Complexity and density conspire to make power delivery very difficult for advanced SoCs. Signal integrity, power integrity, reliability and heat can seem to present unsolvable problems when it comes to efficient power management. There is just not enough room to get it all done with the routing layers available on the top side… Read More
Ansys 2024 R2: Thermal Integrity in the Ansys Electronics Desktop Update
Join us for an exclusive webinar during Ansys 2024 R2 updates. We’ll showcase significant enhancements to our Thermal Integrity tools. Discover the latest in Icepak, Mechanical Thermal, and Mechanical Structural, with expanded capabilities.
TIME:
JULY 18, 2024
11 AM EDT
Venue:
Virtual
Overview
This Ansys 2024 R2 webinar