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In this webinar, Marvell will present how its team accelerates passive interposer routing for advanced 2.5D/3.5D multi die designs by bringing early, physics based signal integrity feedback into each routing iteration. Rather than relying on repeated, compute intensive 3D FEM cycles during development, Marvell uses a Method… Read More
As analog and mixed-signal designs become increasingly complex, parasitic effects dominate both design time and cost, consuming 30–50% of engineers’ effort in debugging and reanalyzing circuits. Addressing these multiphysics effects requires early verification strategies and reliable simulation solutions. Modern … Read More
By Todd Burkholder and Per Viklund, Siemens EDA
The landscape of advanced IC packaging is rapidly evolving, driven by the imperative to support innovation on increasingly complex and high-capacity products. The broad industry trend toward heterogeneous integration of diverse die and chiplets into advanced semiconductor… Read More
According to a recent Samtec whitepaper, in high-data-rate (HDR) architectures, where signals traverse tens to hundreds of gigabits per second, “cable management” isn’t a housekeeping chore, it’s a first-order design variable. The mechanical path a cable takes directly influences channel loss, crosstalk, reliability,
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2.5D and 3D multi-die design is rapidly moving into the mainstream for many applications. HPC, GPU, mobile, and AI/ML are application areas that have seen real benefits. The concept of “mix/match” for chips and chiplets to form a complex system sounds deceptively simple. In fact, the implementation and analysis techniques required… Read More
PCB and package designers need to be concerned with Signal Integrity (SI) issues to deliver electronic systems that work reliably in the field. EDA vendors like Siemens have helped engineers with SI analysis using a simulator called HyperLynx, dating all the way back to 1992. Siemens even wrote a 56-page e-book recently, Signal… Read More
Artificial intelligence (AI) is driving a transformation in data center infrastructure, necessitating cutting-edge technologies to meet the growing demands of AI workloads. As AI systems scale up and out, next-gen compute servers, switches, optical-electrical links, and flexible, redundant networking solutions are … Read More
Synopsys made significant announcements during the recent TSMC OIP Ecosystem Forum, showcasing a range of cutting-edge solutions designed to address the growing complexities in semiconductor design. With a strong emphasis on enabling next-generation chip architectures, Synopsys introduced both new technologies and … Read More
As clock speeds go up, voltages go down and data volumes explode the need for fast, reliable and low latency data channels becomes critical in all kinds of applications. Balancing the requirements of low power and high performance requires the mastery of many skills. At the top of many lists is the need for superior signal integrity,… Read More
PCB designers have been using manual routing for decades now, so when is it time to consider adding interactive routing technologies to become more productive? Manually routing traces to connect components will take time from a skilled team member and involves human judgement that will introduce errors. When a design change … Read More
