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EDA Flows for 3D Die Integrationby Tom Dillinger on 07-20-2021 at 6:00 amCategories: Cadence, EDA, Events
Background
The emergence of 2.5D heterogeneous die integration using a silicon (or organic) interposer has enabled unique system architectures. The term “More than Moore” has been used to describe the circuit density and cost advantages of leveraging multiple die in the package, the die potentially in different process technologies. … Read More
