Wiki Tag: PowerVIA
Backside Power Delivery (BSPD) Wiki
Backside Power Delivery (BSPD), also called Backside Power Delivery Network (BSPDN) or backside power via (BPV) technology, is a semiconductor manufacturing innovation in which the chip’s primary power distribution network is relocated from the front side (transistor and signal interconnect layers) to the backside of the… Read More
Intel 18A(P) Process Technology Wiki
Intel 18A(P) (also referred to as Intel 18A+ or simply 18A Performance) is Intel’s upcoming advanced semiconductor process node, positioned as a refinement and performance enhancement of the base Intel 18A node. It marks a critical step in Intel’s roadmap to reclaim process leadership by the latter half of the 2020s, leveraging… Read More
Intel 3 vs. Intel 18A Wiki
Overview
Feature | Intel 3 | Intel 18A |
---|---|---|
Node Class | Enhanced 7nm (refinement of Intel 4) | 1.8nm-class full-node leap |
Transistor Type | FinFET | RibbonFET (GAAFET) |
Power Delivery | Front-side power only | Backside Power Delivery (PowerVia) |
EUV Use | Partial (select layers) | Extensive EUV, reduced multi-patterning |
PPA Target | Modest vs. Intel |
Intel 18A Process Technology Wiki
Node Name: Intel 18A
Process Class: ~1.8nm (Angstrom-class node)
Announced: July 2021
First Production Tapeout: Late 2024 (risk production)
High-Volume Manufacturing: Expected in 2025
Transistor Type: RibbonFET (Gate-All-Around)
Power Delivery: PowerVia (Backside Power Delivery Network)
Foundry Availability: Yes… Read More
Intel Backside Power Delivery (PowerVia) Wiki
Name: PowerVia™
Type: Backside Power Delivery Network (BSPDN)
Developer: Intel Corporation
First Production Node: Intel 20A (2nm-class)
Announced: July 2021
Expected Production Deployment: 2024 (Intel 20A), with high-volume in 2025
Successor Technologies: Integrated with RibbonFET (Intel’s Gate-All-Around)
Competes… Read More
Can RISC-V Help Recast the DPU Race?