As artificial intelligence (AI) workloads migrate to endpoint hardware, edge AI devices face immense pressure to deliver real-time inference within highly restrictive power and thermal envelopes. Traditional silicon scaling no longer yields the power-density returns it once did. To compensate, engineering teams are turning… Read More
It’s an honor to attend events like this as a guest, and even more so as a speaker. On Friday at 3:30 p.m., I’ll be moderating a panel with the CEOs of three of the hottest AI startups. I definitely have a few questions ready for them! My beautiful wife and I will also be at the banquet. I hope to see you there!
The CASPA CEO Summit arrives … Read More
Artificial intelligence is moving beyond the screen. The attached presentation describes a shift from systems that generate text, images, and code to systems that can perceive their surroundings and take action. These systems could guide robots, vehicles, factory equipment, medical devices, and critical infrastructure.… Read More
Wow, OpenAI and Synopsys just announced a multiyear partnership to develop GPT-Synopsys, a specialized artificial intelligence model for semiconductor design. The agreement combines OpenAI’s frontier models with Synopsys’ electronic design automation software and engineering expertise. Its ambition is to help engineers… Read More
As chipmakers put more computing power into a single system, the challenge extends beyond making individual chips faster. They must connect multiple chips, memory stacks, power supplies, and sometimes optical components in a compact package. In the2026 TSMC OIP Forum talk “Addressing Inter-Die Complexity for 3D Multi-Die… Read More
Synopsys today announced its AgentEngineerTM solutions portfolio and AutopilotTM Platform, advancing a fundamental paradigm shift in electronic design automation (EDA): moving beyond AI copilots toward autonomous engineering agents. Following a recent technical briefing with Thomas Andersen, Vice President of AI and… Read More
Featured Speaker:
As AI/ML clusters scale toward 800G, 1.6T, and beyond, the optical DSP/retimer functions inside conventional transceivers (FRO) are becoming a significant bottleneck — adding power, latency, and cost to every link at a time when interconnects… Read More
Software factories have transformed automotive software development through automation, continuous integration, and rapid feedback cycles, yet achieving the same level of automation and continuous validation across the entire vehicle remains a major challenge. However, by creating complete virtual vehicles, engineering… Read More
Daniel is joined by Dr. Germain Fenger, Senior Director of Product Management at Synopsys where he leads advanced mask solutions and computational lithography technologies. With a background spanning semiconductor manufacturing, lithography research, engineering, and product leadership, Germain has held roles at imec,… Read More
Discover how to transform your embedded software testing with Ansys TPT, reducing cost, improving quality, and accelerating validation across all test levels. You’ll also explore how TPT, combined with SCADE, enables a seamless, scalable design-to-test workflow for modern, safety-critical systems.
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