Power-Efficient RISC-V, DSP and NPU IP for Your Diverse SoC Processing Needs
As electronic systems continue to become more complex and integrate greater functionality, SoC developers are faced with the challenge of developing more powerful, yet more energy-efficient devices. The processors used in these applications must… Read More
Part 1 of this 4-part series introduces the complexities of developing and bringing up the entire software stack on a System on Chip (SoC) or Multi-die system. It explores various approaches to deployment, highlighting their specific objectives and the unique challenges they address.
Introduction
As the saying goes, it’s… Read More
Dan is joined by Mike O’Brien. Mike was recently the vice president of aerospace and government at Synopsys, He has 40 years of experience in the semiconductor, software and computer industries. In his 27 years in EDA and IP at Synopsys and Cadence, Mike helped build new lines of business including outsourced design services, research… Read More
Today, we find ourselves at the nexus of the fourth industrial revolution — an era dominated by Smart Everything. The internet, artificial intelligence, and the use of software are helping to create things that couldn’t even be imagined just a decade or two ago. The opportunities seem limitless, and the potential for more world-changing… Read More
Join us at Virtual Prototyping Day 2024 to hear about the latest deployed virtual prototyping innovations. This event highlights applications from around the world using the latest virtual prototyping technology, covering applications from automotive, AI, and data center domains.
Industry leaders will share their experiences… Read More
As the complexity of modern System-on-Chip (SoC) designs continues to rise, achieving energy efficiency measured as performance per watt has become a crucial design goal. With the increasing demand for powerful, multifunctional chips, balancing performance with power consumption has become essential. Realistic workloads… Read More
In the rapidly evolving world of high-performance computing (HPC) and artificial intelligence (AI), technological advancements must keep pace with increasing demands for speed, efficiency, and security. Synopsys recently announced the industry’s first complete PCIe 7.0 IP solution. This groundbreaking initiative addresses… Read More
Introduction of 2.5D and 3D multi-die based products are helping extend the boundaries of Moore’s Law, overcoming limitations in speed and capacity for high-end computational tasks. In spite of its critical function within the 3DIC paradigm, the interposer die’s role and related challenges are often neither fully comprehended… Read More