Wiki Tag: UCIe
UCIe 3.0 Wiki
UCIe 3.0 is the third major revision of the open, die-to-die interconnect standard for chiplets inside a package. Announced August 5, 2025, UCIe 3.0 doubles peak link speed over 2.0—introducing 48 GT/s and 64 GT/s modes—while adding manageability, power-efficiency, and reliability features aimed at scaling multi-die systems… Read More
Open Chiplet Architecture (OAC) Wiki
Open Chiplet Architecture (OCA) is an open standard developed by Tenstorrent to address the growing complexity and interoperability challenges of chiplet-based system design. Unlike monolithic SoCs, chiplet-based systems use multiple smaller dies—called chiplets—that are fabricated independently and integrated into… Read More
Intel EMIB (Embedded Multi-die Interconnect Bridge)
EMIB (Embedded Multi-die Interconnect Bridge) is an advanced 2.5D packaging technology developed by Intel that enables high-density, high-bandwidth, low-latency interconnects between chiplets (dies) within a single package—without requiring a full silicon interposer. EMIB offers a modular and scalable approach to … Read More
UCIe (Universal Chiplet Interconnect Express) Wiki
UCIe (Universal Chiplet Interconnect Express) is an open industry standard for die-to-die interconnects that enables high-bandwidth, low-latency, power-efficient communication between chiplets in advanced package architectures. The UCIe specification was launched in March 2022 by the UCIe Consortium, with founding… Read More
SerDes (Serializer/Deserializer) Wiki
Overview
SerDes (short for Serializer/Deserializer) is a high-speed circuit block used to convert parallel data to serial form and back again. It is widely used in integrated circuits, networking equipment, SoCs, and interconnect protocols to enable high-bandwidth data transmission over limited pin or channel resources.… Read More
MIPI Alliance Wiki
The MIPI Alliance (Mobile Industry Processor Interface Alliance) is a global, non-profit industry consortium that develops open interface specifications for mobile and mobile-influenced industries. These specifications standardize the interfaces between components in devices such as smartphones, tablets, cameras,… Read More
High Bandwidth Memory (HBM) Wiki
Overview
High Bandwidth Memory (HBM) is a high-performance RAM interface designed to deliver extremely wide I/O and low power consumption. It is primarily used in high-end GPUs, AI accelerators, supercomputers, and advanced FPGAs. HBM achieves high memory bandwidth by stacking multiple DRAM dies vertically and connecting… Read More
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