Mitigating the Effects of DFE Error Propagation on High-Speed SerDes Links

Mitigating the Effects of DFE Error Propagation on High-Speed SerDes Links
by Kalar Rajendiran on 04-18-2023 at 10:00 am

Pre and Post FEC BER as FEC Matrix size Reduces

As digital transmission speeds increase, designers use various techniques to improve the signal-to-noise ratio at the receiver output. One such technique is the Decision Feedback Equalizer (DFE) scheme, commonly used in high-speed Serializer-Deserializer (SerDes) circuits to mitigate the effects of channel noise and … Read More


A MasterClass in Signal Path Design with Samtec’s Scott McMorrow

A MasterClass in Signal Path Design with Samtec’s Scott McMorrow
by Mike Gianfagna on 04-25-2022 at 10:00 am

Samtec Flyover Technology

We all know signal integrity and power integrity are becoming more important for advanced design. Like package engineering, the obscure and highly technical art of SI/PI optimization has taken center stage in the design process. And the folks who command expertise in these areas have become the rock stars of the design team. I … Read More


Enabling Next Generation Silicon In Package Products

Enabling Next Generation Silicon In Package Products
by Kalar Rajendiran on 04-15-2021 at 10:00 am

System on Package Motivation AlphaWave IP

In early April, Gabriele Saucier kicked off Design & Reuse’s IPSoC Silicon Valley 2021 Conference. IPSoC conference as the name suggests is dedicated to semiconductor intellectual property (IP) and IP-based electronic systems. There were a number of excellent presentations at the conference. The presentations had been… Read More


Maximizing ASIC Performance through Post-GDSII Backend Services

Maximizing ASIC Performance through Post-GDSII Backend Services
by Kalar Rajendiran on 03-04-2021 at 6:00 am

Panel 1 Alchip – HPC ASIC Manufacturing Done Your Way 1030x579 1

ASICs by definition are designed to meet the respective applications’ requirements. ASIC engineers deploy various design techniques to maximize performance, minimize power and reduce chip size. But is there more that can be done after the GDSII is taped out? A recent press release from Alchip Technology dated Feb 4, 2021 claims… Read More


Samtec Lets You Learn from Home with a Great Webinar Lineup

Samtec Lets You Learn from Home with a Great Webinar Lineup
by Mike Gianfagna on 01-20-2021 at 10:00 am

Samtec Lets You Learn from Home with a Great Webinar Lineup

Work from home (WFH) has become a normal occurrence this past year. “Do you work from home?”  “Of course, where else?” Samtec is taking the whole work from home thing up a notch with a new webinar lineup for 2021. Back by popular demand, they are launching a new series of educational webinars. Started last year, the gEEk SpEEk Webinar… Read More


Trace Design for Crosstalk Reduction

Trace Design for Crosstalk Reduction
by admin on 06-23-2020 at 3:58 pm

Trace Design for Crosstalk Reduction
Presented by: Scott McMorrow

Returning to basics, we’ll investigate the relationship of trace geometry to crosstalk in interconnect design, and draw some conclusions based on system constraints. Microstrip, stripline, and dual-stripline layer geometries will be examined,

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