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One of the most significant and oft repeated trends in EDA is the use of information from layout to help drive other parts of the design flow. This has happened with simulation and synthesis among other things. Of course, we think of test as a physical operation, but test pattern generation and sorting have been netlist based operations.… Read More
3D-IC has a stack of dies connected and packaged together, and therefore needs new testing strategies other than testing a single die. It’s given that a single defective die can render the whole of 3D-IC unusable, so each die in the stack must be completely and perfectly tested before its entry into that stack. Looking at it from a … Read More
