The semiconductor industry has built decades of success on hyper-integration to increase functionality and performance while also reducing system cost. But the standard way to do this, to jam more and more functionality onto a single die, breaks down when some of the functions you want to integrate are built in different processes.… Read More
Webinar: Ansys 2023 R2: Ansys HFSS, SIwave, and Q3D What’s New
The 2023 R2 update for Ansys High Frequency Electronics products is enormous. In this webinar, you’ll learn about new capabilities in HFSS for 3D Layout that bolsters electromagnetic simulation support for IC design and antenna modeling in large platforms, multiple power and thermal improvements for SIwave, and new solver