The Immensity of Software Development the Challenges of Debugging (Part 1 of 4)

The Immensity of Software Development the Challenges of Debugging (Part 1 of 4)
by Lauro Rizzatti on 07-15-2024 at 10:00 am

Immensity of SW development Fig 1

Part 1 of this 4-part series introduces the complexities of developing and bringing up the entire software stack on a System on Chip (SoC) or Multi-die system. It explores various approaches to deployment, highlighting their specific objectives and the unique challenges they address.

Introduction

As the saying goes, it’s… Read More


Podcast EP234: An Update on Chips and Science Act Progress with Mike O’Brien

Podcast EP234: An Update on Chips and Science Act Progress with Mike O’Brien
by Daniel Nenni on 07-05-2024 at 10:00 am

Dan is joined by Mike O’Brien. Mike was recently the vice president of aerospace and government at Synopsys, He has 40 years of experience in the semiconductor, software and computer industries. In his 27 years in EDA and IP at Synopsys and Cadence, Mike helped build new lines of business including outsourced design services, research… Read More


Synopsys Vietnam Seminar 2024

Synopsys Vietnam Seminar 2024
by Admin on 07-03-2024 at 3:27 pm

Today, we find ourselves at the nexus of the fourth industrial revolution — an era dominated by Smart Everything. The internet, artificial intelligence, and the use of software are helping to create things that couldn’t even be imagined just a decade or two ago. The opportunities seem limitless, and the potential for more world-changing… Read More


Synopsys Virtual Prototyping Day 2024

Synopsys Virtual Prototyping Day 2024
by Admin on 07-03-2024 at 3:23 pm

Join us at Virtual Prototyping Day 2024 to hear about the latest deployed virtual prototyping innovations. This event highlights applications from around the world using the latest virtual prototyping technology, covering applications from automotive, AI, and data center domains.​

​Industry leaders will share their experiences… Read More


LIVE WEBINAR Maximizing SoC Energy Efficiency: The Role of Realistic Workloads and Massively Parallel Power Analysis

LIVE WEBINAR Maximizing SoC Energy Efficiency: The Role of Realistic Workloads and Massively Parallel Power Analysis
by Daniel Nenni on 07-03-2024 at 2:00 pm

The Role of Realistic Workloads and Massively Parallel Power Analysis

As the complexity of modern System-on-Chip (SoC) designs continues to rise, achieving energy efficiency measured as performance per watt has become a crucial design goal. With the increasing demand for powerful, multifunctional chips, balancing performance with power consumption has become essential. Realistic workloads… Read More


Webinar: Enhancing Manufacturing Test Flows with Synopsys VC Z01X

Webinar: Enhancing Manufacturing Test Flows with Synopsys VC Z01X
by Admin on 06-26-2024 at 1:44 pm

Leveraging functional patterns is crucial for achieving high defect coverage and reducing defective parts per million (DPPM) levels. Synopsys VC Z01X fault simulator offers enhanced fault coverage in manufacturing test flows, complementing ATPG tools like Synopsys TestMAX ATPG. In this presentation we will delve into

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Synopsys’ Strategic Advancement with PCIe 7.0: Early Access and Complete Solution for AI and Data Center Infrastructure

Synopsys’ Strategic Advancement with PCIe 7.0: Early Access and Complete Solution for AI and Data Center Infrastructure
by Kalar Rajendiran on 06-25-2024 at 6:00 am

(From NewsRelease)Synopsys PCIe 7.0 IP Solution Infographic

In the rapidly evolving world of high-performance computing (HPC) and artificial intelligence (AI), technological advancements must keep pace with increasing demands for speed, efficiency, and security. Synopsys recently announced the industry’s first complete PCIe 7.0 IP solution. This groundbreaking initiative addresses… Read More


Synopsys-AMD Webinar: Advancing 3DIC Design Through Next-Generation Solutions

Synopsys-AMD Webinar: Advancing 3DIC Design Through Next-Generation Solutions
by Kalar Rajendiran on 06-13-2024 at 10:00 am

The Synopsys Multi Die Solution

Introduction of 2.5D and 3D multi-die based products are helping extend the boundaries of Moore’s Law, overcoming limitations in speed and capacity for high-end computational tasks. In spite of its critical function within the 3DIC paradigm, the interposer die’s role and related challenges are often neither fully comprehended… Read More