Trace Design for Crosstalk Reduction

Trace Design for Crosstalk Reduction
by admin on 06-25-2020 at 11:00 am

Trace Design for Crosstalk Reduction
Presented by: Scott McMorrow

Returning to basics, we’ll investigate the relationship of trace geometry to crosstalk in interconnect design, and draw some conclusions based on system constraints. Microstrip, stripline, and dual-stripline layer geometries will be examined,

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Bridging the Gap Between Design and Analysis

Bridging the Gap Between Design and Analysis
by Mike Gianfagna on 02-20-2020 at 6:00 am

PCB design challenges

At the recent DesignCon 2020 in Santa Clara, Cadence introduced a new product, Sigrity Aurora. You won’t find a press release about this announcement. Rather, Brad Griffin, product management group director at Cadence, presented Sigrity Aurora in the theater at the Cadence booth. This one caught my eye and deserves some discussion.… Read More


Mentor Automating Design Compliance with Power-Aware Simulation HyperLynx and Xpedition Flow

Mentor Automating Design Compliance with Power-Aware Simulation HyperLynx and Xpedition Flow
by Camille Kokozaki on 02-25-2019 at 12:00 pm

High-speed design requires addressing signal integrity (SI) and power integrity (PI) challenges. Power integrity has a frequency component. The Power Distribution Network (PDN) in designs has 2 different purposes: providing power to the chip, and acting as a power plane reference for transmission-line like propagating … Read More


Chip, Package, System Analysis – A User View

Chip, Package, System Analysis – A User View
by Bernard Murphy on 08-16-2018 at 7:00 am

While I missed ANSYS (and indeed everyone else) at DAC this year, I was able to attend the ANSYS Innovation Conference last week at the Santa Clara Convention Center. My primary purpose for being there was to listen to a talk by eSilicon which I’ll get to shortly, but before that I sat through a very interesting presentation on the growing… Read More


"Ten-hut!" Attending the Signal Integrity Bootcamp

"Ten-hut!" Attending the Signal Integrity Bootcamp
by Tom Dillinger on 02-21-2017 at 12:00 pm

The engineering team for the design and analysis of a complex system consists of a diverse set of skills — with the increasing emphasis on both high-speed interface design and multi-domain power management, a critical constituent of the team is the group of signal integrity (SI) and power integrity (PI) engineers.

The training… Read More


DesignCon 2017 and Mentor Graphics

DesignCon 2017 and Mentor Graphics
by Daniel Nenni on 01-17-2017 at 7:00 am

It’s hard to believe but this is DesignCon #22 and being a Silicon Valley conference I have attended my fair share of them. This year it seems like high speed communications will take the lead followed by the latest on PCB design tools, power and signal integrity, jitter and crosstalk, test and measurement tools, parallel … Read More


Solution for PI, TI & SI Issues in 3D-ICs

Solution for PI, TI & SI Issues in 3D-ICs
by Pawan Fangaria on 11-30-2014 at 7:00 pm

As we move towards packing more and more functionalities and increasing densities of SoCs, the power, thermal and signal integrity issues keep on rising. 3D-IC is a great concept to stack multiple dies on top of each other vertically. While it brings lot of avenues to package dies with multiple functions together, it has challenges… Read More


How to Assure Quality of Power and SI Verification?

How to Assure Quality of Power and SI Verification?
by Pawan Fangaria on 12-08-2013 at 10:05 am

As power has become one of the most important criteria in semiconductor design today, I was wondering whether there is a standard set for the power verification for an overall chip. We do have formats evolved like CPF and UPF and there are tools available to check power and signal integrity (SI), however I don’t see a standard objective… Read More


Signal integrity: more than just SerDes analysis

Signal integrity: more than just SerDes analysis
by Don Dingee on 03-29-2013 at 1:00 am

When Cadence acquired Sigrity in 2012, two motives were involved: get more competitive in state of the art signal integrity analysis, and grab a foothold into the other vendor’s PCB flows in an area that is developing as a real sore spot for digital designers.

Just as the days where PCB tape-out meant actually using tape are over, … Read More