Wiki Tag: TSMC SoIC
Samsung X-Cube™ (eXtended-Cube)
Samsung X-Cube™ is a 3D IC packaging technology developed by Samsung Electronics that enables vertical stacking of multiple active logic dies using through-silicon vias (TSVs) and micro-bump bonding. As part of Samsung’s Advanced Package (AVP) portfolio—which also includes I-Cube™ (2.5D interposer-based packaging) and… Read More
Should the US Government Invest in Intel?