Synopsys Foundation IP for Intel 18A is a portfolio of semiconductor building blocks designed to help system-on-chip developers build advanced chips with better power, performance, and area, often called PPA. The offering includes embedded memory compilers, standard-cell logic libraries, and input/output libraries for… Read More
Featured Speaker:
AI performance is no longer limited by compute—it’s limited by how efficiently data moves. As systems scale to compute-dense clusters, memory, die-to-die, and high-speed interfaces are emerging as critical bottlenecks.
This webinar explores… Read More
Heterogeneous compute platforms are driving new requirements for connectivity across increasingly complex system architectures. This webinar explores how PCIe and CXL can be used to provide… Read More
For the past decade, the semiconductor industry has been moving in one direction: shift-left, specifically, shifting more validation into the pre-silicon phase. The idea was straightforward: if software ultimately determines how a system behaves, then software should become a primary vehicle for verification.
The industry… Read More
Synopsys has announced the availability of the first wave of its Multiphysics Fusion Solutions, extending its vision of a unified engineering environment that connects EDA, semiconductor physics, system simulation, and artificial intelligence-driven optimization. The announcement addresses one of the most significant… Read More
As vehicles become increasingly software-defined, automotive semiconductor suppliers face growing pressure to deliver higher compute performance while maintaining strict requirements for power efficiency, reliability, and long-term product support. Advanced driver assistance systems (ADAS), electrification, … Read More
At SAFE Forum 2026, Synopsys announced significant advancements in its collaboration with Samsung Foundry, expanding AI-powered design, verification, test, and IP solutions for Samsung’s most advanced process technologies. The announcement underscores the growing importance of electronic design automation (EDA), … Read More
As advanced packaging becomes a critical enabler for next-generation semiconductor products, Intel continues to drive innovation through its Embedded Multi-die Interconnect Bridge (EMIB) technology. EMIB has emerged as a foundational packaging solution for heterogeneous integration, allowing multiple chiplets and… Read More
Date: Jun 25, 2026 | 9:00 AM PST
In this webinar, Intel will present how EMIB (Embedded Multi‑die Interconnect Bridge) enables compact, cost-effective multi‑die design while sustaining the bandwidth and power efficiency required for AI and datacenter designs. Intel will share an EMIB reference methodology built on Synopsys
Join us for our 6th Annual Virtual Prototyping Day and learn how you can “shift left” your development cycle with virtual prototypes.
Highly complex SoC and muti-die designs are putting pressure on silicon and software development teams to meet time-to-market demands. Virtual prototypes are the answer to begin… Read More
