Former TSMC President Don Brooks

Former TSMC President Don Brooks
by Daniel Nenni on 09-04-2023 at 6:00 am

Don Brooks

Don Brooks is well known to many long time semiconductor insiders, like myself, but most SemiWiki readers have probably never heard of him. Don is a semiconductor legend and here is his story. This will be in two parts since he had a big impact on the semiconductor industry and TSMC. From 1991 to 1997 Don served as President of TSMC and… Read More


The First TSMC CEO James E. Dykes

The First TSMC CEO James E. Dykes
by Daniel Nenni on 08-25-2023 at 6:00 am

James Dykes TSMC CEO (1)

Most people ( including ChatGPT) think Morris Chang was the first TSMC CEO but it was in fact Jim Dykes, a very interesting character in the semiconductor industry.

According to his eulogy: Jim came from the humblest of beginnings, easily sharing that he grew up in a house without running water and never had a bed of his own. But because… Read More


How Philips Saved TSMC

How Philips Saved TSMC
by Daniel Nenni on 08-21-2023 at 6:00 am

TSMC Philips

TSMC and Philips have deep historical ties. In fact, TSMC may not have existed without Philips. In the 1980s TSMC was established as a joint venture with Philips Electronics, the government of Taiwan, and other private investors. Several semiconductor companies were approached by Morris Chang for funding including semiconductor… Read More


Morris Chang’s Journey to Taiwan and TSMC

Morris Chang’s Journey to Taiwan and TSMC
by Daniel Nenni on 08-14-2023 at 6:00 am

Morris Chang 2023

High volume manufacturing is a 24/7 business with 12 hour shifts. You don’t always get to pick the shifts you want and you must cover for others when they can’t. It’s a challenging career and not for the faint of heart like myself.

In the 1980s and 1990s I spent time in Japan working with some of the top Japanese semiconductor manufacturers.… Read More


How Taiwan Saved the Semiconductor Industry

How Taiwan Saved the Semiconductor Industry
by Daniel Nenni on 08-07-2023 at 6:00 am

Taiwan USA

Now that semiconductors are front page news and a political football, I would like to write more about how we got to where we are today to better understand where semiconductors will go tomorrow. I will start this article with a provocative quote that really made me laugh and will put some context to what I am trying to accomplish here:… Read More


CEO Interview: Harry Peterson of Siloxit

CEO Interview: Harry Peterson of Siloxit
by Daniel Nenni on 08-04-2023 at 6:00 am

hwp photo

Harry Peterson is a mixed-signal chip designer with a BS in Physics from Caltech.  He managed IC design groups within Fairchild, Kodak, Philips, Northern Telecom, Toshiba and Pixelworks.  During sabbaticals he helped fly experiments on NASA’s orbiting satellite observatory (OSO-8) and build telescopes in the Canary… Read More


SEMICON West 2023 Summary – No recovery in sight – Next Year?

SEMICON West 2023 Summary – No recovery in sight – Next Year?
by Robert Maire on 07-15-2023 at 6:00 am

Semicon west 2023

-SEMICON well attended but bouncing along the biz bottom
-Recovery seems at least a year away with memory even more
-AI creates hope but not impactful- Disconnect tween stocks & reality
-AMAT me too platform- Back end benefits from chiplets

SEMICON busy but subdued

SEMICON is certainly back to pre-covid levels or perhaps better.… Read More


Intel Internal Foundry Model Webinar

Intel Internal Foundry Model Webinar
by Scotten Jones on 06-21-2023 at 12:00 pm

IAO Investor Webinar Slides to post on our INTC website PDF Page 07

Intel held a webinar today to discuss their IDM2.0 internal foundry model. On the call were Dave Zinsner Executive Vice President and Chief Financial Officer and Jason Grebe Corporate Vice President and General Manager of the Corporate Planning Group.

On a humorous note, the person moderating the attendee questions sounded … Read More


TSMC Doubles Down on Semiconductor Packaging!

TSMC Doubles Down on Semiconductor Packaging!
by Daniel Nenni on 06-14-2023 at 6:00 am

TSMC 3DFabric Integration

Last week TSMC announced the opening of an advanced backend fab for the expansion of the TSMC 3DFabric System Integration Technology. It’s a significant announcement as the chip packaging arms race with Intel and Samsung is heating up.

Fab 6 is TSMC’s first all-in-one advanced packaging and testing fab which is part of the… Read More


VLSI Symposium – Intel PowerVia Technology

VLSI Symposium – Intel PowerVia Technology
by Scotten Jones on 06-12-2023 at 6:00 am

Slide4

At the 2023 VLSI Symposium on Technology and Circuits, Intel presented two papers on their PowerVia technology. We received a pre-conference briefing on the technology embargoed until the conference began and received the papers.

Traditionally all interconnects have taken place on the front side of devices with signal and … Read More