A significant shift is underway in the fabless semiconductor business model. As the application markets have become more diverse (and more cost-sensitive), product requirements have necessitated a new focus on multi-die packaging technology. … Read More
Tag: package on package
Webinar alert – another break in the memory wall
A couple months ago we heard from another vendor in a webinar on HBM and breaking through the “memory wall”. Next week Open Silicon weighs in on the topic in a webinar with partners SK Hynix and Synopsys.… Read More
It’s about the mobile GPU memory bandwidth per watt, folks
There has been a lot of huffing and puffing lately about 64-bit cores making it into the Apple A7 and other mobile SoCs, and we could probably dedicate a post to that discussion. However, there are a couple other wrinkles to the Apple A7 that should be getting a lot more attention.
There are two primary causes of user frustration in multimedia… Read More