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EDPS: 3D ICs, part IIby Paul McLellan on 04-12-2012 at 10:00 pmCategories: EDA, Events
Part I is here.
In the panel session at EDPS on 3D IC a number of major issues got highlighted (highlit?).
The first is the problem of known-good-die (KDG) which is what killed off the promising multi-chip-module approach, perhaps the earliest type of interposer. The KDG problem is that with a single die in a package it doesn’t… Read More
A client turned me on to a great new book, “The Age of the Platform” by Phil Simon. It’s about how Amazon, Apple, Facebook, and Google have radically transformed the landscape. For me, it’s not just social networking – it’s social computing, changing how things are designed.
I’m borrowing this right from Phil’s… Read More
