Wiki Tag: Intel EMIB

Intel EMIB (Embedded Multi-die Interconnect Bridge)

Intel EMIB (Embedded Multi-die Interconnect Bridge)
by Daniel Nenni on 07-16-2025 at 9:39 pm

EMIB (Embedded Multi-die Interconnect Bridge) is an advanced 2.5D packaging technology developed by Intel that enables high-density, high-bandwidth, low-latency interconnects between chiplets (dies) within a single package—without requiring a full silicon interposer. EMIB offers a modular and scalable approach to … Read More

CoWoS® (Chip-on-Wafer-on-Substrate) Wiki

CoWoS® (Chip-on-Wafer-on-Substrate) Wiki
by Daniel Nenni on 07-16-2025 at 9:28 pm

CoWoS® (Chip-on-Wafer-on-Substrate) is a 2.5D advanced packaging technology developed by TSMC that allows multiple dies—including logic, memory, and analog ICs—to be integrated side-by-side on a high-density silicon interposer. CoWoS is a cornerstone of TSMC’s 3D Fabric™ platform and plays a critical role in enabling … Read More