly tested over many years – with PQC, which is fundamentally new, based on different mathematics, and not a like-for-like replacement. There will be hurdles to cross as we work to deliver the most fundamental upgrade to our cybersecurity infrastructure in a generation.

As anyone in cybersecurity knows, attackers are always working to find new vulnerabilities and methods to crack encryption. As we roll out PQC across our digital infrastructure, our work is focused on ensuring that every line of code we write, every mathematical problem we solve, and every interaction we make is focused on one specific goal: keeping us all one step ahead of the attackers.

How is your company’s work addressing this biggest challenge?

A significant milestone for us was the certification of our  PQCryptoLib, PQShield’s hybrid cryptographic library, which has achieved FIPS-140-3 certification under the NIST CMVP process.

This represents a huge three-year team effort. PQCryptoLib is the library that underpins many of PQShield’s products – including the PQPlatform hardware IP family. While there will be many iterations of our products put forward for certification, this achievement represents a quality threshold that can now be attained by PQC.

Off the back of this effort, towards the summer of 2024 we introduced our first fully functional PQC silicon test chip. By building our own ASIC, we can now demonstrate and test our IP in the way that a customer will use it. We’re able to evaluate its operation in real detail, looking at how to be compliant against the NIST standards and perform security testing in a way that would be practically difficult on a customer product deployed in the field.

As we look forward to next year, we will start to see hardware manufacturers bringing new PQC products to market and we are primed as key partners to help them on that journey.

What do you think the biggest growth area for 2025 will be, and why?

For the vast majority of organizations, their ability to transition to PQC will be dependent on their supply chain’s ability to deliver PQC secure products. Therefore, businesses that sit at the foundation of the supply chain – particularly semiconductor manufacturers – are primed for growth and disruption.

As our lives are increasingly digitized through the cloud, businesses operate more advanced industrial IoT, and AI continues to drive demand for high throughput semiconductors, the introduction of PQC enabled hardware is only going to increase demand in this highly competitive sector.

Following the announcement of NIST standards, I expect we will be ending 2025 with quantum security firmly on the agenda of every boardroom in the global technology supply chain.

How is your company’s work addressing this growth?

PQShield is already well placed to help the semiconductor and hardware industries meet this demand. We now have long standing collaborations with Microchip Technologies, AMD and Lattice Semiconductors among others to help develop PQC solutions. Our extensive product suite is helping customers to implement PQC into their design pipelines to ensure quantum secure products reach the market in the new year.

To help us meet this growing demand, we have significantly expanded our corporate function to support global expansion across Europe, the US and Asia. This includes additions to our executive and strategic advisory board, with Antonio J. Viana (BrainChip, Arteris, Parsley, former Arm executive) joining as Non-Executive Director alongside three new additions to our strategic advisory board to accelerate growth into 2025: Mike Muller (co-founder and former CTO, Arm), Rose Schooler (former CVP, Intel, and current Arm board member), and Ian Drew (former chairman at Foundries.io, and CMO at Arm).

Knowing we’re on the precipice of the biggest technological transition in a generation, we’re confident that we have the team and the products to help the market grow in 2025.

What conferences did you attend in 2024 and how was the traffic?

Events are a key opportunity for us to meet our customers and help them to address their questions and concerns around PQC. Two big tentpole events for us last year were Mobile World Congress (MWC) in Barcelona and RSA in San Francisco. At both, we were able to showcase our collaboration with AMD and demonstrate how PQShield’s PQPerform PQC hardware accelerator was installed on the programmable logic of the AMD Versal Adaptive SoC.

Will you attend conferences in 2025? Same or more?

We will be back at MWC and RSA again next year and will be showing how our products have progressed following the publication of NIST’s standards.

Our team loves to get out and about and we have over 20 conferences we plan to attend just in the first half of 2025 alone! To name a few we have CES, Embedded World, CyberUK, DAC, DSEI 2025 and many others.

How do customers engage with your company?

You can connect with us on LinkedIn where we regularly highlight the events we’re attending as well as our latest research. We also have a monthly newsletter that shares the latest developments in PQC and at PQShield.

Get in touch if you have any concerns about planning your own PQC transition as the industry enters the execution phase. Our team has experience across the full spectrum of industry sectors and potential use cases, and is already advising both governments and global enterprises on this transition.

Additional questions or final comments?

Quantum-safe secure boot and PQ/T hybrid requirements are the main challenges moving forward.

The foundation of modern cybersecurity lies in the secure boot process, ensuring only trusted and authenticated software runs on a device. By validating code integrity through cryptographic signatures, secure boot upholds the Confidentiality, Integrity, and Availability triad, acting as the first line of defense against tampering, malware, and unauthorized changes.

The European Union and relevant agencies, such as ANSSI and BSI, advocate for a Post-Quantum/Traditional (PQ/T) hybrid cryptographic model, combining quantum-resistant algorithms with traditional cryptography for added resilience. Implementing quantum-safe secure boot remains challenging due to the performance, scalability, and compliance trade-offs of PQ/T solutions.

I am excited that we are developing a flexible Root of Trust to address this challenge, enabling diverse platforms—embedded systems, edge devices, and Critical National Infrastructure—to transition to quantum-resistant architectures seamlessly.

About PQShield

PQShield comprises a world-class collaboration of post-quantum cryptographers, engineers, and operators. We’ve helped shape all of the first international PQC NIST standards, and we were the first cybersecurity company to develop quantum-safe cryptography on chips, in applications, and in the cloud.

Also Read:

PQShield Demystifies Post-Quantum Cryptography with Leadership Lounge

PQShield Builds the First-Ever Post-Quantum Cryptography Chip

One Step Ahead of the Quantum Threat


2025 Outlook with Larry Zu of Sarcina Technology

2025 Outlook with Larry Zu of Sarcina Technology
by Daniel Nenni on 01-21-2025 at 10:00 am

Larry Zu

Tell us a little bit about yourself and your company. 

Larry Zu

I’m Larry Zu, Founder and CEO of Sarcina Technology. I’ve grown Sarcina from just designing packages for a few small companies to handling the entire post-silicon ecosystem, including package design, assembly, testing, qualification and production services for the top semiconductor companies in the world. I began my career at Bell Labs, before moving to DEC, Intel, and TSMC.  Along the way, I acquired deep skills on how to develop successful products including the Alpha, Itanium 2, Pentium 4, and XBOX 360 microprocessors.

Over my career, I have taped out nearly 1,000 packages with a greater than 99% first tape-out success rate. I’ve applied those skills to build Sarcina, a company that works with the world’s top foundries to ensure high quality products. We manage from the simplest to the most complex of packages. Companies forward their wafers from their foundries and Sarcina does the rest.  Wafers in, packaged chips out.

What was the most exciting high point of 2024 for your company? 

There were many great successes in 2024, so this is a difficult question. If I had to pick one, perhaps I would cite our work on Bump Pitch Transformers (BPT). I know it’s an odd name, but what this work does is reduce the cost and complexity of 2.5D package designs.

Current advanced 2.5D packaging uses a substrate to transpose a chip’s microbump pitch from 40-50 micrometers to the package’s 130 micrometer bump pitch. This is typically done with a silicon TSV (through-silicon via) interposer. These substrates are very expensive, in short supply, and complex to design, resulting in lead-time and cost challenges for many advanced designs.

Our BPT approach uses RDL interconnect or silicon bridge technologies, replacing silicon TSV interposers with more cost-effective re-distribution layers (RDL). This architecture is ideal for homogeneous and heterogeneous chiplet integration, targeting high-performance computing (HPC) devices for AI, data center, microprocessor, and networking applications.

What was the biggest challenge your company faced in 2024? 

Our biggest challenge is actually not a technical one. Sarcina’s strength and fundamental differentiation is our ability to complete high-performance engineering projects. Over the past 12 years, Sarcina has taped out more than 100 packages, all first-time successes. We’ve never re-taped out a single package.

The challenge is to get the word out to more companies who can benefit from our capabilities. We can help small to mid-sized ASIC companies and large system houses be more successful.

How is your company’s work addressing this biggest challenge?  

I personally do a lot of presentations at many trade shows and industry events to help spread the word about Sarcina’s Application Specific Advanced Package (ASAP) Service. Our work here on SemiWiki is also a key part of that strategy.

What do you think the biggest growth area for 2025 will be, and why?

Advanced packaging is now setting the trend for the next level of innovation. The know-how to integrate multiple devices in an advanced package provides the margin of victory. Sarcina is at the forefront, enabling these trends.

There will be growth in many areas as a result. Some markets we are currently enabling include AI, networking, data center, high-speed comms, and medical.

How is your company’s work addressing this growth? 

We continue to build more advanced flows that embody our substantial experience. Our partnerships also help to expand our reach and impact. The work we are doing with Keysight is an example of this. So is the work we are doing with Intel Foundry Services (IFS) Accelerator Design Services Alliance.

What conferences did you attend in 2024 and how was the traffic?

We attended quite a few events in 2024:

  • Chiplet Summit
  • OFC (Optical Fiber Communications)
  • IEEE MTT-S International Microwave Symposium
  • Silicon Catalyst Spring Portfolio Conference
  • Design Automation Conference (DAC) (I was a speaker at the Keysight Theater)
  • IEEE Electronics System-Integration Technology Conference (ESTC)
  • Silicon Catalyst Semiconductor Industry Forum

All these conferences are packed with people because they address hot topics in high performance computing and communication for AI applications inside a semiconductor ASIC chip. As semiconductor packaging becomes more and more important to build advanced ASIC chips, we observe more traffic to our booth during these conferences.

Will you attend conferences in 2025? Same or more?

We plan to attend similar shows in 2025, with some possible additions.  You can visit https://sarcinatech.com/upcoming-events/ to see the latest plans we have for show attendance.

How do customers engage with your company?

You can certainly stop by and visit us at the shows we will attend. You can also reach out to us on our website here: https://sarcinatech.com/contact/. We’ll respond quickly and work with you to define how we can make you more successful.

Additional questions or final comments? 

Semiconductor technology is evolving rapidly. Monolithic integration is being replaced by complex multi-chip system in package design.  These designs represent substantial challenges with many new effects to be modeled and tamed. Sarcina has the experience, skills and track record to help you overcome these challenges. Give us a call and find your margin of victory.

Also Read:

Sarcina Democratizes 2.5D Package Design with Bump Pitch Transformers

How Sarcina Revolutionizes Advanced Packaging #61DAC

Sarcina Teams with Keysight to Deliver Advanced Packages


2025 Outlook with Dr. Chouki Aktouf of Defacto

2025 Outlook with Dr. Chouki Aktouf of Defacto
by Daniel Nenni on 01-21-2025 at 6:00 am

Picture Chouki

Chouki Aktouf is Founder & CEO of Defacto Technologies and Co-Founder of Innova Advanced Technologies.  Prior to founding Defacto in 2003, Dr. Aktouf was an associate professor of Computer Science at the University of Grenoble – France and leader of a dependability research group. He holds a PhD in Electric Engineering from Grenoble University.

Tell us a little bit about your company. 

We provide since more than two decades innovative SoC design solutions for RTL designers and SoC architects. Defacto’s SoC Compiler tool is becoming the “De Facto” software to build large SoCs pre-synthesis by including not only RTL but also IP-XACT and design collaterals such as UPF and SDC. The Physically awareness of the Defacto tool strengthens its market positioning to meet aggressive PPA goals. The company is also known by its high-quality support which is provided to the end-users and also the innovation Defacto brings every year to the market to help building SoCs faster and cheaper.

What was the most exciting high point of 2024 for your company? 

The main accomplishment of Defacto was to position as a real leader in the front-end SoC integration, when having RTL but not only. IP-XACT, UPF, and SDC also need to be considered towards better efficiency, and cost.

What was the biggest challenge your company faced in 2024? 

In 2024, one of the biggest challenge was to succeed in R&D projects considering AI technologies. In the new Defacto products, we will be announcing AI-based automation to confirm our tool as the De Facto solution for SoC creation pre synthesis and help designers even with less expertise to benefit from the tool.

How is your company’s work addressing this biggest challenge? 

We work closely with leading R&D teams in France and in Europe to help solving technical challenges.

What do you think the biggest growth area for 2025 will be?

We believe AI-based EDA will be the main topic for the coming year.

How is your company’s work addressing this growth? 

 The company has engaged since several years with best Research labs in Europe to work closely on advanced AI-based technologies for EDA.

What conferences did you attend in 2024 and how was the traffic?

The main conference we attended this year was DAC. We feel that DAC is coming back from COVID since the past year and we were pleased to see a good affluence, in particular during the first day. We eager to see 2025!

Will you attend conferences in 2025? Same or more?

In 2025 we plan to attend DATE which will be close to our Headquarters in Grenoble, France. Of course DAC will be the main event and we will be announcing big new capabilities. We also plan to attend ITC since we have a regrowth activity around DFT with many news to highlight.

How do customers engage with your company?

The best is either to drop us an email (info_req@defactotech.com) or contact us on  website (https://defactotech.com/contact). We are known in the market as highly reactive, in both technical and business sides. So we encourage to contact us to set up presentations, demos and evaluations.

We also have an upcoming Innova Webinar that you can also attend:

How to track and predict design resources for complex chip design projects by including jointly cost and sustainability

We hope to meet you there.

Also Read:

Build a 100% Python-based Design environment for Large SoC Designs

Defacto Technologies and ARM, Joint SoC Flow at #61DAC

A Joint Solution Toward SoC Design “Exploration and Integration” released by Defacto #61DAC


Synopsys Brings Embedded Memory to the Future with its Flexible, IP-Based Compilers

Synopsys Brings Embedded Memory to the Future with its Flexible, IP-Based Compilers
by Mike Gianfagna on 01-20-2025 at 6:00 am

Synopsys Brings Embedded Memory to the Future with its Flexible, IP Based Compilers

There is a revolution happening that is fueled by innovation in areas such as AI, IoT and autonomous driving. These new systems put incredible stress on next-generation semiconductor technology. Faster processing, higher density and lower latency must all be delivered with reduced power and thermal profiles. One technology has become the centerpiece for much of these advances – memory. And within that discipline the need for dramatically improved embedded non-volatile memory. Synopsys is at the forefront of innovation here. Let’s find out how Synopsys brings embedded memory to the future with its flexible, IP-based compilers.

Embedded NVRAM – The Options

Flash has been the go-to option for embedded non-volatile memory for a long time. But as applications demand much more non-volatile storage and processes shrink below 28nm, flash memory is running out of steam. A new approach is needed to deliver high-speed data collection, transmission, storage, and analysis at scale. 

Two emerging technologies are gaining traction – Magneto-Resistive Random Access Memory (MRAM) and Resistive Random Access Memory (RRAM). These embedded memory options deliver the density, capacity, and scalability for next-generation systems. It turns out each is optimized for different applications and use cases. Let’s examine some of the differences.

MRAM: delivers higher reliability and superior power, performance, and area (PPA), even in extreme environments. Initially developed for aerospace applications, it uses an adjustable magnetic layer to maximize storage density. And its exceptional power and performance characteristics are ideal for applications requiring the highest levels of reliability and data integrity.

The technology is useful for vehicles that need over-the-air software updates for example.  A consideration for this technology is its sensitivity to strong magnetic fields. This may be mitigated with physical placement constraints or shielding in certain environments, adding complexity for some applications.

RRAM: is still in the early stages of market awareness and adoption. This technology uses a dielectric layer to store data. It isn’t sensitive to magnetic fields like MRAM, but it is less reliable in extreme environments.

Low cost and energy consumption combined with high density and scalability make RRAM a good choice for IoT devices, wearables, in-room sensors, and other applications requiring cost, power, and space efficiency. RRAM is also being used in automotive applications where environmental conditions can be managed.

Each of these technologies has a place, and design teams need comprehensive access to each to find the best answer. This is where Synopsys brings embedded memory to the future with its flexible, IP-based compilers.

The Synopsys Approach

Thanks to its IP-based compiler solutions, Synopsys can streamline MRAM and RRAM integration. Most suppliers offer a limited set of fixed macro options for embedded memory. With its IP-based compiler solutions, Synopsys provides comprehensive and configurable choices, allowing design teams to instantly build a wide range of macros and precisely match memory sizes and aspect ratios with MCU requirements.

For example, the MRAM Compiler is well-suited for newer applications with simplified power supply requirements, built-in self-test (BIST) and repair, and error correction code (ECC). In addition to accelerating system-on-chip (SoC) integration and time-to-market, it addresses the growing demand for reliable, cost-effective, efficient memory in AI-enabled applications.

The figure below illustrates how configurable MRAM IP provides flexibility for multiple word widths, aspect ratios, and floorplan optimizations.

Configurable MRAM IP

Synopsys is actively developing MRAM in the TSMC 22ULL and TSMC 16FFC processes. The company is also developing automotive MRAM and RRAM compilers in the GlobalFoundries 22FDX process, and they have demonstrated successful MRAM silicon on the 22ULL process, enabling SoC designers with low-risk solutions. Data retention, write endurance, and magnetic immunity testing results have met or exceeded design targets.

Leading foundries have announced roadmaps for additional MRAM and RRAM enablement, including FinFET solutions at 6nm and beyond. Synopsys has stated it will continue advancing next-gen memory technologies and help redefine the future of embedded systems.

To Learn More

You can read an informative blog from Synopsys entitled, Flash Forward: MRAM and RRAM Bring Embedded Memory and Applications into the Future here. You can also access the web page for Synopsys MRAM and RRAM IP here. That page also has very useful links to access a foundation IP selector and a non-volatile memory IP selector. And that’s how Synopsys brings embedded memory to the future with its flexible, IP-based compilers.

Also Read:

Synopsys Brings Multi-Die Integration Closer with its 3DIO IP Solution and 3DIC Tools

Enhancing System Reliability with Digital Twins and Silicon Lifecycle Management (SLM)

A Master Class with Ansys and Synopsys, The Latest Advances in Multi-Die Design


Podcast EP270: A tour of the Q3 2024 Semi Electronic Design Market Data Report with Wally Rhines

Podcast EP270: A tour of the Q3 2024 Semi Electronic Design Market Data Report with Wally Rhines
by Daniel Nenni on 01-17-2025 at 10:00 am

Dan is joined by Dr. Walden Rhines. Wally is a lot of things, CEO of Cornami, board member, advisor to many and friend to all. Today he is the Executive Sponsor of the SEMI Electronic Design Market Data report.

Dan explores the recently published report with Wally. Overall growth was 8.8%, a strong number but not as large as prior quarters. However, Wally does report that overall EDA revenue has reached a $20B run rate for the first time, a substantial achievement. Wally and Dan explore the details of the report, including the areas of strong growth and the reasons why. There were two regions that exhibited weaker growth as well. Dan explores the reasons for this with Wally. Some interesting insights about overall market dynamics come out of that discussion.

There are many other insightful discussions, including the strong growth in services and what that can mean for the future of the industry. The views, thoughts, and opinions expressed in these podcasts belong solely to the speaker, and not to the speaker’s employer, organization, committee or any other group or individual


CEO Interview: John Chang of Jmem Technology Co., Ltd.

CEO Interview: John Chang of Jmem Technology Co., Ltd.
by Daniel Nenni on 01-17-2025 at 6:00 am

Jmem Tek CEO John

John Chang, founder and CEO of JMEMTEK, combines technical expertise and business acumen to lead the company in addressing critical hardware security challenges. With a PhD candidate in Electro Physics at National Yang Ming Chiao Tung University and dual bachelor’s degrees in Electrical Engineering and Banking and Finance from the Queensland University of Technology, John bridges innovation and strategy seamlessly.

Since founding JMEMTEK in 2022, John has secured over $6 million in funding. His decade-long experience in semiconductor innovation and failure analysis, reinforces JMEMTEK’s position as a leader in hardware security and post-quantum cryptography.

With John’s vision, JMEMTEK continues to drive advancements for industries like FinTech, Defense Tech, and AIoT, shaping the future of secure and scalable technologies in the new quantum era.

Can you tell us about Jmem Technology and its core mission?

Jmem Technology Co., Ltd. is a pioneering company specializing in hardware security IP and IC design services. Our primary mission is to address the growing cybersecurity challenges posed by the advent of quantum computing and emerging threats in the digital age. We focus on developing cutting-edge Post-Quantum Cryptography (PQC) solutions and our foremost technologies on Roof of Trust like J-Physical Unclonable Function (JPUF) technology to deliver robust and scalable security for industries such as FinTech, Defense, and AIoT.

Our vision is simple yet bold: to build a secure digital future by safeguarding critical infrastructures with advanced hardware solutions. This vision drives everything we do, from R&D to partnerships with academia and industry leaders.

What sets Jmem Technology apart in the market?

Jmem Tek stands out because of our dual focus on innovation and practicality. For instance, our proprietary PQC security chip, powered by JPUF technology, not only generates and stores cryptographic keys securely but also enables tamper-proof authentication and secure OTA firmware updates.

Our technology is also designed to be highly scalable, making it adaptable to a wide range of applications—from protecting sensitive data in autonomous vehicles to securing critical systems in defense. Unlike software-based security measures, our hardware-based solutions offer unparalleled protection against cloning, reverse engineering, and other sophisticated attacks. With our chip our solutions can outperformed PQC on software up to few-hundreds times.

Additionally, we have cultivated strong collaborations with globally respected research institutions and corporate partners, including Andes Technology, UMC and co-author with HSSC on Side Channel attack topic. These partnerships validate our technological approach and open doors to new markets and opportunities.

How has Silicon Catalyst supported Jmem Technology’s journey?

Becoming a portfolio company of Silicon Catalyst has been transformative for Jmem Tek. The program offers unparalleled access to mentorship, industry connections, and technical resources. This support has accelerated our product development and market expansion, particularly in the U.S. and Europe.

One of the key benefits is the opportunity to engage with Silicon Catalyst’s extensive network of industry veterans, who provide invaluable insights and guidance as we scale. Additionally, being associated with Silicon Catalyst enhances our credibility as an innovative leader in hardware security, helping us forge stronger relationships with investors and partners.

What industries and applications do you see benefiting most from Jmem Technology’s solutions?

The versatility of our solutions allows us to cater to a diverse range of industries. Our PQC and PUF technologies are particularly valuable for:

  • FinTech: Ensuring secure transactions and safeguarding sensitive financial data.
  • Defense: Protecting mission-critical systems and communications against cyber threats.
  • AIoT: Enabling secure device connectivity and data exchange in smart environments.

As quantum computing continues to evolve, the demand for hardware-based security solutions will only grow, especially in sectors where data confidentiality and system integrity are paramount.

What are Jmem Technology’s plans for the future?

Our immediate goal is to expand our reach into new markets, particularly in Europe and North America, while strengthening our foothold in Taiwan’s semiconductor ecosystem. We’re also focused on advancing our research and development to further enhance the performance and versatility of our PQC and JPUF solutions.

Looking ahead, we aim to deepen our collaborations with strategic partners and academic institutions, leveraging their expertise to refine our technology and explore new applications. Ultimately, our mission is to create a world where every digital interaction is secure, no matter how advanced the threats become.

What excites you most about the future of hardware security?

The rapid advancement of quantum computing poses both challenges and opportunities. While it introduces new vulnerabilities, it also pushes us to innovate faster and smarter. We are excited about the role Jmem Tek can play in this transformative period, helping industries adapt and thrive in the face of unprecedented change, not just secure, but also enhancing the efficiency.

By staying ahead of the curve, we’re not just solving today’s problems—we’re building the foundation for a secure and resilient digital future.

For more information about Jmem Technology, visit https://jmemtek.com.

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Accelerating FPGA-Based SoC Prototyping

Accelerating FPGA-Based SoC Prototyping
by Kalar Rajendiran on 01-16-2025 at 10:00 am

S2C Image for SoC Prototyping Blog

FPGA-based prototyping offers advantages such as high-speed operation, real-world environment testing, and parallel execution that cannot be matched by software simulations alone. It enables developers to validate their designs and initiate software development long before the final silicon is ready. At the same time, prototyping is not merely just an FPGA board, and many factors need to be considered when it comes to rapid and effective implementation. Accelerating FPGA prototyping requires a combination of advanced hardware capabilities, improved design methodologies, efficient debugging tools, and reliable software automation. By leveraging these approaches, engineers can significantly reduce prototyping time while maintaining accuracy and performance.

The Challenges of Prototyping for SoC Development

One of the major hurdles in SoC prototyping is ensuring a realistic testing environment that accurately simulates real-world chip behavior. Additionally, challenges such as managing partitioning for large-scale designs and achieving stable communication between high-speed and low-speed devices add to the complexity. Without the right tools and strategies, development teams face significant delays and increased risk during the prototyping phase, which can impact their ability to meet project deadlines and deliver quality products to the market.

Innovative Approaches to Overcoming Prototyping Hurdles

To address these challenges, several innovative approaches have emerged. Flexible interfaces, such as configurable daughter boards, enable rapid connection to external devices and mimic real-world conditions, allowing developers to validate designs in realistic environments. Speed adapter solutions ensure seamless communication between devices operating at different speeds, which is critical for high-speed interfaces like PCIe or advanced memory standards like LPDDR4/5. Co-simulation tools and reference designs streamline the debugging process by facilitating efficient data exchange and providing pre-validated solutions, reducing the need for custom development. Furthermore, optimized design partitioning and FPGA interconnecting topology play a vital role in managing the complexities of large-scale SoC designs, allowing for iterative mapping of components while maximizing system scalability.

S2C’s Prodigy Prototyping Solutions

S2C’s Prodigy Prototyping Solutions address key challenges in FPGA-based SoC prototyping through flexible hardware, reliable software tools, and streamlined processes.

Flexible Daughter Boards for Seamless Integration

S2C’s Prodigy platform features a vast library of daughter boards supporting applications ranging from communications and SoC to storage and multimedia, including various gigabit Ethernet interfaces, QSFP28/QSFPDD, PCIe, USB, LPDDR4/DDR4, QSPI, EMMC, MIPI D-PHY and HDMI. These modular daughter boards, pre-validated to meet industry standards, simplify system setup and reduce development risks.

Speed Adapter and Memory Models to Bridge the Gap

To overcome the limitations of FPGA-based systems in handling high-speed protocols or the latest memory interfaces, S2C offers speed adapter and memory model solutions to support the device under test in the FPGA environment. This is particularly useful in validating PCIe subsystem not running at real-world speed or advanced memory controllers such as DDR5/HBM, where FPGA vendors often lack suitable PHY IPs. S2C’s PCIe speed adapter can act as a gear shift between two different PCIe speeds while memory models allow customers to validate LPDDR5/DDR5/HBM based memory controllers by bridging gaps to FPGA’s DDR4 PHYs, addressing critical bottlenecks.

High Productivity Toolchain to Streamline Large-scale SoC Designs

Software/hardware co-development with ProtoBridge™: ProtoBridge enables high-throughput data exchange between FPGA prototypes and PC hosts at speed up to 4GB/s utilizing PCIe connectivity. With ready-to-use C APIs on host PC and bridging AXI-4 master/slave IPs running in the DUT, large data such as videos, software applications or operating systems can be uploaded with ease. ProtoBridge is also a critical building block for co-simulation and other co-development applications.

Remote Runtime Management with PlayerPro – Runtime (PPro-RT): Prototyping can be remotely managed and download designs over Ethernet/USB by PPro-RT. With hardware self-tests, virtual I/O tools, and design resource access, it simplifies multi-system management, ensuring effective hardware validation and streamlined firmware testing.

Deep trace and multi-FPGA debugging with PlayerPro – DebugTime (PPro-DT): PPro-DT allows users to pre-select the signals to be observed before compilation and define the trigger conditions to start a data capture. During runtime, the selected signals are captured and stored in an external DDR4 memory for analysis.

Multi-FPGA prototyping with Player Pro – Compile Time (PPro-CT): PPro-CT is a timing-driven partitioning software enables one-click flow from RTL to bitstream, simplifying the steps of large design partitioning with features such as system level STA, high-performance TDM assignment and incremental compilation.

The Benefits of S2C’s Solutions

By providing a near-realistic environment for software validation, S2C’s customers reduce the likelihood of costly rework after silicon fabrication, ensuring a smoother transition to final production. Development teams improve efficiency by leveraging pre-validated components and automated tools, which minimize errors and streamline the prototyping process. The tools also save engineering resources, allowing developers to focus on innovation rather than labor-intensive setup and troubleshooting tasks. Faster time-to-market is achieved as these solutions significantly reduce the time required for debugging and verification, enabling teams to meet tight deadlines.

Summary

The success of FPGA-based prototyping hinges on overcoming several key challenges. By integrating flexible interfaces, speed adapter solutions, advanced co-simulation tools, and high productivity toolchain, S2C’s Prodigy Prototyping Solutions address these challenges head-on. The S2C Prodigy platform empowers development teams to reduce risk, validate designs more efficiently, and deliver products to market faster, making it an invaluable tool in the fast-paced world of chip design.

Learn more at https://www.s2cinc.com/products/

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MCUs Are Now Embracing Mainstream NoCs

MCUs Are Now Embracing Mainstream NoCs
by Bernard Murphy on 01-16-2025 at 6:00 am

MCU applications

The moral of today’s story is that to succeed in a late-adopter market, sometimes you just have to wait for the market to catch up (assuming you have a strong early adopter market to buy your product today). I have been working with Arteris for 6+ years now promoting their NoC technology, and there was never any question that they offer significant value for design teams building big, complex systems-on-chip connecting multiple IPs through extensive networks. Such systems include application processors and, more recently, AI systems for automotive applications. Lower-end designs, commonly MCUs, had been more resistant to the benefits of Arteris technology. But as AI, safety, and security are becoming just as important in MCUs as elsewhere, even MCU design teams are rethinking their earlier strategies.

Evolving MCU demands

Historically, MCUs have served relatively bounded objectives like control units in car engines and home appliances. The architecture was comparably simple: an 8-bit processor, memory, peripherals, timers, counters. One initiator, a few targets, easily satisfied by crossbar switch interconnect. Design support teams often built their own generators for this kind of interconnect. A small number even built their own NoC generators to handle more complex system interconnects.

Now even legacy in-house generators are coming under pressure, in part through competitive and regulatory requirements and in part to meet scalability expectations. AI is everywhere, as much in MCUs as anywhere else to support intelligent sensing. Automation demands for smart homes, cars, cities, factories, all require smart MCUs with communication support. Many must also prioritize safety and security, all at very constrained cost and power demand per unit. Cities and factories planning to deploy thousands of devices want unit prices around a few dollars at most and even lower maintenance costs.

MCUs are growing up to meet these needs; now it’s not always easy to tell where MCUs end and SoCs begin. According to Andy Nightingale (VP Product Management and Marketing, Arteris), MCUs span a long tail beyond SoCs, from complex all the way down to simple devices. Simple MCUs still have their uses where cost is more important than adding features (simple toys or basic home thermostats, for example), but above wherever that breakpoint might be, more functions must be supported on-chip and that invariably requires NoC connectivity.

The drivers to mainstream NoCs

What is motivating change at the simpler end of this MCU range? In part, power reduction. Networks burn power even when there’s no traffic, a fact easy to overlook when concentrating on minimizing power in endpoint IPs. This power component alone can be an important overhead, unless you are using a network like Arteris FlexNoC which supports power domain switching and DVFS within the network.

Safety standards have become another driver. If the MCU is going into any safety-critical application (car, aircraft, industrial robotics, …) you must demonstrate compliance to applicable standards, again as much for the network as for the endpoint IP. Arteris has already done the groundwork against both ASIL B and ASIL D for automotive applications.

At higher complexities, many requirements making NoCs essential in SoC design have become just as relevant in MCU design. Support for multiple protocols (AXI, ACE-lite, ACE, CHI, APB, etc.) is unavoidable in designs using both legacy and 3rd party IP, and acceptable performance for systems with multiple initiators and targets is only possible through the packetization offered by NoCs.

AI accelerators, multicore processors, and again performance are pushing new network topologies: mesh, tree, Clos, even crossbars in some cases, demanding NoC generators with track records to provide support across this range. Meanwhile, network standards continue to evolve. In debug and parametric modeling, support for ATB 128-bit trace and now DVM 8.1 have become essential. AMBA 5 now supports “stashing” to improve memory utilization, latencies, and bandwidths, here also requiring support from the NoC generator. High-end goals can only be guaranteed with networks that constantly track these new demands.

For implementation, it is now clear that complex NoC design must be physically as well as architecturally aware right from the outset. Bus widths and serialization options can be optimized early on against rough floorplan concepts and later fine-tuned against realistic floorplans to best optimize area/performance tradeoffs. Just as logical/physical co-design appeared years ago in physical synthesis for block design, now the same need has become unavoidable in full system design.

Strategic planning for scalability

No design is an island, as some reuse expert might have said. What we build today must also factor into tomorrow’s plan for larger or repurposed designs. Or reuse may go in the opposite direction. Auto OEMs may first design a system for the high end of a car range, with intent to deploy the same system or a derated version in lower-end models in the future. In support of these goals, it is necessary to plan for a design infrastructure that can span seamlessly from low-end MCUs to high-end MCUs to SoCs, without need for fundamental network redesign.

Between the intrinsic flexibility of NoC-based networks and physically aware design, Arteris networks can easily span this range (since they are already widely deployed in high-end SoC design flows). Hierarchical NoCs are already as commonplace as hierarchical crossbar switches, so reuse methods are also well-proven. It seems pretty clear that NoC architectures are the way to go for scalability.

You can learn more about this topic HERE, the Arteris non-coherent FlexNoC architecture HERE, and their coherent Ncore architecture HERE.

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CES 2025: All In on AI and Proposed Tariffs

CES 2025: All In on AI and Proposed Tariffs
by Bill Jewell on 01-15-2025 at 2:00 pm

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CES 2025 was held last week in Las Vegas. We at Semiconductor Intelligence attended for our tenth CES. The event had over 140,000 attendees and over 4,500 exhibitors.

U.S. Consumer Electronics Market
Brian Comiskey of the Consumer Technology Association (CTA) presented on technology trends in 2025. The key theme was advances in AI and connectivity will lead to major changes in enterprise operations, consumer electronics, energy, mobility, smart homes and media. Comiskey presented CTA’s forecast for the U.S. consumer electronics market.

After strong growth in 2021 due to recovery from the pandemic, the overall U.S. electronics market fell in 2022 and 2023. The market turned positive in 2024, with 2.5% growth. The expectation is for stronger growth in 2025 at 3.2%.

However, there is much uncertainty about the outlook in 2025. U.S. President-elect Donald Trump has proposed new tariffs on imports to the U.S. Two proposals are:

• A 60% tariff on imports from China and a 10% tariff on other imports.

• A 100% tariff on imports from China and a 20% tariff on other imports.

The CTA conducted a study on the potential impact on the U.S. electronics market if these tariffs are enacted. Using the lower-tariff scenario, the price increases to consumer and the change in consumption due to the higher prices are:

Under the higher-tariff scenario, CTA estimates consumption of laptops & tablets would drop 68% and consumption of smartphones would drop 54%. Thus, the CTA forecast of 2.6% growth in the U.S. electronics hardware market in 2025 could instead be a major double-digit decline.

CES 2025 Themes

AI was the overriding theme of CES 2025. The kickoff keynote was by Jansen Huang, CEO of Nvidia, the dominant AI chip provider. Huang said AI will enable major advancements in technology. Every engineer, programmer and content creator will need an AI assistant to do their job effectively. AI has allowed advances in real-time image rendering which will have a major impact on video games, movies and television. AI will analyze physical world data to train robots. Huang predicted robots will become the largest technology industry in the not-too-distant future.

Nvidia’s Jensen Huang with AI enabled robots

Delta Airlines’ keynote was held in the Las Vegas Sphere, a 18,600-seat venue with the world’s largest video screen at 160,000 square feet. Delta Airlines CEO Ed Bastian spoke about using AI to analyze customer feedback and make air travel more personalized. Delta will partner with Joby to provide electric vertical take-off and landing (VTOL) aircraft to transport passengers from city centers to airports. Delta is also partnering with Uber to connect transportation to the airport with airline reservations.

Delta’s Ed Bastian in the Las Vegas Sphere

Samsung’s press conference emphasized home AI through its SmartThings system. Samsung has over 340 partners working on Smart Things applications. The goal is to use SmartThings to integrate and control TVs, appliances, smartphones, connected devices, lighting, heating and air conditioning. Samsung is working with Hyundai on automotive AI for electric vehicles. In a departure from the past, Samsung did not use the press conference to introduce any new TVs, smartphones, or appliances.

Among the other major consumer electronics companies, LG Electronics’ booth had a similar theme to Samsung – the AI home. Sony’s booth focused on a few areas including gaming, cameras and video entertainment.

Vehicle Technology

The West Hall of the Las Vegas convention center (LVCC) was devoted to Vehicle Technology and Advance Mobility. TIER IV exhibited an autonomous bus which is currently in operation in Japan. May Mobility showed an autonomous vehicle (AV) built using a Toyota vehicle. May will introduce AVs in partnership with Lyft in Atlanta later in 2025. Oshkosh displayed electric trucks including a fire truck, garbage truck and a delivery vehicle for the U.S. Postal Service. John Deere featured autonomous equipment for farming and construction. Chinese company Zeekr drew a crowd with its EVs featuring its Golden Battery which charges from 10% to 80% in 10.5 minutes. Waymo exhibited its AVs in partnership with Zeekr and Hyundai.

Oskosh electric fire truck

Interestingly, most of the major automakers did not have exhibits. Honda displayed its EV concept models, the Honda 0 Saloon and SUV. BMW showcased its Panoramic iDrive display which will be in all BMW models by the end of 2025. None of the other major automakers had displays at CES.

Robots

Robots were prominent at CES 2025. Robots on display performed tasks such as making coffee, serving food, greeting and providing information. Open Droids is introducing a series of robots to perform more complex household tasks such as unloading dishwashers, doing laundry, and cleaning. Numerous types of electric personal transportation were on display, including electric bikes, scooters, and even an electric surfboard.

CES 2025 continued the shift from consumer electronics being driven by traditional products such as TVs, smartphones and appliance to AI-enabled new products such as robots, electric vehicles and autonomous transportation. As a result, we are seeing much of the innovation being driven by start-up companies rather than large consumer electronics companies.

Semiconductor Intelligence is a consulting firm providing market analysis, market insights and company analysis for anyone involved in the semiconductor industry – manufacturers, designers, foundries, suppliers, users or investors. Please contact me if you would like further information.

Bill Jewell
Semiconductor Intelligence, LLC
billjewell@sc-iq.com

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