The truth is that we are just at the beginning of the Artificial Intelligent (AI) revolution. The capabilities of AI are just now starting to show hints of what the future holds. For instance, cars are using large complex neural network models to not only understand their environment, but to also steer and control themselves. For… Read More
Tag: wafer scale
Die-to-Die Connections Crucial for SOCs built with Chiplets
If you ascribe to the notion that things move in circles, or concentrically, the move to die-to-die connectivity makes complete sense. Just as multi-chip modules (MCM) were the right technology decades ago to improve power, areas, performance and cost, the use of chiplets with die-to-die connections provides many advantages… Read More