Advances in Physical Verification and Thermal Modeling of 3DICs

Advances in Physical Verification and Thermal Modeling of 3DICs
by Peter Bennet on 02-07-2023 at 6:00 am

Fig 1 3DIC

If, like me, you’ve been paying too little attention to historically less glamorous areas of chip design like packaging, you’ll wake up one day and realize just how much things have changed and continue to advance and how interesting it’s become.

One of the main drivers here is the increasing use of chiplets to counter the decreasing… Read More