A Master Class with Ansys and Synopsys, The Latest Advances in Multi-Die Design

A Master Class with Ansys and Synopsys, The Latest Advances in Multi-Die Design
by Mike Gianfagna on 12-04-2024 at 6:00 am

A Master Class with Ansys and Synopsys, The Latest Advances in Multi Die Design

2.5D and 3D multi-die design is rapidly moving into the mainstream for many applications. HPC, GPU, mobile, and AI/ML are application areas that have seen real benefits. The concept of “mix/match” for chips and chiplets to form a complex system sounds deceptively simple. In fact, the implementation and analysis techniques required… Read More


Signal Integrity Basics

Signal Integrity Basics
by Daniel Payne on 11-12-2024 at 10:00 am

Digital and analog waveforms

PCB and package designers need to be concerned with Signal Integrity (SI) issues to deliver electronic systems that work reliably in the field. EDA vendors like Siemens have helped engineers with SI analysis using a simulator called HyperLynx, dating all the way back to 1992. Siemens even wrote a 56-page e-book recently, SignalRead More


How AI is Redefining Data Center Infrastructure: Key Innovations for the Future

How AI is Redefining Data Center Infrastructure: Key Innovations for the Future
by Kalar Rajendiran on 10-10-2024 at 10:00 am

Connectivity Demands for AI Alphawave Semi

Artificial intelligence (AI) is driving a transformation in data center infrastructure, necessitating cutting-edge technologies to meet the growing demands of AI workloads. As AI systems scale up and out, next-gen compute servers, switches, optical-electrical links, and flexible, redundant networking solutions are … Read More


Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design

Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design
by Kalar Rajendiran on 10-02-2024 at 10:00 am

OIP 2024 Synopsys TSMC

Synopsys made significant announcements during the recent TSMC OIP Ecosystem Forum, showcasing a range of cutting-edge solutions designed to address the growing complexities in semiconductor design. With a strong emphasis on enabling next-generation chip architectures, Synopsys introduced both new technologies and … Read More


Samtec Demystifies Signal Integrity for Everyone

Samtec Demystifies Signal Integrity for Everyone
by Mike Gianfagna on 09-10-2024 at 6:00 am

Samtec Demystifies Signal Integrity for Everyone

As clock speeds go up, voltages go down and data volumes explode the need for fast, reliable and low latency data channels becomes critical in all kinds of applications. Balancing the requirements of low power and high performance requires the mastery of many skills. At the top of many lists is the need for superior signal integrity,… Read More


Is it time for PCB auto-routing yet?

Is it time for PCB auto-routing yet?
by Daniel Payne on 06-04-2024 at 10:00 am

PCB routing min

PCB designers have been using manual routing for decades now, so when is it time to consider adding interactive routing technologies to become more productive? Manually routing traces to connect components will take time from a skilled team member and involves human judgement that will introduce errors. When a design change … Read More


Will my High-Speed Serial Link Work?

Will my High-Speed Serial Link Work?
by Daniel Payne on 04-30-2024 at 10:00 am

traditional flow min

PCB designers can perform pre-route simulations, follow layout and routing rules, hope for the best from their prototype fab, and yet design errors cause respins which delays the project schedule. Just because post-route analysis is time consuming doesn’t mean that it should be avoided. Serial links are found in many PCB designs,… Read More


Webinar: Signal Integrity for Embedded Computing Applications by Matthew Burns

Webinar: Signal Integrity for Embedded Computing Applications by Matthew Burns
by Admin on 03-27-2024 at 1:27 pm

Embedded computing developers face new design challenges implementing high-speed protocols like 100 GbE, USB4, PCIe 5.0, DDR4/5, and more. This webinar introduces fundamental signal integrity concepts like insertion loss, return loss, and crosstalk, and relates them to a case study of the connector design for the COM-HPC… Read More


Synopsys Enhances PPA with Backside Routing

Synopsys Enhances PPA with Backside Routing
by Mike Gianfagna on 03-19-2024 at 6:00 am

Comparison of frontside and backside PDNs (Source IMEC)

Complexity and density conspire to make power delivery very difficult for advanced SoCs. Signal integrity, power integrity, reliability and heat can seem to present unsolvable problems when it comes to efficient power management. There is just not enough room to get it all done with the routing layers available on the top side… Read More


Podcast EP168: The Extreme View of Meeting Signal Integrity Challenges at Wild River Technology with Al Neves

Podcast EP168: The Extreme View of Meeting Signal Integrity Challenges at Wild River Technology with Al Neves
by Daniel Nenni on 06-16-2023 at 10:00 am

Dan is joined by Al Neves, Founder and Chief Technology Officer at Wild River Technology. Al has 30 years of experience in design and application development for semiconductor products and capital equipment focused on jitter and signal integrity. He is involved with the signal integrity community as a consultant, high-speed… Read More